D/CRCW-TR e3
www.vishay.com
Vishay
Lead (Pb)-Free Thick Film, Rectangular,
Trimmable Chip Resistors
FEATURES
• Can be trimmed to the required value after
insertion
• For applications in precision circuitry where
relative tolerances can be compensated by
trimming
• Pure tin solder contact on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
INCH
CASE
SIZE
METRIC
LIMITING
POWER ELEMENT
TEMPERATURE
RATING VOLTAGE
COEFFICIENT
Umax.
P
70
± ppm/K
AC
RMS
/DC
W
V
0.063
0.10
0.125
0.25
0.50
0.75
1.0
50
75
150
200
200
400
500
100
200
100
200
100
200
100
200
100
200
100
200
100
200
TOLERANCE
±%
RESISTANCE
RANGE
SERIES
10 to 10M
0.47 to 10M
10 to 10M
0.47 to 10M
10 to 10M
0.47 to 10M
10 to 10M
0.47 to 10M
10 to 4.7M
10 to 4.7M
10 to 4.7M
MODEL
D10/CRCW0402-TR
D11/CRCW0603-TR
D12/CRCW0805-TR
D25/CRCW1206-TR
CRCW1210-TR
CRCW2010-TR
CRCW2512-TR
0402
0603
0805
1206
1210
2010
2512
RR 1005M
RR 1608M
RR 2012M
RR 3216M
RR 3225M
RR 5025M
RR 6332M
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
10, 15, 20,
+ 0/- 10, + 0/- 20, + 0/- 30
E24
E24
E24
E24
E24
E24
E24
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time, generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking: None
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation
P
70 (1)
Operating voltage
U
max.
AC
RMS
/DC
Insulation voltage
U
ins.
(1 min)
Insulation resistance
Operating temperature range
Weight
UNIT
W
V
V
°C
mg
0.65
2
5.5
D10/
D11/
D12/
D25/
CRCW1210-TR CRCW2010-TR CRCW2512-TR
CRCW0402-TR CRCW0603-TR CRCW0805-TR CRCW1206-TR
0.063
50
75
0.1
75
100
0.125
150
200
0.25
200
300
>
10
9
10
16
25.5
40.5
- 55 to + 155
0.50
200
300
0.75
400
300
1.0
500
300
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 13-Aug-12
Document Number: 20023
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-TR e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW040275R0KKEDTR
C
MODEL
R
C
W
0
4
0
2
7
5
R
TCR
0
K
K
E
D
T
R
SPECIAL
RESISTANCE
R
= Decimal
K
= Thousand
M
= Million
TOLERANCE
K
= ± 10 %
L
= ± 15 %
M
= ± 20 %
U
= + 0 %/- 10 %
V
= + 0 %/- 20 %
W
= + 0 %/- 30 %
PACKAGING
EA
EB
EC
ED
EE
EF
EG
EH
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW2010
CRCW2512
K
= ± 100 ppm/K
N
= ± 200 ppm/K
Up to 2 digits
TR
= Trimmable
Product Description: D10/CRCW0402-TR 100 75R 10 % ET7 e3
D10/CRCW0402-TR
MODEL
D10/CRCW0402-TR
D11/CRCW0603-TR
D12/CRCW0805-TR
D25/CRCW1206-TR
CRCW1210-TR
CRCW2010-TR
CRCW2512-TR
100
TCR
±
100
ppm/K
±
200
ppm/K
75R
RESISTANCE
49K9
= 49.9 k
5R1
= 5.1
10 %
TOLERANCE
±
10 %
±
15 %
±
20 %
+ 0 %/- 10 %
+ 0 %/- 20 %
+ 0 %/- 30 %
ET7
PACKAGING
ET1
ET5
ET6
ET7
EF4
E02
E67
E82
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination finish
PACKAGING
MODEL
D10/CRCW0402-TR
CODE
ED = ET7
EE = EF4
EA = ET1
D11/CRCW0603-TR
EB = ET5
EC = ET6
EA = ET1
D12/CRCW0805-TR
EB = ET5
EC = ET6
EA = ET1
D25/CRCW1206-TR
EB = ET5
EC = ET6
EA = ET1
CRCW1210-TR
CRCW1218-TR
CRCW2010-TR
CRCW2512-TR
EB = ET5
EC = ET6
EK = ET9
EF = E02
EG = E67
EH = E82
QUANTITY
10 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
4000
4000
2000
4000
Blister tape acc.
to IEC 60068-3
Type II
12 mm
12 mm
12 mm
4 mm
4 mm
8 mm
4 mm
8 mm
4 mm
8 mm
4 mm
Paper tape acc.
