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CY37512VP208-66NTI

EE PLD, 20ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
QFP
包装说明
THERMALLY ENHANCED, PLASTIC, QFP-208
针数
208
Reach Compliance Code
compli
其他特性
512 MACROCELLS
最大时钟频率
50 MHz
系统内可编程
YES
JESD-30 代码
S-PQFP-G208
JESD-609代码
e0
JTAG BST
YES
长度
28 mm
湿度敏感等级
3
专用输入次数
1
I/O 线路数量
160
宏单元数
512
端子数量
208
最高工作温度
85 °C
最低工作温度
-40 °C
组织
1 DEDICATED INPUTS, 160 I/O
输出函数
MACROCELL
封装主体材料
PLASTIC/EPOXY
封装代码
FQFP
封装等效代码
QFP208,1.2SQ,20
封装形状
SQUARE
封装形式
FLATPACK, FINE PITCH
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3 V
可编程逻辑类型
EE PLD
传播延迟
20 ns
认证状态
Not Qualified
座面最大高度
3.77 mm
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
28 mm
Base Number Matches
1
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Family
Ultra37000™ CPLD Family
[1]
5V, 3.3V, ISR™ High-Performance CPLDs
Features
• In-System Reprogrammable™ (ISR™) CMOS CPLDs
— JTAG interface for reconfigurability
— Design changes don’t cause pinout changes
— Design changes don’t cause timing changes
• High density
— 32 to 512 macrocells
— 32 to 264 I/O pins
— 5 dedicated inputs including 4 clock pins
• Simple timing model
— No fanout delays
— No expander delays
— No dedicated vs. I/O pin delays
— No additional delay through PIM
— No penalty for using full 16 product terms
— No delay for steering or sharing product terms
3.3V and 5V versions
PCI Compatible
[2]
Programmable Bus-Hold capabilities on all I/Os
Intelligent product term allocator provides:
— 0 to 16 product terms to any macrocell
— Product term steering on an individual basis
— Product term sharing among local macrocells
• Flexible clocking
— 4 synchronous clocks per device
— Product Term clocking
— Clock polarity control per logic block
• Consistent package/pinout offering across all densities
— Simplifies design migration
— Same pinout for 3.3V and 5.0V devices
• Packages
— 44 to 400 Leads in PLCC, CLCC, PQFP, TQFP, CQFP,
BGA, and Fine-Pitch BGA packages
General Description
The Ultra37000™ family of CMOS CPLDs provides a range of
high-density programmable logic solutions with unparalleled
system performance. The Ultra37000 family is designed to
bring the flexibility, ease of use, and performance of the 22V10
to high-density CPLDs. The architecture is based on a number
of logic blocks that are connected by a Programmable Inter-
connect Matrix (PIM). Each logic block features its own prod-
uct term array, product term allocator, and 16 macrocells. The
PIM distributes signals from the logic block outputs and all in-
put pins to the logic block inputs.
All of the Ultra37000 devices are electrically erasable and In-
System Reprogrammable (ISR), which simplifies both design
and manufacturing flows, thereby reducing costs. The ISR fea-
ture provides the ability to reconfigure the devices without hav-
ing design changes cause pinout or timing changes. The
Cypress ISR function is implemented through a JTAG-compli-
ant serial interface. Data is shifted in and out through the TDI
and TDO pins, respectively. Because of the superior routability
and simple timing model of the Ultra37000 devices, ISR allows
users to change existing logic designs while simultaneously
fixing pinout assignments and maintaining system perfor-
mance.
The entire family features JTAG for ISR and boundary scan,
and is compatible with the PCI Local Bus specification, meet-
ing the electrical and timing requirements. The Ultra37000
family features user programmable bus-hold capabilities on all
I/Os.
Ultra37000 5.0V Devices
The Ultra37000 devices operate with a 5V supply and can sup-
port 5V or 3.3V I/O levels. V
CCO
connections provide the ca-
pability of interfacing to either a 5V or 3.3V bus. By connecting
the V
CCO
pins to 5V the user insures 5V TTL levels on the
outputs. If V
CCO
is connected to 3.3V the output levels meet
3.3V JEDEC standard CMOS levels and are 5V tolerant.
These devices require 5V ISR programming.
Ultra37000V 3.3V Devices
Devices operating with a 3.3V supply require 3.3V on all V
CCO
pins, reducing the device’s power consumption. These devices
support 3.3V JEDEC standard CMOS output levels, and are
5V tolerant. These devices allow 3.3V ISR programming.
