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CLC400A8B

Fast Settling, Wideband Low-Gain Monolithic Op Amp

器件类别：模拟混合信号IC    放大器电路   

厂商名称：National Semiconductor（TI ）

厂商官网：http://www.ti.com

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参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
National Semiconductor（TI ）
零件包装代码
DIP
包装说明
DIP, DIP8,.3
针数
8
Reach Compliance Code
unknow
ECCN代码
EAR99
放大器类型
OPERATIONAL AMPLIFIER
架构
CURRENT-FEEDBACK
25C 时的最大偏置电流 (IIB)
20 µA
标称共模抑制比
50 dB
频率补偿
YES
最大输入失调电压
5000 µV
JESD-30 代码
R-GDIP-T8
JESD-609代码
e0
低-失调
NO
标称负供电电压 (Vsup)
-5 V
功能数量
1
端子数量
8
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DIP
封装等效代码
DIP8,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度（摄氏度）
NOT SPECIFIED
电源
+-5 V
认证状态
Not Qualified
筛选级别
38535Q/M;38534H;883B
座面最大高度
5.08 mm
最小摆率
430 V/us
最大压摆率
23 mA
供电电压上限
7 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
BIPOLAR
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽带
YES
宽度
7.62 mm
文档预览
CLC400
Fast Settling, Wideband Low-Gain Monolithic Op Amp
June 1999
N
CLC400
Fast Settling, Wideband Low-Gain Monolithic Op Amp
General Description
Features
s
s
s
s
s
s
s
-3dB bandwidth of 200MHz
0.05% settling in 12ns
Low power, 150mW
Low distortion, -60dBc at 20MHz
Stable without compensation
Overload and short circuit protected
±1 to ±8 closed-loop gain range
Flash, precision A/D conversion
Video distribution
Line drivers
D/A current-to-voltage conversion
Photodiode, CCD preamps
IF processors
High-speed communications
Applications
s
s
s
s
s
s
s
The CLC400 is available in several versions to meet a variety of require-
ments. A three-letter suffix determines the version:
CLC400AJP
CLC400AJE
CLC400AIB
CLC400A8B
-40°C
-40°C
-40°C
-55°C
to
to
to
to
+85°C
+85°C
+85°C
+125°C
8-pin plastic DIP
8-pin plastic SOIC
8-pin hermetic CERDIP
8-pin hermetic CERDIP,
MIL-STD-833, Level B
DESC SMD number: 5962-89970
Package Dimensions
Pinout
DIP & SOIC
© 1999 National Semiconductor Corporation
Printed in the U.S.A.
http://www.national.com
CLC400 Electrical Characteristics
(A
v
= +2, V
cc
= ±5V, R
L
= 100Ω, R
f
= 250Ω; unless specified)
Min/max ratings are based on product characterization and simulation. Individual parameters are tested as noted. Outgoing quality levels are
determined from tested parameters.
Absolute Maximum Ratings
Miscellaneous Ratings
Package Thermal Resistance
Package
AJP
AJE
AIB
A8B
θ
JC
70°C/W
65°C/W
35°C/W
35°C/W
θ
JA
125°C/W
145°C/W
145°C/W
145°C/W
EDS rating (human body model)
500V
Reliability Information
Transistor count
24
http://www.national.com
2
CLC400 Typical Performance Characteristics
Non-Inverting Frequency Response
V
out
= 0.5V
pp
A
v
= 1
R
f
= 280Ω
A
v
= 2
R
f
= 249Ω
V
out
= 0.5V
pp
Ω
(T
A
= 25°, A
v
= +2, V
CC
= ±5V, R
L
= 100Ω; unless specified)
Inverting Frequency Response
A
v
= -1
R
f
= 200Ω
A
v
= -2
R
f
= 249Ω
Magnitude (1dB/div)
Magnitude (dB/div)
Phase (deg)
Phase (deg)
0
-90
A
v
= 10
R
f
= 249Ω
A
v
= 5
R
f
= 249Ω
-180
-270
A
v
= -10
R
f
= 249Ω
A
v
= -5
R
f
= 249Ω
-180
-270
-360
-450
100
-360
-450
-540
-630
1
Frequency (MHz)
10
1
10
Frequency (MHz)
100
3
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参数对比
与CLC400A8B相近的元器件有：CLC400、CLC400AIB、CLC400AJE、CLC400AJP。描述及对比如下：
型号 CLC400A8B CLC400 CLC400AIB CLC400AJE CLC400AJP
描述 Fast Settling, Wideband Low-Gain Monolithic Op Amp Fast Settling, Wideband Low-Gain Monolithic Op Amp Fast Settling, Wideband Low-Gain Monolithic Op Amp Fast Settling, Wideband Low-Gain Monolithic Op Amp Fast Settling, Wideband Low-Gain Monolithic Op Amp
是否Rohs认证 不符合 - 不符合 不符合 不符合
厂商名称 National Semiconductor（TI ） - National Semiconductor（TI ） National Semiconductor（TI ） National Semiconductor（TI ）
零件包装代码 DIP - DIP SOIC DIP
包装说明 DIP, DIP8,.3 - DIP, DIP8,.3 PLASTIC, SOIC-8 DIP, DIP8,.3
针数 8 - 8 8 8
Reach Compliance Code unknow - unknow unknow unknow
ECCN代码 EAR99 - EAR99 EAR99 EAR99
放大器类型 OPERATIONAL AMPLIFIER - OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
架构 CURRENT-FEEDBACK - CURRENT-FEEDBACK CURRENT-FEEDBACK CURRENT-FEEDBACK
25C 时的最大偏置电流 (IIB) 20 µA - 20 µA 20 µA 20 µA
标称共模抑制比 50 dB - 50 dB 50 dB 50 dB
频率补偿 YES - YES YES YES
最大输入失调电压 5000 µV - 5000 µV 5000 µV 5000 µV
JESD-30 代码 R-GDIP-T8 - R-GDIP-T8 R-PDSO-G8 R-PDIP-T8
JESD-609代码 e0 - e0 e0 e0
低-失调 NO - NO NO NO
标称负供电电压 (Vsup) -5 V - -5 V -5 V -5 V
功能数量 1 - 1 1 1
端子数量 8 - 8 8 8
最高工作温度 125 °C - 85 °C 85 °C 85 °C
最低工作温度 -55 °C - -40 °C -40 °C -40 °C
封装主体材料 CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP - DIP SOP DIP
封装等效代码 DIP8,.3 - DIP8,.3 SOP8,.25 DIP8,.3
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE - IN-LINE SMALL OUTLINE IN-LINE
峰值回流温度（摄氏度） NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 +-5 V - +-5 V +-5 V +-5 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm - 5.08 mm 1.75 mm 5.08 mm
最小摆率 430 V/us - 430 V/us 430 V/us 430 V/us
最大压摆率 23 mA - 23 mA 23 mA 23 mA
供电电压上限 7 V - 7 V 7 V 7 V
标称供电电压 (Vsup) 5 V - 5 V 5 V 5 V
表面贴装 NO - NO YES NO
技术 BIPOLAR - BIPOLAR BIPOLAR BIPOLAR
温度等级 MILITARY - INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE - THROUGH-HOLE GULL WING THROUGH-HOLE
端子节距 2.54 mm - 2.54 mm 1.27 mm 2.54 mm
端子位置 DUAL - DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽带 YES - YES YES YES
宽度 7.62 mm - 7.62 mm 3.9 mm 7.62 mm
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