D/CRCW-HR
www.vishay.com
Vishay
Lead (Pb)-Bearing Thick Film,
Rectangular High Value Chip Resistor
FEATURES
• High resistance values (up to 470M)
• Suitable for voltage dividers and hybrids
• Lead (Pb)-bearing termination plating on Ni barrier layer
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P
70
W
0.10
0.125
0.25
LIMITING
ELEMENT
VOLTAGE
U
max.
AC
RMS
/DC
V
75
150
200
TEMPERATURE
COEFFICIENT
ppm/K
RESISTANCE
RANGE
MODEL
TOLERANCE
%
SERIES
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
0603
0805
1206
RR 1608M
RR 2012M
RR 3216M
± 500
± 500
± 500
±5
±5
±5
11M to 470M
11M to 470M
11M to 470M
E24
E24
E24
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage, and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time, generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020)
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation at
P
70 (1)
Operating Voltage
U
max.
AC
RMS
/DC
Voltage Coefficient
Insulation Voltage
U
ins
(1 min)
Insulation Resistance
Operating Temperature Range
Weight
UNIT
W
V
%/V
V
°C
mg
2
100
D11/CRCW0603-HR
0.1
75
D12/CRCW0805-HR
0.125
150
< 100M: < 0.1
> 100M: < 0.3
200
> 10
9
- 55 to + 155
5.5
10
300
D25/CRCW1206-HR
0.25
200
(1)
Note
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 12-Jun-12
Document Number: 20011
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-HR
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW060316M0JPTBHR
C
R
C
W
0
6
0
3
1
6
M
0
J
TCR
P
T
B
H
R
SPECIAL
MODEL/SIZE
CRCW0603
CRCW0805
CRCW1206
RESISTANCE
M
= Million
TOLERANCE
J
=±5%
PACKAGING
TA, TB
TC
P
= ± 500 ppm/K
Up to 2 digits
HR
= High value
Product Description: CRCW0603-HR 500 16M 5% RT5
CRCW0603-HR
MODEL
CRCW0603-HR
CRCW0805-HR
CRCW1206-HR
500
TCR
±
500
ppm/K
16M
RESISTANCE
68M
= 68 M
220M
= 220 M
J
TOLERANCE
±5%
RT5
PACKAGING
RT1, RT5
RT6
PACKAGING
MODEL
CRCW0603-HR
CODE
TA = RT1
TB = RT5
TC = RT6
TA = RT1
CRCW0805-HR
TB = RT5
TC = RT6
TA = RT1
CRCW1206-HR
TB = RT5
TC = RT6
QUANTITY
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
8 mm
4 mm
Paper tape acc. to
IEC 60068-3
Type I
8 mm
4 mm
8 mm
4 mm
CARRIER TAPE
WIDTH
PITCH
REEL DIAMETER
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
DIMENSIONS
SOLDER PAD DIMENSIONS
in millimeters
SIZE
INCH METRIC
0603
0805
1206
1608
2012
3216
1.55
2.0
3.2
L
+ 0.10
- 0.05
+ 0.20
- 0.10
+ 0.10
- 0.20
DIMENSIONS
in millimeters
REFLOW SOLDERING
W
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
H
0.45 ± 0.05
0.45 ± 0.05
0.55 ± 0.05
T1
0.3 ± 0.2
0.3
+ 0.20
- 0.10
WAVE SOLDERING
a
0.9
0.9
1.1
b
0.9
1.3
1.7
l
1.0
1.3
2.3
T2
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
a
0.5
0.7
0.9
b
0.9
1.3
1.7
l
1.0
1.2
2.0
0.45 ± 0.2
Revision: 12-Jun-12
Document Number: 20011
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-HR
www.vishay.com
DERATING
Fraction of Rated Dissipation
P
70
Vishay
100
%
50
0
- 50
0
50
100
°C
150
70
Ambient Temperature in
amb
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
D/CRCW-HR
4.5
4.13
4.17.2
4.8.4.2
4.32
4.33
_
_
58 (Td)
_
21 (Uu
3
)
21 (Uu
1
)
Resistance
Short time overload
Solderability
Temperature
coefficient
Shear (adhesion)
Substrate bending
-
U
= 2.5 x √P
70
x
R
2 x
U
max.
;
Duration acc. to style
Solder bath method;
Sn60Pb40
20 °C/- 55 °C/20 °C and
20 °C/125 °/20 °C
RR 1608: 9 N
RR 2012 and RR 3216: 45 N
Depth 2 mm;
3 times
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH
24 h; 5 cycle
U
= √P
70
x
R
U
= √P
70
x
R
U
max.
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
11 M to 470 M
±5%
± (0.5 %
R
+ 0.05
)
Good tinning ( 95 % covered); no visible
damage
± 500 ppm/K
No visible damage
No visible damage, no open circuit in bent
position
± (0.25 %
R
+ 0.05
)
4.19
14 (Na)
Rapid change of
temperature
Climatic sequence:
Dry Heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
D.C. Load
Endurance at
70 °C
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
_
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
_
± (2 %
R
+ 0.1
)
4.25.1
_
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
Revision: 12-Jun-12
Document Number: 20011
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-HR
www.vishay.com
Vishay
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
D/CRCW-HR
11 M to 470 M
± (0.5 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (2 %
R
+ 0.1
)
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
4.18.2
58 (Td)
Resistance to
soldering heat
Damp heat,
steady state
Endurance at upper
category temperature
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
(40 ± 2) °C;
(93 ± 3) % RH; 56 days
155 °C; 1000 h
4.24
4.25.3
78 (Cab)
_
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 12-Jun-12
Document Number: 20011
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000