Notes:
1. The data sheet parameters are final for the following devices: CY37032, CY37032V (with the exception of the 154-MHz speed bin), CY37128, CY37128V (with
the exception of the 154-MHz speed bin), CY37192, CY37192V, CY37256, and CY37256V (with the exception of the 143-MHz speed bin). The data sheet
parameters are considered preliminary for the following devices: CY37064, CY37064V, CY37384, CY37384V, CY37512, and CY37512V.
2. Due to the 5V-tolerant nature of 3.3V device I/Os, the I/Os are not clamped to V
CC
, PCI V
IH
=2V.
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
February 9, 2000
Ultra37000™ CPLD Family
[1]
Selection Guide
5.0V Selection Guide
General Information
Device
CY37032
CY37064
CY37128
CY37192
CY37256
CY37384
CY37512
Speed Bins
Device
CY37032
CY37064
CY37128
CY37192
CY37256
CY37384
CY37512
200
X
X
X
X
X
167
154
X
X
143
125
X
X
X
X
X
X
X
X
X
X
X
X
X
X
100
83
66
Macrocells
32
64
128
192
256
384
512
Dedicated
Inputs
5
5
5
5
5
5
5
I/O Pins
32
32/64
64/128
120
128/160/192
160/192
160/192/264
Speed (t
PD
)
6
6
6.5
7.5
7.5
10
10
Speed (f
MAX
)
200
200
167
154
154
125
125
Device-Package Offering & I/O Count
Device
CY37032
CY37064
CY37128
CY37192
CY37256
CY37384
CY37512
44-
Lead
TQFP
37
37
44-
Lead
PLCC
37
37
37
69
69
69
69
69
133
125
133
133
165
165
165
165
197
197
197
269
44-
Lead
CLCC
84-
Lead
PLCC
84-
Lead
CLCC
100-
Lead
TQFP
160-
Lead
TQFP
160-
Lead
CQFP
208-
Lead
PQFP
208-
Lead
CQFP
256-
Lead
BGA
352-
Lead
BGA
2
Ultra37000™ CPLD Family
[1]
3.3V Selection Guide
General Information
Device
CY37032V
CY37064V
CY37128V
CY37192V
CY37256V
CY37384V
CY37512V
Speed Bins
Device
CY37032V
[1]
CY37064V
[1]
CY37128V
[1]
CY37192V
CY37256V
CY37512V
[1]
Macrocells
32
64
128
192
256
384
512
Dedicated
Inputs
5
5
5
5
5
5
5
I/O Pins
32
32/64
64/80/128
120
128/160/192
160/192
160/192/264
Speed (t
PD
)
8.5
8.5
10
12
12
15
15
Speed (f
MAX
)
143
143
125
100
100
83
83
200
167
154
X
X
X
143
X
X
125
100
X
X
83
66
X
X
X
X
X
X
X
X
X
X
X
X
CY37384V
[1]
Shaded areas indicate preliminary speed bins.
Device-Package Offering & I/O Count
Device
CY37032V
CY37064V
CY37128V
CY37192V
CY37256V
CY37384V
CY37512V
44-
Lead
TQFP
44-
Lead
PLCC
44-
Lead
CLCC
48-
Lead
FBGA
84-
Lead
PLCC
84-
Lead
CLCC
100-
Lead
TQFP
100-
Lead
FBGA
160-
Lead
TQFP
160-
Lead
CQFP
208-
Lead
PQFP
208-
Lead
CQFP
256-
Lead
BGA
256-
Lead
FBGA
352-
Lead
BGA
400-
Lead
FBGA
37
37
37
37
37
37
69
69
69
69
69
85
133
125
133
133
165
165
165
165
197
197
197
269
269
197
3
Ultra37000™ CPLD Family
[1]
Architecture Overview of Ultra37000 Family
Programmable Interconnect Matrix
The Programmable Interconnect Matrix (PIM) consists of a
completely global routing matrix for signals from I/O pins and
feedbacks from the logic blocks. The PIM provides extremely
robust interconnection to avoid fitting and density limitations.
The inputs to the PIM consist of all I/O and dedicated input pins
and all macrocell feedbacks from within the logic blocks. The
number of PIM inputs increases with pin count and the number
of logic blocks. The outputs from the PIM are signals routed to
the appropriate logic blocks. Each logic block receives 36 in-
puts from the PIM and their complements, allowing for 32-bit
operations to be implemented in a single pass through the
device. The wide number of inputs to the logic block also im-
proves the routing capacity of the Ultra37000 family.
An important feature of the PIM is its simple timing. The prop-
agation delay through the PIM is accounted for in the timing
specifications for each device. There is no additional delay for
traveling through the PIM. In fact, all inputs travel through the
PIM. As a result, there are no route-dependent timing param-
eters on the Ultra37000 devices. The worst-case PIM delays
are incorporated in all appropriate Ultra37000 specifications.
