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CRCW0805768RDEEBP

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 768ohm, 150V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 0805, CHIP, ROHS COMPLIANT

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1609582342
包装说明
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
PRECISION
构造
Chip
JESD-609代码
e3
制造商序列号
CRCW0805-P
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.45 mm
封装长度
2 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
1.25 mm
包装方法
TR, PAPER, 11.25 INCH
额定功率耗散 (P)
0.125 W
额定温度
70 °C
参考标准
AEC-Q200
电阻
768 Ω
电阻器类型
FIXED RESISTOR
系列
D/CRCW-P E3
尺寸代码
0805
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
25 ppm/°C
端子面层
Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
0.5%
工作电压
150 V
文档预览
D/CRCW-P e3
Vishay Draloric
Lead (Pb)-Free Thick Film, Rectangular,
Semi-Precision Chip Resistors
FEATURES
Low temperature coefficient (25 ppm/K) and tight
tolerances (± 0.25 %)
Metal glaze on high quality ceramic
Pure tin solder contacts on Ni Barrier layer
provides compatibility with lead (Pb)-free and
lead containing soldering processes
Compliant to RoHS directive 2002/95/EC
Halogen-free according to IEC 61249-2-21 definition
AEC-Q200 qualified, rev. C compliant
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
INCH
METRIC
LIMITING
RATED DISSIPATION
TEMPERATURE
ELEMENT
P
70
COEFFICIENT
VOLTAGE
ppm/K
W
U
max.
AC/DC
± 100
D10/CRCW0402-P 0402 RR 1005M
0.063
50
± 50
± 25
± 100
D11/CRCW0603-P 0603 RR 1608M
0.1
75
± 50
± 25
± 100
D12/CRCW0805-P 0805 RR 2012M
0.125
150
± 50
± 25
± 100
D25/CRCW1206-P 1206 RR 3216M
0.25
200
± 50
± 25
CRCW1210-P
1210 RR 3225M
0.5
200
± 100
± 50
± 100
± 50
± 100
± 50
± 100
± 50
TOLERANCE
%
± 0.5
RESISTANCE
RANGE
Ω
10R to 1M0
E24; E96
SERIES
± 0.25, ± 0.5, ± 1 100R to 1M0
± 0.5, ± 1
± 0.5
± 0.5, ± 1
± 0.25
1K0 to 10K
10R to 10M
100R to 10M
100R to 1M0
E24; E96
± 0.25, ± 0.5, ± 1 200R to 10K
± 0.5
± 0.5, ± 1
± 0.25
10R to 10M
100R to 10M
100R to 1M0
E24; E96
± 0.25, ± 0.5, ± 1 150R to 10K
± 0.5
± 0.5, ± 1
± 0.25
10R to 10M
100R to 10M
100R to 1M0
E24; E96
± 0.25, ± 0.5, ± 1 150R to 10K
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
100R to 1M0
E24; E96
CRCW1218-P
1218 RR 3246M
1.0
200
100R to 2M2
10R to 10M
100R to 10M
10R to 10M
100R to 10M
E24; E96
CRCW2010-P
2010 RR 5025M
0.75
400
E24; E96
CRCW2512-P
2512 RR 6332M
1.0
500
E24; E96
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
www.vishay.com
148
For technical questions, contact:
thickfilmchip@vishay.com
Document Number: 20036
Revision: 04-Aug-10
D/CRCW-P e3
Lead (Pb)-Free Thick Film, Rectangular,
Semi-Precision Chip Resistors
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation
P
70 (1)
Limiting element voltage
U
max.