to IEC 60068-3
Type I
8 mm
4 mm
8 mm
4 mm
CARRIER TAPE
WIDTH
8 mm
PITCH
2 mm
REEL DIAMETER
180 mm/7"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
180 mm/7"
180 mm/7"
Revision: 13-Aug-12
Document Number: 20023
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-TR e3
www.vishay.com
Vishay
DIMENSIONS
SIZE
DIMENSIONS
in millimeters
SOLDER PAD DIMENSIONS
in millimeters
REFLOW
SOLDERING
T2
0.2 ± 0.1
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
0.4 ± 0.2
0.6 ± 0.2
0.6 ± 0.2
a
0.4
0.5
0.7
0.9
0.9
1.0
1.0
b
0.6
0.9
1.3
1.7
2.5
2.5
3.2
l
0.5
1.0
1.2
2.0
2.0
3.9
5.2
0.9
0.9
1.1
1.1
1.2
1.2
0.9
1.3
1.7
2.5
2.5
3.2
1.0
1.3
2.3
2.2
3.9
5.2
a
WAVE
SOLDERING
b
l
INCH
0402
0603
0805
1206
1210
2010
2512
METRIC
1005
1608
2012
3216
3225
5025
6332
L
1.0 ± 0.05
1.55
2.0
3.2
+ 0.10
- 0.05
+ 0.20
- 0.10
+ 0.10
- 0.20
W
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
2.5 ± 0.2
2.5 ± 0.15
3.15 ± 0.15
H
0.35 ± 0.05
0.45 ± 0.05
0.45 ± 0.05
0.55
+ 0.05
- 0.10
T1
0.25 ± 0.05
0.3 ± 0.2
0.3
+ 0.20
- 0.10
0.45 ± 0.2
0.45 ± 0.2
0.6 ± 0.2
0.6 ± 0.2
3.2 ± 0.2
5.0 ± 0.15
6.3 ± 0.2
0.55 ± 0.05
0.6 ± 0.1
0.6 ± 0.1
TRIMMING INSTRUCTIONS
Overglaze
Sn - Film
Ni - Film
CrNi - Film
Ceramic Substrate
Silver
Resistance Layer
YAG-Laser:
Maximum trimming factor = 1.6 for an I-cut and 1.8 for a L-cut.
Double cut: Distance between two cuts = 0.5 mm min.
The laser-cut should be protected with epoxy resins.
Revision: 13-Aug-12
Document Number: 20023
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-TR e3
www.vishay.com
PERMISSIBLE TRIMMING AREA
L tr im
pre-contact,
hidden
trimming cut
Vishay
usable
trimming
area
tinned contact,
electroplated,
visible
L
DIMENSIONS OF THE PERMISSIBLE TRIMMING AREA
in millimeters
MODEL
D10/CRCW0402-TR
(1)
D11/CRCW0603-TR
(1)
D12/CRCW0805-TR
D25/CRCW1206-TR
CRCW1210-TR
CRCW2010-TR
CRCW2512-TR
Note
(1)
Single cut only.
L
1.0
1.55
2.0
3.2
3.2
5.0
6.3
W
0.5
0.85
1.25
1.6
2.5
2.5
3.15
L
trim
0.25
0.425
0.625
0.8
1.25
1.25
1.575
W
trim
0.27
0.5
0.85
1.0
1.6
1.9
2.4
D
0.25
0.425
0.625
0.8
1.25
1.25
1.575
DERATING
Fraction of Rated Dissipation
P
70
100
%
50
0
- 50
0
D
50
Derating
100
°C
150
70
Ambient Temperature in
amb
Revision: 13-Aug-12
Document Number: 20023
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
W trim
W
D/CRCW-TR e3
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Vishay
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
(1)
Stability for product types:
D/CRCW-TR e3
4.5
4.13
-
-
Resistance
Short time overload
-
U
= 2.5 x
P
70
x
R
2 x
U
max.;
Duration acc. to style
Solder bath method;
Sn60Pb40
non-activated flux;
(235 ± 5) °C
(2 ± 0.2) s
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5 or
Sn99.3Cu0.7
non-activated flux;
(245 ± 5) °C or (250 ± 5) °C
(3 ± 0.3) s
(20/- 55/20) °C and
(20/125/20) °C
30 min. at - 55 °C;
30 min. at 125 °C
4.19
14 (Na)
Rapid change
of temperature
5 cycles
1000 cycles
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
STABILITY CLASS 1
OR BETTER
1 to 10 M
±1%
± (0.25 %
R
+ 0.05
)
STABILITY CLASS 2
OR BETTER
0.47 to 10 M
±5%
± (0.5 %
R
+ 0.05
)
Good tinning ( 95 % covered)
no visible damage
Good tinning ( 95 % covered)
no visible damage
4.8.4.2
-
Temperature
coefficient
± 100 ppm/K
± 200 ppm/K
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
U
=
P
70
x
R
U
max.;
1.5 h on; 0.5 h off;
4.25.1
-
Endurance at 70 °C
70 °C; 1000 h
70 °C; 8000 h
Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (0.25 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
4.18.2
58 (Td)
Revision: 13-Aug-12
Document Number: 20023
5
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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