SMD ESD Protection Diode
CPDV6-5V0U-HF
RoHS Device
Halogen Free
Features
-EC61000-4-2 Level 4 ESD protection.
-Surface mount package.
-High component density.
0.053(1.35)
0.045(1.15)
SOT-363
0.087(2.20)
0.079(2.00)
Mechanical data
-Case: SOT-363 Standard package, molded
plastic.
-Terminals: Solderable per MIL-STD-750,
method 2026.
-Marking code: E5U
-Mounting position: Any.
-Weight: 0.0091 gram (approx.)
Dimensions in inches and (millimeter)
0.014(0.35)
0.006(0.15)
0.004(0.10)
0.000(0.00)
0.018(0.46)
0.010(0.26)
0.039(1.00)
0.035(0.90)
0.055(1.40)
0.047(1.20)
0.006(0.15)
0.003(0.08)
0.096(2.45)
0.085(2.15)
Circuit diagram
6
5
4
1
2
3
Maximum Rating and Electrical Characteristics
(at TA=25°C unless otherwise noted)
Parameter
Diode breakdown voltage
Leakage current
Forward voltage
Junction capacitance
ESD capability
Symbol
V
BD
I
L
V
F
C
T
ESD
I
R
= 1mA
V
R
= 3V
I
F
=10mA
Conditions
Min Typ Max Unit
6.1
0.1
1.0
1.2
60
80
V
uA
V
pF
V
R
= 0V,f = 1MHz
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
I
PP
= 1A,T
P
=8/20us
I
PP
= 8A,T
P
=8/20us
15
8
8
10
80
125
-55
150
kV
Clamping voltage
V
C
V
Peak pulse power
Operation temperature
Storage temperature
P
PP
T
J
T
STG
W
°C
°C
REV:B
QW-JP009
Page 1
Comchip Technology CO., LTD.
SMD ESD Protection Diode
RATING AND CHARACTERISTIC CURVES (CPDV6-5V0U-HF)
Fig. 1 - 8/20us Peak pulse current
waveform acc. IEC 61000-4-5
120%
Ta=25°C
Test Waveform
parameters
tf=8us
td=20us
Fig.2 - Power rating derating curve
120
Mounting on glass epoxy PCBs
100%
Peak Valur Ipp
100
Percentage of Ipp
80%
60%
40%
20%
0%
0
5
e-t
Power rating, (%)
25
30
80
60
40
20
0
td= t Ipp/2
10
15
20
0
25
50
75
100
125
150
Time, (us)
Ambient temperature, ( °C )
Fig.3 - Clamping voltage vs.
peak pulse current
14
Fig.4 - Capacitance between
terminals characteristics
Capacitance between terminals, (
P
F)
100
f=1MHz
TA=25°C
8/20us waveform
12
Clamping voltage, V
C
(V)
80
10
8
6
4
2
0
0
2
4
6
8
60
40
20
0
0
1
2
3
4
5
Peak pulse current, I
PP
(A)
Reverse voltage, (V)
REV:B
QW-JP009
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Comchip Technology CO., LTD.
SMD ESD Protection Diode
Reel Taping Specification
d
P0
P1
T
E
F
B
W
C
P
A
12
0
o
D
2
D
1
D
W
1
SYMBOL
A
2.25
±
0.05
0.089
±
0.002
B
2.55
±
0.05
0.100
±
0.002
C
1.20
±
0.05
0.047
±
0.002
d
1.50
±
0.10
0.059
±
0.004
D
178
±
2.00
7.008
±
0.079
D
1
54.40
±
1.00
2.142
±
0.039
D
2
13.00
±
1.00
0.512
±
0.039
SOT-363
(mm)
(inch)
SYMBOL
E
1.75
±
0.10
0.069
±
0.004
F
3.50
±
0.10
0.138
±
0.004
P
4.00
±
0.10
0.157
±
0.004
P
0
4.00
±
0.10
0.157
±
0.004
P
1
2.00
±
0.10
W
8.00
+
0.30 /
–0.10
W
1
12.30
±
1.00
SOT-363
(mm)
(inch)
0.079
±
0.004
0.315
+
0.012 /
–0.004
0.484
±
0.039
REV:B
QW-JP009
Page 3
Comchip Technology CO., LTD.
SMD ESD Protection Diode
Marking Code
6
5
4
Part Number
CPDV6-5V0U-HF
Marking Code
E5U
.
1
E5U
2
3
Suggested PAD Layout
SOT-363
SIZE
(mm)
A
B
C
D
0.40
0.80
0.65
1.94
(inch)
0.016
0.031
0.026
B
0.076
A
D
C
Standard Packaging
REEL PACK
Case Type
REEL
( pcs )
Reel Size
(inch)
SOT-363
3,000
7
REV:B
QW-JP009
Page 4
Comchip Technology CO., LTD.