AC/DC
Insulation voltage
U
ins
(1 min)
Insulation resistance
Category temperature range
Failure rate
Weight
UNIT
W
V
V
Ω
°C
h
-1
mg
0.65
2
5.5
D10/
D11/
D12/
D25/
CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P
CRCW0402-P CRCW0603-P CRCW0805-P CRCW1206-P
0.063
50
> 75
0.1
75
> 100
0.125
150
> 200
0.25
200
> 300
> 10
9
- 55 to + 155
< 0.1 x 10
- 9
10
16
29.5
25.5
40.5
0.5
200
> 300
1.0
200
> 300
0.75
400
> 300
1.0
500
> 300
Vishay Draloric
(1)
Note
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-ciruit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW040275R0DKEDP
(2)
C
R
C
W
0
4
0
2
7
5
R
0
D
K
E
D
P
MODEL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
VALUE
R
= Decimal
K
= Thousand
M
= Million
TOLERANCE
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
TCR
E
= ± 25 ppm/K
H
= ± 50 ppm/K
K
= ± 100 ppm/K
PACKAGING
EA, EB,
EC, ED,
EE, EI,
EL, EK,
EF, EG,
EH, EY
SPECIAL
Up to 2 digits
P
= Precision
Product Description: D10/CRCW0402-P 100 75R 0.5 % ET7 e3
D10/CRCW0402-P
MODEL
D10/CRCW0402-P
D11/CRCW0603-P
D12/CRCW0805-P
D25/CRCW1206-P
CRCW1210-P
CRCW1218-P
CRCW2010-P
CRCW2512-P
100
TCR
±
25
ppm/K
±
50
ppm/K
±
100
ppm/K
75R
RESISTANCE VALUE
49K9
= 49.9
Ω
5R1
= 5.1
Ω
0.5 %
TOLERANCE
±
0.25 %
±
0.5 %
±
1%
ET7
PACKAGING
ET1, ET5,
ET6, ET7,
EF4, EG1,
E20, ET0,
E02, E67,
E82, E27
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination finish
Note
(2)
Preferred way for ordering products is by use of the PART NUMBER.
Document Number: 20036
Revision: 04-Aug-10
For technical questions, contact:
thickfilmchip@vishay.com
www.vishay.com
149
D/CRCW-P e3
Vishay Draloric
Lead (Pb)-Free Thick Film, Rectangular,
Semi-Precision Chip Resistors
PACKAGING
MODEL
UNIT
180 mm/7"
330 mm/13"
180 mm/7"
D11/CRCW0603-P 285 mm/11.25"
330 mm/13"
180 mm/7"
D12/CRCW0805-P 285 mm/11.25"
330 mm/13"
180 mm/7"
D25/CRCW1206-P 285 mm/11.25"
330 mm/13"
180 mm/7"
CRCW1210-P
285 mm/11.25"
330 mm/13"
CRCW1218-P
CRCW2010-P
CRCW2512-P
180 mm/7"
180 mm/7"
180 mm/7"
10 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
PAPER TAPE
ACC. IEC 60286-3, TYPE I
ED
EE
EA
EB
EC
EA
EB
EC
EA
EB
EC
EA
EB
EC
ET7
EF4
ET1
ET5
ET6
ET1
ET5
ET6
ET1
ET5
ET6
ET1
ET5
ET6
4000
4000
2000
4000
EK
EF
EG
EH
ET9
E02
E67
E82
BLISTER TAPE
ACC. IEC 60286-3, TYPE II
QUANTITY PART NUMBER PRODUCT DESC. QUANTITY PART NUMBER PRODUCT DESC.
