SPECIFICATION
· Supplier : Samsung electro-mechanics
· Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
①
①
Series
②
Size
③
Dielectric
④
Capacitance
⑤
Capacitance
tolerance
⑥
Rated Voltage
⑦
Thickness
10
②
C
③
R75
④
B
⑤
B
⑥
8
⑦
N
⑧
N
⑨
· Samsung P/N :
· Description :
(Reference sheet)
CL10CR75BB8NNNC
CAP, 0.75㎊, 50V, ± 0.1㎊, C0G, 0603
N
⑩
C
⑪
Samsung Multi-layer Ceramic Capacitor
0603 (inch code)
L: 1.60 ± 0.10 mm
C0G
0.75
㎊
± 0.1㎊
50 V
0.80 ± 0.10 mm
⑧
Inner electrode
Termination
Plating
⑨
Product
⑩
Special
⑪
Packaging
W: 0.80 ± 0.10 mm
Ni
Cu
Sn 100%
(Pb Free)
Normal
Reserved for future use
Cardboard Type, 7" reel
B. Structure and dimension
Dimension(㎜)
Samsung P/N
L
CL10CR75BB8NNNC
1.60 ± 0.10
W
0.80 ± 0.10
T
0.80 ± 0.10
BW
0.30 ± 0.20
1
C. Samsung Reliability Test and Judgement condition
Judgement
Capacitance
Q
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Solderability
Within specified tolerance
415 min
10,000Mohm or 500Mohm x
㎌
Whichever is smaller
No abnormal exterior appearance
No dielectric breakdown or
mechanical breakdown
C0G
Test condition
1㎒±10% / 0.5~5Vrms
Rated Voltage
60~120 sec.
Microscop (X10)
300% of the rated voltage
(From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃)
No peeling shall be occur on the
500g×F, for 10±1 sec.
terminal electrode
Capacitance change :
Bending to the limit (1mm)
with 1.0mm/sec.
within ±5% or ±0.5㎊ whichever is larger
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering heat
Vibration Test
Capacitance change :
within ±2.5% or ±0.25㎊ whichever is larger
Tan
δ,
IR : initial spec.
Capacitance change :
within ±2.5% or ±0.25㎊ whichever is larger
Tan
δ,
IR : initial spec.
Capacitance change :
within ±7.5% or ±0.75㎊ whichever is larger
Q:
102.50 min
IR :
500Mohm or 25Mohm ×
㎌
Whichever is smaller
Capacitance change :
within ±3% or ±0.3㎊ whichever is larger
207.5 min
Q:
IR :
1,000Mohm or 50Mohm ×
㎌
Whichever is smaller
Capacitance change :
within ±2.5% or ±0.25㎊ whichever is larger
Tan
δ,
IR : initial spec.
Solder pot : 270±5℃, 10±1sec.
Amplitude : 1.5mm
From 10㎐ to 55㎐ (return : 1min.)
2hours ´ 3 direction (x, y, z)
With rated voltage
40±2℃, 90~95%RH, 500+12/-0hrs
Moisture
Resistance
High Temperature
Resistance
With 200% of the rated voltage
Max. operating temperature
1,000+48/-0hrs
Temperature
Cycling
1 cycle condition
Min. operating temperature
Max. operating temperature
→
→
→
25℃
25℃
5 cycle test
※
The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260±5℃,
30sec.
)
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
2
MLCC Pro
oduct Manual
E. Recomm
mended TE
EST PCB
( Adhesive strength of termination)
)
Size cod
de
02
03
05
10
21
31
32
43
55
Siz (mm)
ze
0..4 × 0.2
0..6 × 0.3
1.0 × 0.5
0.
