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CY2304NZ
Four Output PCI-X and General Purpose Buffer
Features
•
One input to four output buffer/driver
• General-purpose or PCI-X clock buffer
• Buffers all frequencies from DC to 140 MHz
•
Output-to-output skew less than 100 ps
•
Space-saving 8-pin TSSOP package
• 3.3V operation
• 60 ps typical output-output skew
BUF_IN
L
H
L
H
Functional Description
The CY2304NZ is a low-cost buffer designed to distribute
high-speed clocks for PCI-X and other applications. The
device operates at 3.3V and outputs can run up to 140 MHz.
Table 1. Function Table
Inputs
OE
L
L
H
H
Outputs
Output [1:4]
L
L
L
H
Block Diagram
OE
BUF_IN
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
Logic
Control
Pin Configuration
8 TSSOP
Top View
BUF_IN
OE
OUTPUT1
GND
1
2
3
4
8
7
6
5
OUTPUT4
OUTPUT3
VDD
OUTPUT2
Pin Description for CY2304NZ
Signal
V
DD
GND
BUF_IN
OUTPUT [1:4]
OE
Pin
6
4
1
3, 5, 7, 8
2
3.3V voltage supply
Ground
Input clock
Outputs
Input pin for output enable, active HIGH.
Description
Cypress Semiconductor Corporation
Document #: 38-07099 Rev. *C
•
3901 North First Street
•
San Jose
,
CA 95134
•
408-943-2600
Revised January 04, 2005
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CY2304NZ
Maximum Ratings
Supply Voltage to Ground Potential ........–0.5V to V
DD
+0.5V
DC Input Voltage (Except REF) .............–0.5V to V
DD
+0.5V
DC Input Voltage REF.............................–0.5V to V
DD
+0.5V
Storage Temperature ................................. –65°C to +150°C
Max. Soldering Temperature (10 sec.) ....................... 260°C
Junction Temperature ................................................. 150°C
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ........................... > 2,000V
Operating Conditions
Parameter
V
DD
T
A
C
L
C
IN
t
PU
Supply Voltage
Operating Temperature (Ambient Temperature)
Load Capacitance
Input Capacitance
Power-up time for all VDD's to reach minimum specified
voltage (power ramps must be monotonic)
Description
Min.
3.0
–40
–
–
DC
0.05
Max.
3.6
85
25
7
140
50
Unit
V
°C
pF
pF
MHz
ms
BUF_IN, OUTPUT [1:4] Operating Frequency
Electrical Characteristics
Parameter
V
IL
V
IH
I
IL
I
IH
V
OL
V
OH
I
DD
Description
Input LOW Voltage
[1]
Input HIGH Voltage
[1]
Input LOW Current
Input HIGH Current
Output LOW Voltage
[2]
Test Conditions
Min.
–
2.0
Max.
0.8
–
5
5
0.8
0.55
–
–
25
Unit
V
V
µA
µA
V
V
V
V
mA
V
IN
= 0V
V
IN
= V
DD
I
OL
= 24 mA
I
OL
= 12 mA
I
OH
= –24 mA
I
OH
= –12 mA
Unloaded outputs at 66.66 MHz
–5
–5
–
–
2.0
2.4
–
Output HIGH Voltage
[2]
Supply Current
Switching Characteristics
[3]
for Commercial and Industrial Temperature Devices
Parameter
t
3
t
4
t
5
t
6
Name
Duty Cycle
[2]
= t
2
÷
t
1
Rise Time
[2]
Fall Time
[2]
Output to Output Skew
[2]
Propagation Delay,
BUF_IN Rising Edge to
OUTPUT
Rising Edge
[2]
Description
Measured at 1.5V
Measured between 0.8V and 2.0V
Measured between 0.8V and 2.0V
All outputs equally loaded
Measured at V
DD
/2
Min.
40.0
–
–
–
2.5
Typ.
50.0
–
–
60
3.5
Max.
60.0
1.50
1.50
100
5
Unit
%
ns
ns
ps
ns
Switching Waveforms
Duty Cycle Timing
t
1
t
2
1.5V
1.5V
1.5V
Notes:
1. BUF_IN input has a threshold voltage of V
DD
/2.
2. Parameter is guaranteed by design and characterization. It is not 100% tested in production.
3. All parameters specified with loaded outputs.
Document #: 38-07099 Rev. *C
Page 2 of 5
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CY2304NZ
Switching Waveforms
(continued)
All Outputs Rise/Fall Time
OUTPUT
2.0V
0.8V
t
3
2.0V
0.8V
t
4
3.3V
0V
Output-Output Skew
OUTPUT
1.5V
OUTPUT
t
5
1.5V
Input-Output Propagation Delay
INPUT
V
DD
/2
OUTPUT
t
6
V
DD
/2
Ordering Information
Ordering Code
Standard
CY2304NZZC-1
CY2304NZZC-1T
CY2304NZZI-1
CY2304NZZI-1T
Lead-free
CY2304NZZXC-1
CY2304NZZXC-1T
CY2304NZZXI-1
CY2304NZZXI-1T
8-pin TSSOP
8-pin TSSOP – Tape and Reel
8-pin TSSOP
8-pin TSSOP – Tape and Reel
Commercial, 0°C to 70°C
Commercial, 0°C to 70°C
Industrial, –40°C to 85°C
Industrial, –40°C to 85°C
8-pin TSSOP
8-pin TSSOP – Tape and Reel
8-pin TSSOP
8-pin TSSOP – Tape and Reel
Commercial, 0°C to 70°C
Commercial, 0°C to 70°C
Industrial, –40°C to 85°C
Industrial, –40°C to 85°C
Package Type
Operating Range
Document #: 38-07099 Rev. *C
Page 3 of 5
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CY2304NZ
Package Diagram
8-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z8
PIN 1 ID
1
DIMENSIONS IN MM[INCHES] MIN.
MAX.
6.25[0.246]
6.50[0.256]
4.30[0.169]
4.50[0.177]
8
0.19[0.007]
0.30[0.012]
0.65[0.025]
BSC.
1.10[0.043] MAX.
0.25[0.010]
BSC
GAUGE
PLANE
0°-8°
0.85[0.033]
0.95[0.037]
2.90[0.114]
3.10[0.122]
0.076[0.003]
0.05[0.002]
0.15[0.006]
SEATING
PLANE
0.50[0.020]
0.70[0.027]
0.09[[0.003]
0.20[0.008]
51-85093-*A
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-07099 Rev. *C
Page 4 of 5
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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