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CL32B226KOJVPNE

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 22uF, Surface Mount, 1210, CHIP

器件类别:无源元件    电容器   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
SAMSUNG(三星)
包装说明
, 1210
Reach Compliance Code
compli
ECCN代码
EAR99
Samacsys Descripti
Samsung
电容
22 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
JESD-609代码
e3
安装特点
SURFACE MOUNT
多层
Yes
负容差
10%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
包装方法
TR, EMBOSSED PLASTIC, 7 INCH
正容差
10%
额定(直流)电压(URdc)
16 V
尺寸代码
1210
表面贴装
YES
温度特性代码
X7R
温度系数
15% ppm/°C
端子面层
Tin (Sn) - with Nickel (Ni) barrie
端子形状
WRAPAROUND
文档预览
Specification of Automotive MLCC
Supplier : Samsung Electro-Mechanics
Product : Multi-layer Ceramic Capacitor
Samsung P/N :
Description :
(Referance sheet)
CL32B226KOJVPNE
CAP, 22㎌, 16V, ± 10%, X7R, 1210
AEC-Q200 Qualified
A. Dimension
Dimension
Size
L
W
T
BW
1210 inch
3.20±0.30 mm
2.50±0.20 mm
2.50±0.20 mm
0.60±0.30 mm
B. Samsung Part Number
CL
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
16
V
2.50±0.20 mm
32
B
226
K
O
J
V
P
N
E
Samsung Multi-layer Ceramic Capacitor
1210
(inch code)
X7R
22
± 10%
L : 3.20±0.30 mm
Inner electrode
Termination
Plating
Product
Special code
Packaging
W :2.50±0.20 mm
Ni
Metal-Epoxy
Sn 100%
Automotive
Normal
Embossed Type, 7" Reel
(Pb Free)
C. Reliability Test and Judgement condition
Test items
High Temperature
Exposure
Performance
Test condition
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Tan
δ
: 0.125 max.
IR :More than 10,000
or 50
㏁×㎌
Whichever is smaller
Unpowered, 1,000hrs @ Max. temperature
Measurement at 24±2hrs after test conclusion
Initial Measurement 2*
Final Measurement 3*
1,000Cycles
Initial Measurement 2*
Final Measurement 3*
Measurement at 24±2hrs after test conclusion
1 cycle condition : -55+0/-3℃(30±3min)
Room Temp. (1min)
125+3/-0℃(30±3min)
Room Temp. (1min)
Per EIA 469
1,000hrs 85℃/85%RH, Rated Voltage and 1.3~1.5V,
Add 100kohm resistor
Initial Measurement 2*
Final Measurement 4*
Measurement at 24±2hrs after test conclusion
The charge/discharge current is less than 50mA.
1,000hrs @ 125℃, 150% Rated Voltage,
Initial Measurement 2*
Final Measurement 4*
Measurement at 24±2hrs after test conclusion
The charge/discharge current is less than 50mA.
Temperature Cycling
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Tan
δ
: 0.125 max.
IR : More than 10,000
or 50
㏁×㎌
Whichever is smaller
Destructive Physical
No Defects or abnormalities
Analysis
Humidity Bias
Appearance : No abnormal exterior appearance
Capacitance Change Within ±12.5 %
Tan
δ
: 0.125 max.
IR :More than 500
or 5
㏁×㎌
Whichever is smaller
Appearance : No abnormal exterior appearance
Capacitance Change Within ±12.5 %
Tan
δ
: 0.125 max.
IR :More than 1,000
or 5
㏁×㎌
Whichever is smaller
High Temperature
Operating Life
Performance
Test condition
External Visual
No abnormal exterior appearance
Microscope (´10)
Using The calipers
Three shocks in each direction should be applied along
3 mutually perpendicular axes of the test specimen (18 shocks)
Peak value
1,500G
Duration
0.5ms
Wave
Half sine
Velocity
4.7m/sec
Within the specified dimensions
Physical Dimensions
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Tan
δ,
IR : Initial spec.
Mechanical Shock
Initial Measurement 2*
Final Measurement 5*
Vibration
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Tan
δ,
IR : Initial spec.
5g's for 20min., 12cycles each of 3 orientations,
Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2,000㎐.
Initial Measurement 2*
Final Measurement 5*
Resistance to
Solder Heat
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Tan
δ,
IR : Initial spec.
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Tan
δ,
IR : Initial spec.
Solderability
95% of the terminations is to be soldered
evenly and continuously
preheating : 150℃ for 60~120 sec.
Solder pot : 260±5℃, 10±1sec.
Initial Measurement 2*
Final Measurement 3*
ESD
AEC-Q200-002 or ISO/DIS10605
Initial Measurement 2*
Final Measurement 4*
a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃
b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃
solder : a solution ethanol and rosin
Electrical
Characterization
Capacitance : Within specified tolerance
Tan
δ
: 0.1 max.
IR(25℃) : More than 10,000
or 50
㏁×㎌
Whichever is smaller
IR(125℃) More than 1,000
or 10
㏁×㎌
Whichever is smaller
Dielectric Strength
Board Flex
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Appearance : No abnormal exterior appearance
Capacitance Change Within ±10 %
Destruction value should be exceed
X7R
From -55
to 125
℃,
Capacitance change should be within ±15%
54.5 N
*A capacitor prior to measuring the capacitance is heat treated at
150 +0/-10℃ for 1hour and maintained in ambient air for 24±2 hours
The Capacitance / D.F. should be measured at 25℃,
120
± 20%,
0.5 ± 0.1 Vrms
I.R. should be measured with a DC voltage not exceeding
Rated Voltage @25℃, @125℃ for 60~120 sec.
Dielectric Strength : 250% of the rated voltage for 1~5 seconds
Bending to the limit, 3
for 60 seconds 1*
Initial Measurement 2*
Final Measurement 5*
Terminal
Strength(SMD)
18 N, for 60 sec.
Initial Measurement 2*
Final Measurement 5*
Beam Load
Temperature
Characteristics
Beam speed :
2.5±0.25
㎜/sec
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260 +0/-5℃, 30sec. ), Meet IPC/JEDEC J-STD-020 D Standard
*1 : The figure indicates typical specification. Please refer to individual specifications.
*2 : Initial measurement : Perform a heat treatment at 150 +0/-10℃ for one hour after soldering process.
and then let sit for 24±2 hours at room temperature. Perform the initial measurement.
*3 : Final measurement : Let sit for 24±2 hours at room temperature after test conclusion, then measure.
*4 : Final measurement : Perform a heat treatment at 150 +0/-10℃ for one hour after soldering process.
and then let sit for 24±2 hours at room temperature. Perform the initial measurement.
*5 : Final measurement : Let measure within 24 hours at room temperature after test conclusion.
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.
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