D10/CRCW0402-P
DIMENSIONS
SOLDER PAD DIMENSIONS
in millimeters
SIZE
INCH METRIC
0402
0603
0805
1206
1210
1218
2010
2512
1005
1608
2012
3216
3225
3246
5025
6332
L
1.0 ± 0.05
1.55
2.0
3.2
+ 0.10
- 0.05
+ 0.20
- 0.10
+ 0.10
- 0.20
DIMENSIONS
in millimeters
REFLOW SOLDERING
W
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
2.5 ± 0.2
4.6 ± 0.15
2.5 ± 0.15
3.15 ± 0.15
H
T1
T2
0.2 ± 0.1
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
0.4 ± 0.2
0.4 ± 0.2
0.6 ± 0.2
0.6 ± 0.2
a
0.4
0.5
0.7
0.9
0.9
1.05
1.0
1.0
b
0.6
0.9
1.3
1.7
2.5
4.9
2.5
3.2
l
0.5
1.0
1.2
2.0
2.0
1.9
3.9
5.2
0.9
0.9
1.1
1.1
1.25
1.2
1.2
0.9
1.3
1.7
2.5
4.8
2.5
3.2
1.0
1.3
2.3
2.2
1.9
3.9
5.2
WAVE SOLDERING
a
b
l
0.35 ± 0.05 0.25 ± 0.05
0.45 ± 0.05
0.45 ± 0.05
0.55 ± 0.05
0.55 ± 0.05
0.55 ± 0.05
0.6 ± 0.1
0.6 ± 0.1
0.3 ± 0.2
0.3
+ 0.20
- 0.10
0.45 ± 0.2
0.45 ± 0.2
0.45 ± 0.2
0.6 ± 0.2
0.6 ± 0.2
3.2 ± 0.2
3.2
+ 0.10
- 0.20
5.0 ± 0.15
6.3 ± 0.2
www.vishay.com
150
For technical questions, contact:
thickfilmchip@vishay.com
Document Number: 20036
Revision: 04-Aug-10
D/CRCW-P e3
Lead (Pb)-Free Thick Film, Rectangular,
Semi-Precision Chip Resistors
Derating
Fraction of Rated Dissipation in
%
120
100
Vishay Draloric
80
60
40
20
0
- 55
- 25
0
25
50
75
70
100
125
155 175
Ambient Temperature in °C
Current Noise
Current Noise
A
1
in µV/V
100
10
2
040
3
060
5
0
8
0 6
20
1
0
201
1
0.1
0.01
100
1K
10K
100K
1M
10M
Resistance Value
R
in
Ω
Non-Linearity
Attenuation of 3rd Harmonic A
3
in dB
120
100
80
1206, 2010
0805
60
40
20
0
10
0603
0402
100
1K
10K
100K
1M
10M
Resistance Value
R
in
Ω
Document Number: 20036
Revision: 04-Aug-10
For technical questions, contact:
thickfilmchip@vishay.com
www.vishay.com
151
D/CRCW-P e3
Vishay Draloric
Lead (Pb)-Free Thick Film, Rectangular,
Semi-Precision Chip Resistors
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
TEST
PROCEDURE
SIZE 0402 to 2512
STABILITY CLASS 1 OR BETTER
Stability for product types:
D/CRCW-P e3
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
= 2.5 x
P
70
x
R
2 x
U
max.
;
duration: Acc. to style
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5)
°C
(3 ± 0.3) s
(20/- 55/20)
°C
and
(20/125/20)
°C
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
Depth 2 mm;
3 times
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
U
=
P
70
x
R
U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5)
°C;
(10 ± 1) s
± (1 %
R
+ 0.05
Ω)
± (2 %
R
+ 0.05
Ω)
± (0.25 %
R
+ 0.05
Ω)
± (1 %
R
+ 0.05
Ω)
± (0.25 %
R
+ 0.05
Ω)
± (1 %
R
+ 0.05
Ω)
1
Ω
to 10 MΩ
±1%
No flashover or breakdown
±
(0.25
%
R
+ 0.05
Ω)
Good tinning (≥ 95 % covered)
no visible damage
4.17.2
58 (Td)
Solderability
Good tinning (≥ 95 % covered)
no visible damage
4.8.4.2
4.32
4.33
-
21 (Uu
3
)
21 (Uu
1
)
Temperature
coefficient
Shear
(adhesion)
Substrate bending
± 100 ppm/K
No visible damage
No visible damage, no open circuit in bent position
± (0.25 %
R
+ 0.05
Ω)
4.19
14 (Na)
Rapid change of
temperature
4.25.1
-
Endurance
at 70 °C
www.vishay.com
152
For technical questions, contact:
thickfilmchip@vishay.com
Document Number: 20036
Revision: 04-Aug-10
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