CPC1510
I
NTEGRATED
C
IRCUITS
D
IVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
250
200
15
Units
V
P
mA
rms
/ mA
DC
Single-Pole, Normally Open Relay
with Integrated Current Limit
Description
The CPC1510 is a single-pole, normally
open (1-Form-A) Solid State Relay with an
integrated current limit feature that can replace
electromechanical relays while enhancing the
robustness of wireline-interface applications.
The relay is constructed using a GaAIAs LED for
actuation control and an integrated monolithic die for
the switch output. The die, fabricated in a
high-voltage dielectrically isolated technology,
comprises a photodiode array, switch control with
active current limiting circuitry, and MOSFET
switches. The active current limit circuitry in the
CPC1510 also provides a thermal shutdown feature
offering excellent power cross immunity for improved
survivability in harsh environments.
These enhancements greatly improve the robustness
of end systems using this device compared to
systems using relays without the integrated current
limit. In addition, the active current limit circuitry
enables the CPC1510 to pass FCC 68.302 and
other regulatory voltage surge requirements when
adequate overvoltage protection is provided. The
CPC1510 relay may be used in both unidirectional
DC applications as well as bi-directional AC
applications.
Features
•
•
•
•
•
•
•
•
•
Integrated active current-limit protection
Thermal shutdown
Linear AC or DC operation
Low power consumption
Clean, bounce-free switching
High surge capability
Low power drive requirements
Surface mount version available
Tape & reel packaging available
Applications
•
•
•
•
•
•
Fault protected switch
Instrumentation
Elevator controls
Industrial controls
Security
Peripherals
•
Automatic tuning/balancing
•
Transducer driver
•
Pre-driver for large electro-mechanical relays
•
Telecom switching
•
Medical equipment
Approvals
•
UL Approved Component: File # E76270
•
CSA Certified Component: Certificate # 1172007
•
EN/IEC 60950-1 Certified Component: Pending
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
Ordering Information
Part #
CPC1510G
CPC1510GS
CPC1510GSTR
Description
6-Pin 0.250" Wide, Through Hole (50/Tube)
6-Pin 0.250" Wide, Surface Mount (50/Tube)
6-Pin 0.250" Wide, Surface Mount (1000/Reel)
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
I
LOAD
t
on
10%
t
off
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I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input LED Current
Continuous
Peak (10ms)
Input Control Current
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
CPC1510
Ratings
250
5
50
1
10
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mA
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate Linearly 1.33 mW/ºC
Derate Linearly 1.67 mW/ºC
Recommended Operating Conditions
Parameter
Load Current, Continuous
Input Control Current
Operating Temperature Range
Symbol
I
L
I
F
T
A
Configuration
AC/DC
DC-Only
-
-
Min
-
-
3
-40
Nominal
-
-
5
-
Max
200
350
10
+85
Units
mA
rms
/ mA
DC
mA
DC
mA
ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Current Limit
AC/DC Configuration
DC Configuration
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
LED Forward Voltage
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
I
F
=5mA, V
L
=±5V, t=5ms
I
LMT
300
600
6
1.5
-
366
730
13
3.3
1.3e
-5
0.845
0.26
205
65
-
-
1.37
3
450
920
15
3.75
1
mA
P
I
F
=5mA, I
L
=100mA
V
L
=200V
R
ON
I
LEAK
t
on
t
off
C
O
µA
I
F
=5mA, I
L
=10mA, V
L
=10V
I
F
=0mA, V
L
=1V, f=1MHz
I
F
=0mA, V
L
=50V, f=1MHz
I
L
=100mA
I
L
=100mA
I
F
=5mA
-
-
-
2
-
ms
pF
I
F
I
F
V
F
C
I/O
-
0.2
1.15
-
2
-
1.5
-
mA
mA
V
pF
2
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NTEGRATED
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IVISION
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA)
CPC1510
30
25
Device Count (N)
20
15
10
5
0
25
20
15
10
5
0
50
45
40
35
30
25
20
15
10
5
0
0.22
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA)
