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CY7C1303BV25-100BZC

QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Cypress(赛普拉斯)
零件包装代码
BGA
包装说明
13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
针数
165
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
最长访问时间
3 ns
其他特性
PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)
100 MHz
I/O 类型
SEPARATE
JESD-30 代码
R-PBGA-B165
JESD-609代码
e0
长度
15 mm
内存密度
18874368 bit
内存集成电路类型
QDR SRAM
内存宽度
18
湿度敏感等级
3
功能数量
1
端子数量
165
字数
1048576 words
字数代码
1000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
1MX18
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装等效代码
BGA165,11X15,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
220
电源
1.5/1.8,2.5 V
认证状态
Not Qualified
座面最大高度
1.4 mm
最小待机电流
2.4 V
最大供电电压 (Vsup)
2.6 V
最小供电电压 (Vsup)
2.4 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
13 mm
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PRELIMINARY
CY7C1303BV25
CY7C1306BV25
18-Mbit Burst of 2 Pipelined SRAM with
QDR™ Architecture
Features
• Separate independent Read and Write data ports
— Supports concurrent transactions
• 167-MHz Clock for high bandwidth
— 2.5 ns Clock-to-Valid access time
• 2-Word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read and
Write Ports (data transferred at 333 MHz) @167 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) account for clock skew
and flight time mismatching
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• 2.5V core power supply with HSTL Inputs and Outputs
• 13 x 15 x 1.4 mm 1.0-mm pitch fBGA package, 165 ball
(11x15 matrix) Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–1.9V)
• JTAG Interface
• Variable Impedance HSTL
Functional Description
The CY7C1303BV25 and CY7C1306BV25 are 2.5V
Synchronous Pipelined SRAMs equipped with QDR™ archi-
tecture. QDR architecture consists of two separate ports to
access the memory array. The Read port has dedicated Data
Outputs to support Read operations and the Write Port has
dedicated Data inputs to support Write operations. Access to
each port is accomplished through a common address bus.
The Read address is latched on the rising edge of the K clock
and the Write address is latched on the rising edge of K clock.
QDR has separate data inputs and data outputs to completely
eliminate the need to “turn-around” the data bus required with
common I/O devices. Accesses to the CY7C1303BV25/
CY7C1306BV25 Read and Write ports are completely
independent of one another. All accesses are initiated
synchronously on the rising edge of the positive input clock
(K). In order to maximize data throughput, both Read and
Write ports are equipped with Double Data Rate (DDR) inter-
faces. Therefore, data can be transferred into the device on
every rising edge of both input clocks (K and K) and out of the
device on every rising edge of the output clock (C and C, or K
and K when in single clock mode) thereby maximizing perfor-
mance while simplifying system design. Each address location
is associated with two 18-bit words (CY7C1303BV25) or two
36-bit words (CY7C1306BV25) that burst sequentially into or
out of the device.
Depth expansion is accomplished with a Port Select input for
each port. Each Port Selects allow each port to operate
independently. 38-05627
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Configurations
CY7C1303BV25 – 1M x 18
CY7C1306BV25 – 512K x 36
Cypress Semiconductor Corporation
Document #: 38-05627 Rev. **
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised July 29, 2004
PRELIMINARY
Logic Block Diagram (CY7C1303BV25)
D
[17:0]
18
Write
Data Reg
Write Add. Decode
Write
Data Reg
Read Add. Decode
CY7C1303BV25
CY7C1306BV25
A
(18:0)
19
Address
Register
Address
Register
19
A
(18:0)
K
K
512Kx18
Memory
Array
512Kx18
Memory
Array
CLK
Gen.
Control
Logic
RPS
C
C
Read Data Reg.
36
Vref
WPS
BWS
0
BWS
1
Control
Logic
18
Reg.
18
Reg.
18
Reg. 18
18
Q
[17:0]
Logic Block Diagram (CY7C1306BV25)
D
[35:0]
36
Write
Data Reg
Write Add. Decode
Write
Data Reg
Read Add. Decode
A
(17:0)
18
Address
Register
Address
Register
18
A
(17:0)
K
K
256Kx36
Memory
Array
256Kx36
Memory
Array
CLK
Gen.
Control
Logic
RPS
C
C
Read Data Reg.
72
Vref
WPS
BWS
0
BWS
1
BWS
2
BWS
3
Control
Logic
36
Reg.
36
Reg.
