CRA04P
www.vishay.com
Vishay
Thick Film Chip Resistor Array
FEATURES
• Concave terminal array with square corners
• Wide ohmic range: 1R0 to 1M0
• 8 terminal package with isolated resistors
The CRA04P thick film resistor array is constructed on a
high grade ceramic body with concave terminations. A small
package enables the design of high density circuits. The
single component reduces board space, component counts
and assembly costs.
• Pure tin solder contacts on Ni barrier layer,
provides compatibility with lead (Pb)-free and
lead containing soldering processes
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CIRCUIT
POWER RATING
P
70 °C
W
0.063
LIMITING ELEMENT
VOLTAGE MAX.
V
50
TEMPERATURE
COEFFICIENT
±
ppm/K
100
200
TOLERANCE
±
%
2
5
RESISTANCE
RANGE
10 to 1M
1 to 1M
E-SERIES
24
24
CRA04P
03
Zero-Ohm-Resistor:
R
max.
= 50 m,
I
max.
= 1 A
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation
P
70
(1)
UNIT
W per element
V
V
°C
CRA04P
0.063
50
100
> 10
9
- 55 to + 155
Limiting element voltage
U
max.
AC/DC
Insulation voltage
U
ins
(1 min)
Insulation resistance
Category temperature range
Note
(1)
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRA04P08347K0JTD
(2)
C
R
A
TERMINAL
STYLE
P
0
4
P
0
8
3
4
7
K
0
J
T
D
MODEL
CRA04
PIN
08
CIRCUIT
3
= 03
VALUE
R
= Decimal
K
= Thousand
M
= Million
0000
= 0
Jumper
47K
TOLERANCE
G
=±2%
J
=±5%
Z
= 0
Jumper
PACKAGING
(3)
TD
TC
PZ
SPECIAL
Up to 2 digits
Product Description: CRA04P 08 03 47K 5 % RT7 e3
CRA04P
MODEL
CRA04P
08
TERMINAL COUNT
08
03
CIRCUIT TYPE
03
5%
TOLERANCE
±2%
±5%
RT7
PACKAGING
(3)
RT7
RT6
PZ
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination finish
RESISTANCE VALUE
10R
= 10
47K
= 47
1M
= 1 M
0R0
= 0
Jumper
(2)
(3)
Notes
Preferred way for ordering products is by use of the PART NUMBER.
Please refer to the table PACKAGING, see next page.
Revision: 24-Jun-13
Document Number: 31048
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRA04P
www.vishay.com
Vishay
PACKAGING CODE
PACKAGING
MODEL
TAPE WIDTH
DIAMETER
180 mm/7"
CRA04P
8 mm
330 mm/13"
330 mm/13"
PITCH
2 mm
2 mm
2 mm
PIECES/REEL
10 000
20 000
50 000
TD
TC
PZ
PAPER TAPE
PART NUMBER
PRODUCT DESCRIPTION
RT7
RT6
PZ
CIRCUIT
03 Circuit
DERATING
Rated Power in %
120
100
80
60
40
20
0
- 55
- 25
0
25
50
75
70
100
125
155 175
Ambient Temperature in °C
DIMENSIONS
A
C
PIN
NO#
8
TOL.
DIMENSIONS
in millimeters
L
2.00
A
0.20
B
0.32
C
0.25
P
NOM.
0.50
-
T
0.45
W
1.00
W
± 0.20 ± 0.10 ± 0.10 ± 0.15
± 0.10 ± 0.10
P
L
B
T
SOLDER PAD DIMENSIONS
in millimeters
c
WAVE
0.5
w
1.5
p
0.5
a
0.32
b
0.5
c
w
b
p
a
Revision: 24-Jun-13
Document Number: 31048
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRA04P
www.vishay.com
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
Stability for product type:
CRA04P
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
=
2.5 x
P
70
x
R
2 ×
U
max.
; Duration according to style
Solder bath method; Sn60Pb40;
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
(20/- 55/20) °C and (20/125/20) °C
45 N
Depth 2 mm; 3 times
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
-
125 °C; 16 h
55 °C;
90 % RH; 24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH; 24 h; 5 cycle
U
=
P
70
x
R
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
No burning after 30 s
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (1 %
R
+ 0.05
)
No visible damage
Marking legible,
no visible damage
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
U
=
P
70
x
R
U
max.
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
Solder bath method; (260 ± 5) °C; (10 ± 1) s
IEC 60695-11-5; 10 s
(40 ± 2) °C; (93 ± 3) % RH; 56 days
155 °C; 1000 h
IEC 61340-3-1; 3 positive and 3 negative
discharges; ESD voltage according to style
Isopropyl alcohol; 50 °C; method 2
Isopropyl alcohol; 50 °C; method 1;
toothbrush
f = 10 Hz to 2000 Hz; x, y, z
1.5 mm;
A
200 m/s
2
; 10 sweeps per axis
U
=
15
x
P
70
x
R
2 x
U
max.
0.1 s on; 2.5 s off; 1000 cycles
Û
=
10 x
P
70
x
R
2 x
U
max.
10 pulses
± (2 %
R
+ 0.05
)
REQUIREMENTS PERMISSIBLE
CHANGE (R)
(1)
STABILITY CLASS 2 OR BETTER
10
to 1 M
±2%
1
to 1 M
±5%
Vishay
No flashover or breakdown
± (0.5 %
R
+ 0.05
)
Good tinning ( 95 % covered)
no visible damage
Good tinning ( 95 % covered)
no visible damage
± 100 ppm/K
± 200 ppm/K
No visible damage
No visible damage,
no open circuit in bent position
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
4.17.2
58 (Td)
Solderability
4.8.4.2
4.32
4.33
-
21 (U
U3
)
21 (U
U1
)
Temperature coefficient
Shear (adhesion)
Substrate bending
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
4.22
4.37
4.27
14 (Na)
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
-
58 (Td)
-
78 (Cab)
-
-
45 (XA)
45 (XA)
6 (Fc)
-
-
Rapid change of temperature
Dry heat
Damp heat, cyclic
Cold
Low air pressure
-
Damp heat, cyclic
D.C. load
Endurance at 70 °C
Resistance to soldering heat
Flammability, needle flame test
Damp heat, steady state
Endurance at
upper category temperature
Electrostatic discharge
(human body model)
Component solvent resistance
Solvent resistance of marking
Vibration, endurance by sweeping
Periodic electric overload
Single pulse high voltage overload,
10 μs/700 μs
Note
(1)
Figures are given for a single element.
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 24-Jun-13
Document Number: 31048
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000
模拟与混合信号