Routing signals through the PIM is completely invisible to the
user. All routing is accomplished by software—no hand routing
is necessary.
Warp™
and third-party development packages
automatically route designs for the Ultra37000 family in a mat-
ter of minutes. Finally, the rich routing resources of the
Ultra37000 family accommodate last minute logic changes
while maintaining fixed pin assignments.
Logic Block
The logic block is the basic building block of the Ultra37000
architecture. It consists of a product term array, an intelligent
product-term allocator, 16 macrocells, and a number of I/O
cells. The number of I/O cells varies depending on the device
used. Refer to
Figure 1
for the block diagram.
Product Term Array
Each logic block features a 72 x 87 programmable product
term array. This array accepts 36 inputs from the PIM, which
originate from macrocell feedbacks and device pins. Active
LOW and active HIGH versions of each of these inputs are
generated to create the full 72-input field. The 87 product
terms in the array can be created from any of the 72 inputs.
Of the 87 product terms, 80 are for general-purpose use for
the 16 macrocells in the logic block. Four of the remaining
seven product terms in the logic block are output enable (OE)
product terms. Each of the OE product terms controls up to
eight of the 16 macrocells and is selectable on an individual
macrocell basis. In other words, each I/O cell can select be-
tween one of two OE product terms to control the output buffer.
The first two of these four OE product terms are available to
the upper half of the I/O macrocells in a logic block. The other
two OE product terms are available to the lower half of the I/O
macrocells in a logic block.
The next two product terms in each logic block are dedicated
asynchronous set and asynchronous reset product terms. The
final product term is the product term clock. The set, reset, OE
and product term clock have polarity control to realize OR
functions in a single pass through the array.
3
0−16
PRODUCT
TERMS
2
I/O
CELL
0
2
MACRO-
CELL
0
MACRO-
CELL
1
7
0−16
PRODUCT
TERMS
to cells
2, 4, 6 8, 10, 12
FROM
PIM
36
72 x 87
PRODUCT TERM
ARRAY
80
PRODUCT
TERM
ALLOCATOR
0−16
PRODUCT
TERMS
MACRO-
CELL
14
MACRO-
CELL
15
I/O
CELL
14
0−16
TO
PIM
PRODUCT
TERMS
16
8
Figure 1. Logic Block with 50% Buried Macrocells
4
Ultra37000™ CPLD Family
[1]
Low-Power Option
Each logic block can operate in high-speed mode for critical
path performance, or in low-power mode for power conserva-
tion. The logic block mode is set by the user on a logic block
by logic block basis.
Product Term Allocator
Through the product term allocator, software automatically dis-
tributes product terms among the 16 macrocells in the logic
block as needed. A total of 80 product terms are available from
the local product term array. The product term allocator pro-
vides two important capabilities without affecting performance:
product term steering and product term sharing.
Product Term Steering
Product term steering is the process of assigning product
terms to macrocells as needed. For example, if one macrocell
requires ten product terms while another needs just three, the
product term allocator will “steer” ten product terms to one
macrocell and three to the other. On Ultra37000 devices, prod-
uct terms are steered on an individual basis. Any number be-
tween 0 and 16 product terms can be steered to any macrocell.
Note that 0 product terms is useful in cases where a particular
macrocell is unused or used as an input register.
Product Term Sharing
Product term sharing is the process of using the same product
term among multiple macrocells. For example, if more than
one output has one or more product terms in its equation that
are common to other outputs, those product terms are only
programmed once. The Ultra37000 product term allocator al-
lows sharing across groups of four output macrocells in a vari-
able fashion. The software automatically takes advantage of
this capability—the user does not have to intervene.
Note that neither product term sharing nor product term steer-
ing have any effect on the speed of the product. All worst-case
steering and sharing configurations have been incorporated in
the timing specifications for the Ultra37000 devices.
Ultra37000 Macrocell
Within each logic block there are 16 macrocells. Macrocells
can either be I/O Macrocells, which include an I/O Cell which
is associated with an I/O pin, or buried Macrocells, which do
not connect to an I/O. The combination of I/O Macrocells and
buried Macrocells varies from device to device.
Buried Macrocell
Figure 2
displays the architecture of buried macrocells. The
buried macrocell features a register that can be configured as
combinatorial, a D flip-flop, a T flip-flop, or a level-triggered
latch.
The register can be asynchronously set or asynchronously re-
set at the logic block level with the separate set and reset prod-
uct terms. Each of these product terms features programma-
ble polarity. This allows the registers to be set or reset based
on an AND expression or an OR expression.