36
Reg. 36
36
Q
[35:0]
Selection Guide
CY7C1303BV25-167 CY7C1303BV25-133 CY7C1303BV25-100
CY7C1306BV25-167 CY7C1306BV25-133 CY7C1306BV25-100
Maximum Operating Frequency
Maximum Operating Current
167
TBD
133
TBD
100
TBD
Unit
MHz
mA
Document #: 38-05627 Rev. **
Page 2 of 19
PRELIMINARY
Pin Configuration – CY7C1303BV25 (Top View)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TDO
2
Gnd/
144M
Q9
NC
D11
NC
Q12
D13
VREF
NC
NC
Q15
NC
D17
NC
TCK
3
NC/ 36M
D9
D10
Q10
Q11
D12
Q13
VDDQ
D14
Q14
D15
D16
Q16
Q17
A
4
WPS
A
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
A
A
5
BWS
1
NC
A
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
A
A
A
6
K
K
A
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
A
C
C
7
NC
BWS
0
A
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
A
A
A
8
RPS
A
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
A
A
CY7C1303BV25
CY7C1306BV25
9
A
NC
NC
NC
NC
NC
NC
VDDQ
NC
NC
NC
NC
NC
NC
A
10
Gnd/
72M
NC
Q7
NC
D6
NC
NC
VREF
Q4
D3
NC
Q1
NC
D0
TMS
11
NC
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
Pin Configuration - CY7C1306BV25 (Top View)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
NC
Q27
D27
D28
Q29
Q30
D30
NC
D31
Q32
Q33
D33
D34
Q35
TDO
2
Gnd/
288M
Q18
Q28
D20
D29
Q21
D22
VREF
Q31
D32
Q24
Q34
D26
D35
TCK
3
NC/ 72M
D18
D19
Q19
Q20
D21
Q22
VDDQ
D23
Q23
D24
D25
Q25
Q26
A
4
WPS
A
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
A
A
5
BWS
2
BWS
3
A
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
A
A
A
6
K
K
A
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
A
C
C
7
BWS
1
BWS
0
A
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
A
A
A
8
RPS
A
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
A
A
9
NC/36M
D17
D16
Q16
Q15
D14
Q13
VDDQ
D12
Q12
D11
D10
Q10
Q9
A
10
Gnd/
144M
Q17
Q7
D15
D6
Q14
D13
VREF
Q4
D3
Q11
Q1
D9
D0
TMS
11
NC
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
Document #: 38-05627 Rev. **
Page 3 of 19
PRELIMINARY
Pin Definitions
Name
D
[x:0]
I/O
Input-
Synchronous
Description
CY7C1303BV25
CY7C1306BV25
Data input signals, sampled on the rising edge of K and K clocks during valid write
operations.
CY7C1303BV25 – D
[17:0]
CY7C1306BV25 – D
[35:0]
Write Port Select, active LOW.
Sampled on the rising edge of the K clock. When
asserted active, a Write operation is initiated. Deasserting will deselect the Write port.
Deselecting the Write port will cause D
[x:0]
to be ignored.
Byte Write Select 0, 1, 2 and 3 - active LOW.
Sampled on the rising edge of the K and
K clocks during Write operations. Used to select which byte is written into the device
during the current portion of the Write operations.
CY7C1303BV25 - BWS
0
controls D
[8:0]
and BWS
1
controls D
[17:9].
CY7C1306BV25 - BWS
0
controls D
[8:0]
, BWS
1
controls D
[17:9]
, BWS
2
controls D
[26:18]
and BWS
3
controls D
[35:27]
Bytes not written remain unaltered. Deselecting a Byte Write Select will cause the corre-
sponding byte of data to be ignored and not written into the device.
Address Inputs.
Sampled on the rising edge of the K clock during active Read opera-
tions and on the rising edge of K for Write operations. These address inputs are multi-
plexed for both Read and Write operations. Internally, the device is organized as 1M x
18 (2 arrays each of 512K x 18) for CY7C1303BV25 and 512K x 36 (2 arrays each of
256K x 36) for CY7C1306BV25. Therefore, only 19 address inputs are needed to access
the entire memory array of CY7C1303BV25 and 18 address inputs for CY7C1306BV25.
These inputs are ignored when the appropriate port is deselected.
Data Output signals.
These pins drive out the requested data during a Read operation.
Valid data is driven out on the rising edge of both the C and C clocks during Read
operations or K and K when in single clock mode. When the Read port is deselected,
Q
[x:0]
are automatically three-stated.