Device Count (N)
Device Count (N)
1.364
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
0.76
0.79
0.82 0.85 0.88 0.91
Turn-On Time (ms)
0.94
0.24
0.26
0.28
Turn-Off Time (ms)
0.30
25
20
15
10
5
0
Typical On-Resistance
(N=50, I
F
=5mA, I
L
=100mA)
Device Count (N)
12.2 12.4 12.6 12.8 13.0 13.2 13.4 13.6
On-Resistance ( )
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.7
LED Current (mA)
1.6
1.5
1.4
1.3
1.2
1.1
1.0
-50
-25
0
25
50
Temperature (ºC)
75
100
I
F
=10mA
I
F
=5mA
I
F
=2mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA
DC
)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=1mA)
LED Current (mA)
-25
0
25
50
Temperature (ºC)
75
100
-25
0
25
50
Temperature (ºC)
75
100
400
300
Load Current (mA)
200
100
0
-100
-200
-300
-400
Typical Load Current vs. Load Voltage
(I
F
=5mA)
Turn-On Time (ms)
Typical Turn-On Time
vs. LED Forward Current
2.0
Turn-Off Time (ms)
2.0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=10mA & I
L
=100mA
DC
)
1.5
I
L
=100mA
DC
I
L
=10mA
DC
1.5
1.0
1.0
0.5
0.5
0.0
-4
-3
-2
-1
0
1
Load Voltage (V)
2
3
4
0
1
2
3 4 5 6 7 8 9 10 11 12
LED Forward Current (mA)
0.0
0
1
2
3
4
5
6
7
8
9 10 11 12
LED Forward Current (mA)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA*
On-Resistance vs. Temperature
AC/DC Configuration
(I
F
=2mA, I
L
=100mA
DC
)
Turn-On Time (ms)
CPC1510
20
On-Resistance ( )
3.0
2.5
2.0
1.5
1.0
0.5
Typical Turn-On Time vs. Temperature
(I
L
=100mA
DC
)
Turn-Off Time (ms)
2.0
Typical Turn-Off Time vs. Temperature
(I
L
=100mA
DC
)
15
1.5
10
I
F
=2mA
I
F
=5mA
I
F
=10mA
1.0
I
F
=10mA
I
F
=5mA
I
F
=2mA
5
0.5
0
-50
-25
0
25
50
Temperature (ºC)
75
100
0.0
-50
-25
0
25
50
Temperature (C)
75
100
0.0
-50
-25
0
25
50
Temperature (ºC)
75
100
5
On-Resistance ( )
4
3
2
1
0
-50
On-Resistance vs. Temperature
DC-Only Configuration
(I
F
=2-10mA, I
L
=100mA
DC
)
Turn-On Time (ms)
2.0
Typical Turn-On Time vs. Temperature
(I
L
=10mA
DC
)
Turn-Off Time (ms)
75
100
I
F
=2mA
I
F
=5mA
I
F
=10mA
2.0
Typical Turn-Off Time vs. Temperature
(I
F
=2-10mA, I
L
=10mA
DC
)
1.5
1.5
1.0
1.0
0.5
0.5
0.0
-25
0
25
50
Temperature (ºC)
75
100
-50
-25
0
25
50
Temperature (ºC)
0.0
-50
-25
0
25
50
Temperature (ºC)
75
100
Maximum Load Current
vs. Temperature
400
350
Load Current (mA)
300
250
200
150
100
50
0
-50
-25
0
25
50
Temperature (ºC)
75
100
AC/DC Configuration
DC-Only Configuration
1000
900
800
700
600
500
400
300
200
100
0
-50
Typical Current Limit vs. Temperature
(I
F
=5mA)
Leakage Current (nA)
Typical Leakage Current vs. Temperature
(Measured with 250V across pins 6 & 4)
10
1
0.1
0.01
0.001
Current Limit (mA
P
)
DC Configuration
AC/DC Configuration
-25
0
25
50
Temperature (ºC)
75
100
0.0001
-25
0
25
50
Temperature (ºC)
75
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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IRCUITS
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IVISION
Manufacturing Information
Moisture Sensitivity
CPC1510
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL)
classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1510GS
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the
IPC/JEDEC J-STD-020
Classification Temperature (T
C
) and the maximum
dwell time the body temperature of these surface mount devices may be (T
C
- 5)°C or greater. The Classification
Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.
Device
CPC1510GS
Classification Temperature (T
c
)
250ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
3
The maximum wave soldering conditions of the through-hole devices is provided in the following table. Dwell time is
the time it takes for the pins to pass through both waves.
Device
CPC1510G
Maximum Wave Temperature
260ºC
Body Temperature
250ºC
Dwell Time
10 seconds
Wave Cycles
1
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to halide flux or solvents that are Chlorine, Bromine, Fluorine, or Iodine-based.
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