1..6 × 0.8
2.0 × 1.25
0
3..2 × 1.6
3..2 × 2.5
4..5 × 3.2
5..7 × 5.0
a
0.20
0.30
0.40
1.00
1.20
2.20
2.20
3.50
4.50
b
0.1
17
0.3
30
0.5
55
1.0
00
1.4
40
1.4
40
1.4
40
1.7
75
1.7
75
c
0.26
0.30
0.50
1.20
1.65
2.00
2.90
3.70
5.60
c
b
a
d
e
(Subs
strate for be
ending strength test)
Siz code
ze
02
03
05
10
21
31
32
43
55
Size (mm)
0.4 × 0.2
0.6 × 0.3
1.0 × 0.5
1.6 × 0.8
2.0 × 1.25
3.2 × 1.6
3.2 × 2.5
4.5 × 3.2
5.7 × 5.0
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
b
0.6
0.9
1.5
3.0
4.0
5.0
5.0
7.0
8.0
(Su
ubstrate for R
Reliability te
est)
c
0.2
2
0.3
3
0.5
5
1.2
2
1.6
65
2.0
0
2.9
9
3.7
7
5.6
6
d
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
e
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
☞
☞
al
te
Materia : Glass epoxy substrat
: Copper f (T=0.035 ㎜)
foil
5
☞ T
Thickness : T=1.6 ㎜ (T= 0.8 ㎜ for 0
T
03/05)
☞
: So
older resist
ity
sed solder (K
KSD 6704) with 3% silver is used.
w
r
☞ Caution : Abnormali can occur if lead-bas
3
3
MLCC Pro
oduct Manual
1. Packag
ging
This spe
ecification a
applies to ta
aping of ML
LCC
When c
customers re
equire, the specification may be ch
s
n
hanged und the agre
der
eement.
1-1. Figure
1-2. Quan
ntity
[unit:pcs]
Type
Size Code
Inch(mm)
0402 (01005)
0603 (0201)
1005 (0402)
1608 (0603)
2012 (0805)
Chip
Thickness
Taping Typ
pe
PAPER
PAPER
PAPER
PAPER
PAPER
EMBOSSED
D
PAPER
EMBOSSED
D
EMBOSSED
D
EMBOSSED
D
EMBOSSED
D
EMBOSSED
D
EMBOSSED
D
EMBOSSED
D
EMBOSSED
D
Pitch
2mm
2mm
2mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
8mm
8mm
8mm
8mm
8mm
Plastic
7 inches reel
20k
10K
10K
4K
4K
2K
4K
2K
2K
1K
2k
1k
-
-
-
Plastic
10 inches reel
-
-
-
10K
10K
6K
10K
4K
4K
4K
-
-
-
-
-
Plast
tic
13 inches reel
100K
K
50K
K
50K
K
15K / 10K
1
15K / 10K
1
10K
K
10K
K
10K
K
10K
K
4K
8k
4k
4K
2K
2K
0.2 mm
0.3 mm
0.5 mm
0.8 mm
T≤0.85 mm
T≥1.0 mm
T≤0.85 mm
T≥1.0 mm
T≤1.6 mm
T≥2.0 mm
T≤1.6 mm
T≥2.0 mm
T≤2.0 mm
T>2.0 mm
T≥2.5 mm
MLCC
3216 (1206)
3225 (1210)
4520 (1808)
4532 (1812)
5750 (2220)
4
4
MLCC Product Manual
1-3. Tape Size
1-3-1. Cardboard(Paper) tape : 4mm pitch
[unit:mm]
Size
Inch(mm)
0603
(1608)
0805
(2012)
1206
(3216)
A
1.00
±0.10
1.55
±0.10
2.05
±0.10
B
1.90
±0.10
2.30
±0.10
3.60
±0.10
W
F
E
P1
P2
P0
D
t
8.00
±0.30
3.50
±0.05
1.75
±0.10
4.00
±0.10
2.00
±0.05
4.00
±0.10
φ1.50
+0.10/-0
1.1
Below
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
1-3-2. Cardboard(Paper) tape : 2mm pitch
[unit:mm]
Size
Inch(mm)
01005
(0402)
0201
(0603)
0402
(1005)
0204
(0510)
A
0.25
±0.02
0.38
±0.03
0.62
±0.05
0.62
+0.05
/-0.10
B
0.46
±0.02
0.68
±0.03
1.12
±0.05
1.12
+0.05
/-0.10
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
W
F
E
P1
P2
P0
D
t
0.25
±0.02
0.35
±0.03
0.60
±0.05
0.37
±0.03
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
5
5