CY7C1303BV25 - Q
[17:0]
CY7C1306BV25 - Q
[35:0]
Read Port Select, active LOW.
Sampled on the rising edge of positive input clock (K).
When active, a Read operation is initiated. Deasserting will cause the Read port to be
deselected. When deselected, the pending access is allowed to complete and the output
drivers are automatically three-stated following the next rising edge of the K clock. Each
read access consists of a burst of two sequential 18-bit or 36-bit transfers.
Positive Output Clock Input.
C is used in conjunction with C to clock out the Read data
from the device. C and C can be used together to deskew the flight times of various
devices on the board back to the controller. See application example for further details.
Negative Output Clock Input.
C is used in conjunction with C to clock out the Read
data from the device. C and C can be used together to deskew the flight times of various
devices on the board back to the controller. See application example for further details.
Positive Input Clock Input.
The rising edge of K is used to capture synchronous inputs
to the device and to drive out data through Q
[x:0]
when in single clock mode. All accesses
are initiated on the rising edge of K.
Negative Input Clock Input.
K is used to capture synchronous inputs to the device and
to drive out data through Q
[x:0]
when in single clock mode.
Output Impedance Matching Input.
This input is used to tune the device outputs to the
system data bus impedance. Q
[x:0]
output impedance are set to 0.2 x RQ, where RQ is
a resistor connected between ZQ and ground. Alternately, this pin can be connected
directly to V
DD
, which enables the minimum impedance mode. This pin cannot be
connected directly to GND or left unconnected.
TDO pin for JTAG.
TCK pin for JTAG.
TDI pin for JTAG.
TMS pin for JTAG.
Address expansion for 36M.
This pin is not connected to the die and so can be tied to
any voltage level on CY7C1303BV25/CY7C1306BV25.
WPS
Input-
Synchronous
Input-
Synchronous
BWS
0
, BWS
1
,
BWS
2
, BWS
3
A
Input-
Synchronous
Q
[x:0]
Outputs-
Synchronous
RPS
Input-
Synchronous
C
Input-Clock
C
Input-Clock
K
Input-Clock
K
ZQ
Input-Clock
Input
TDO
TCK
TDI
TMS
NC/36M
Output
Input
Input
Input
N/A
Document #: 38-05627 Rev. **
Page 4 of 19
PRELIMINARY
Pin Definitions
(continued)
Name
GND/72M
NC/72M
GND/144M
GND/288M
NC
V
REF
V
DD
V
SS
V
DDQ
I/O
Input
N/A
Input
Input
N/A
Input-
Reference
Power Supply
Ground
Power Supply
Description
CY7C1303BV25
CY7C1306BV25
Address expansion for 72M.
This pin has to be tied to GND on CY7C1303BV25.
Address expansion for 72M.
This pin can be tied to any voltage level on
CY7C1306BV25.
Address expansion for 144M.
This pin has to be tied to GND on
CY7C1303BV25/CY7C1306BV25.
Address expansion for 288M.
This pin has to be tied to GND on CY7C1306BV25.
Not connected to the die.
Can be tied to any voltage level.
Reference Voltage Input.
Static input used to set the reference level for HSTL inputs
and Outputs as well as AC measurement points.
Power supply inputs to the core of the device.
Ground for the device.
Power supply inputs for the outputs of the device.
requested data will be valid 2.5 ns from the rising edge of the
output clock (C and C, or K and K when in single clock mode,
167-MHz device).
Synchronous internal circuitry will automatically three-state
the outputs following the next rising edge of the positive output
clock (C). This will allow for a seamless transition between
devices without the insertion of wait states in a depth
expanded memory.
Write Operations
Write operations are initiated by asserting WPS active at the
rising edge of the positive input clock (K). On the same K clock
rise the data presented to D
[17:0]
is latched and stored into the
lower 18-bit Write Data register provided BWS
[1:0]
are both
asserted active. On the subsequent rising edge of the negative
input clock (K), the address is latched and the information
presented to D
[17:0]
is stored into the Write Data register
provided BWS
[1:0]
are both asserted active. The 36 bits of data
are then written into the memory array at the specified
location.
When deselected, the Write port will ignore all inputs after the
pending Write operations have been completed.
Byte Write Operations
Byte Write operations are supported by the CY7C1303BV25.
A Write operation is initiated as described in the Write
Operation section above. The bytes that are written are deter-
mined by BWS
0
and BWS
1
which are sampled with each set
of 18-bit data word. Asserting the appropriate Byte Write
Select input during the data portion of a write will allow the data
being presented to be latched and written into the device.
