Product Family:
High Power Chip Resistor
Construction:
•
99.5% BeO or 99.6% Alumina Ceramic
•
Nickel alloy thin film resistive element
•
Epoxy-resin overcoat
•
Pre-tinned (Sn100, matte) terminations
over Ni barrier
Features:
•
TCR’s to ± 25ppm
•
Tolerances less than ± 1%
•
Custom and standard sizes available
•
High volume production, suitable for
commercial and special applications
Description:
These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A
lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,
much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.
The CPB series effectively integrates the power resistor with the board, providing a thermal resistance comparable with aluminum
heat-sinks.
Dimensions:
Size
Inch
Metric
2512
6332
2525
6363
L
6.3 ± 0.2
6.3 ± 0.2
Dimensions (mm)
W
H
3.2 ± 0.2
1.1 ± 0.1 (CPB)
0.7± 0.1 (CPA)
6.3 ± 0.2
1.1 ± 0.1 (CPB)
0.7± 0.1 (CPA)
T-top
0.9 ± 0.2
0.9 ± 0.2
T-btm
2.0 ± 0.2
2.0 ± 0.2
Call for other sizes
Electrical Specifications:
Size: Inch (Metric)
Rated Power at 70ºC
1
(BeO)
Rated Power at 70ºC
1
(Alumina)
Rated Voltage
Resistance Tolerance
Resistance Values
TCR (ppm/ºC)
Operating Temperature Range
3
Insulation Resistance (100V, 1min)
4
2
Derating Curve:
2512 (6332) 2525 (6363)
Up to 5W
1
Up to 8W
1
Up to 2W
1
Up to 3W
1
√(PxR)
± 1 to 5%
5 to 200
Ω,
call for other
values
± 25 to 200
-55 to 150ºC
> 1G
Ω
Notes:
1. Dependent on effective thermal conductivity of board construction/land design and size of board - greater power capability for
board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of
reflowing solder bonds before device damage occurs.
2. Per MIL-PRF-55342 (-55/25/125ºC).
3. Per MIL-PRF-55342, see derating curve.
4. Per IEC 60115-1.
Environmental Performance Specifications:
Test
Life
Thermal Shock
High Temperature Exposure
Short Time Overload
Moisture Resistance
Resistance to Soldering Heat
1
Solderability
2
Board Flex
Terminal Strength
Reference
MIL-PRF-55342,
MIL-STD-202
Method 108A
MIL-PRF-55342,
MIL-STD-202
Method 107G
MIL-PRF-55342
MIL-PRF-55342
MIL-PRF-55342,
MIL-STD-202
Method 106G
MIL-PRF-55342,
MIL-STD-202
Method 210F
MIL-PRF-55342,
MIL-STD-202
Method 208H
IEC 60115-1 /
JIS C 5202
MIL-PRF-55342
Conditions of Test
70ºC, 2000h, rated power, 1.5h on, 0.5h off
Condition F-3, -65ºC/0.25h to 150ºC/0.25h, 100 cycles
150ºC, 100h
6.25x rated power, 5 sec.
25/65/25/65/25/–10ºC, 90% to 98%RH, 10 cycles,
24h/cycle, with and without bias, bias = 1.5h on, 0.5h
off @ 1/10
th
rated power
260ºC for 15 sec., over 220ºC for 60 sec., 3 cycles
Precondition E: 150ºC dry bake for 16h,
Method 1 “Dip and Look Test”, 245ºC, 5 sec., Pb-free
(SnAgCu) Solder
Bend amount of 3mm, measurements during and after
bend
Force of 3kg for 30 sec.
Requirement
± 0.5% + 0.01
Ω
± 0.1% + 0.01
Ω
± 0.1% + 0.01
Ω
± 0.1% + 0.01
Ω
± 0.1% + 0.01
Ω
± 0.1% + 0.01
Ω
Min 95%
coverage of
critical area
± 0.1% + 0.01
Ω
,
No mechanical
damage
No mechanical
damage
Notes:
1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added.
2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H.
JESD22-B102D procedure comes from EIA-638, “Surface Mount Solderability Test”.
Recommended Solder Pad Dimensions:
Size: Inch (Metric)
A
B
C
Dimensions (mm)
2512 (6332) 2525 (6363)
1.6
1.6
7.7
7.7
3.5
6.7
Notes on board construction and land design:
1. A multi-layer board with several ground or power planes significantly reduces thermal resistance.
2. Plated via holes around the power resistor further reduces thermal resistance.
3. Maximize land area beyond solder pad area in both width and length to further reduce thermal resistance.
4. Optimizing the thermal resistance of the board helps dissipate heat, enabling higher power handling and lower surface
temperatures.
Part Numbering:
(Ex. CPB2512S27R0JS)
CP
Product
Designator
CP
B
Material
Designator
A = Alumina
B = BeO
2512
Size, Inch
Refer to
table above
E=
H=
K=
S=
S
TCR
± 25 ppm/C
± 50 ppm/C
± 100 ppm/C
± 200 ppm/C
27R0
Resistance Value
Ex. 27R0 = 27.0
Ω
J
Tolerance
F=
G=
J=
± 1%
± 2%
± 5%
S
Custom
Designator
Standard = S
Custom = TBD
Thin Film Technology Corp., 1980 Commerce Drive, North Mankato, MN 56003, (507) 625-8445
www.thin-film.com