Clocking of the register is very flexible. Four global synchro-
nous clocks and a product term clock are available to clock the
register. Furthermore, each clock features programmable po-
larity so that registers can be triggered on falling as well as
rising edges (see the Clocking section). Clock polarity is cho-
sen at the logic block level.
The buried macrocell also supports input register capability.
The buried macrocell can be configured to act as an input reg-
ister (D-type or latch) whose input comes from the I/O pin as-
sociated with the neighboring macrocell. The output of all bur-
ied macrocells is sent directly to the PIM regardless of its
configuration.
I/O Macrocell
Figure 2
illustrates the architecture of the I/O macrocell. The
I/O macrocell supports the same functions as the buried mac-
rocell with the addition of I/O capability. At the output of the
macrocell, a polarity control mux is available to select active
LOW or active HIGH signals. This has the added advantage of
allowing significant logic reduction to occur in many applica-
tions.
The Ultra37000 macrocell features a feedback path to the PIM
separate from the I/O pin input path. This means that if the
macrocell is buried (fed back internally only), the associated
I/O pin can still be used as an input.
Bus Hold Capabilities on all I/Os
Bus-hold, which is an improved version of the popular internal
pull-up resistor, is a weak latch connected to the pin that does
not degrade the device’s performance. As a latch, bus-hold
maintains the last state of a pin when the pin is placed in a
high-impedance state, thus reducing system noise in bus-in-
terface applications. Bus-hold additionally allows unused de-
vice pins to remain unconnected on the board, which is partic-
ularly useful during prototyping as designers can route new
signals to the device without cutting trace connections to V
CC
or GND. For more information, see the application note “Un-
derstanding Bus-hold
A Feature of Cypress CPLDs.”
Programmable Slew Rate Control
Each output has a programmable configuration bit, which sets
the output slew rate to fast or slow. For designs concerned with
meeting FCC emissions standards the slow edge provides for
lower system noise. For designs requiring very high perfor-
mance the fast edge rate provides maximum system perfor-
mance.
5
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参数对比
与CY37512VP208-66NTI相近的元器件有:CY37512VP208-66NTC、CY37512VP208-83NTC、CY37512P208-125NTC、CY37512P208-83NTI、CY37512P208-100NTI、CY37512P208-100NTC、CY37512P208-83NTC。描述及对比如下:
型号 CY37512VP208-66NTI CY37512VP208-66NTC CY37512VP208-83NTC CY37512P208-125NTC CY37512P208-83NTI CY37512P208-100NTI CY37512P208-100NTC CY37512P208-83NTC
描述 EE PLD, 20ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 20ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 15ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 10ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 15ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 12ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 12ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208 EE PLD, 15ns, 512-Cell, CMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, QFP-208
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208 THERMALLY ENHANCED, PLASTIC, QFP-208
针数 208 208 208 208 208 208 208 208
Reach Compliance Code compli compli compliant compliant compliant compliant compliant compliant
其他特性 512 MACROCELLS 512 MACROCELLS 512 MACROCELLS 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
最大时钟频率 50 MHz 50 MHz 62.5 MHz 83 MHz 62.5 MHz 80 MHz 80 MHz 62.5 MHz
系统内可编程 YES YES YES YES YES YES YES YES
JESD-30 代码 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
JTAG BST YES YES YES YES YES YES YES YES
长度 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm
专用输入次数 1 1 1 1 1 1 1 1
I/O 线路数量 160 160 160 160 160 160 160 160
宏单元数 512 512 512 512 512 512 512 512
端子数量 208 208 208 208 208 208 208 208
最高工作温度 85 °C 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C
组织 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O 1 DEDICATED INPUTS, 160 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FQFP FQFP FQFP FQFP FQFP FQFP FQFP FQFP
封装等效代码 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V 3.3 V 3.3/5,5 V 3.3/5,5 V 3.3/5,5 V 3.3/5,5 V 3.3/5,5 V
可编程逻辑类型 EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD
传播延迟 20 ns 20 ns 15 ns 10 ns 15 ns 12 ns 12 ns 15 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.77 mm 3.77 mm 3.77 mm 3.77 mm 3.77 mm 3.77 mm 3.77 mm 3.77 mm
最大供电电压 3.6 V 3.6 V 3.6 V 5.25 V 5.5 V 5.5 V 5.25 V 5.25 V
最小供电电压 3 V 3 V 3 V 4.75 V 4.5 V 4.5 V 4.75 V 4.75 V
标称供电电压 3.3 V 3.3 V 3.3 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm 28 mm
厂商名称 - - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
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