Deasserting the Byte Write Select input during the data portion
of a write will allow the data stored in the device for that byte
to remain unaltered. This feature can be used to simplify
Read/Modify/Write operations to a Byte Write operation.
Single Clock Mode
The CY7C1303BV25 can be used with a single clock mode. In
this mode the device will recognize only the pair of input clocks
(K and K) that control both the input and output registers. This
operation is identical to the operation if the device had zero
skew between the K/K and C/C clocks. All timing parameters
remain the same in this mode. To use this mode of operation,
Introduction
Functional Overview
The CY7C1303BV25/CY7C1306BV25 are synchronous
pipelined Burst SRAM equipped with both a Read port and a
Write port. The Read port is dedicated to Read operations and
the Write port is dedicated to Write operations. Data flows into
the SRAM through the Write port and out through the Read
port. These devices multiplex the address inputs in order to
minimize the number of address pins required. By having
separate Read and Write ports, this architecture completely
eliminates the need to “turn-around” the data bus and avoids
any possible data contention, thereby simplifying system
design. 38-05627Each access consists of two 18-bit data
transfers in the case of CY7C1303BV25, and two 36-bit data
transfers in the case of CY7C1306BV25, in one clock cycle.
Accesses for both ports are initiated on the rising edge of the
Positive Input Clock (K). All synchronous input timing is refer-
enced from the rising edge of the input clocks (K and K) and
all output timings are referenced to rising edge of output clocks
(C and C or K and K when in single clock mode).
All synchronous data inputs (D
[x:0]
) pass through input
registers controlled by the rising edge of the input clocks (K
and K). All synchronous data outputs (Q
[x:0]
) pass through
output registers controlled by the rising edge of the output
clocks (C and C, or K and K when in single clock mode).
All synchronous control (RPS, WPS, BWS
[x:0]
) inputs pass
through input registers controlled by the rising edge of input
clocks (K and K).
The following descriptions take CY7C1303BV25 as an
example. The same basic descriptions apply to
CY7C1306BV25.
Read Operations
The CY7C1303BV25 is organized internally as 2 arrays of
512K x 18. Accesses are completed in a burst of two
sequential 18-bit data words. Read operations are initiated by
asserting RPS active at the rising edge of the positive input
clock (K). The address is latched on the rising edge of the K
clock. Following the next K clock rise the corresponding lower
order 18-bit word of data is driven onto the Q
[17:0]
using C as
the output timing reference. On the subsequent rising edge of
C the higher order data word is driven onto the Q
[17:0]
. The
Document #: 38-05627 Rev. **
Page 5 of 19
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参数对比
与CY7C1303BV25-100BZC相近的元器件有:CY7C1306BV25-100BZC、CY7C1306BV25-133BZC、CY7C1303BV25-133BZC。描述及对比如下:
型号 CY7C1303BV25-100BZC CY7C1306BV25-100BZC CY7C1306BV25-133BZC CY7C1303BV25-133BZC
描述 QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
零件包装代码 BGA BGA BGA BGA
包装说明 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
针数 165 165 165 165
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3 ns 3 ns 3 ns 3 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
最大时钟频率 (fCLK) 100 MHz 100 MHz 133 MHz 133 MHz
I/O 类型 SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 代码 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609代码 e0 e0 e0 e0
长度 15 mm 15 mm 15 mm 15 mm
内存密度 18874368 bit 18874368 bit 18874368 bit 18874368 bit
内存集成电路类型 QDR SRAM QDR SRAM QDR SRAM QDR SRAM
内存宽度 18 36 36 18
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端子数量 165 165 165 165
字数 1048576 words 524288 words 524288 words 1048576 words
字数代码 1000000 512000 512000 1000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C
组织 1MX18 512KX36 512KX36 1MX18
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA
封装等效代码 BGA165,11X15,40 BGA165,11X15,40 BGA165,11X15,40 BGA165,11X15,40
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 220 220 220 220
电源 1.5/1.8,2.5 V 1.5/1.8,2.5 V 1.5/1.8,2.5 V 1.5/1.8,2.5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.4 mm 1.4 mm 1.4 mm 1.4 mm
最小待机电流 2.4 V 2.4 V 2.4 V 2.4 V
最大供电电压 (Vsup) 2.6 V 2.6 V 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 13 mm 13 mm 13 mm 13 mm
是否无铅 含铅 含铅 - 含铅
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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