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CY7C1324-100AC

Cache SRAM, 128KX18, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Cypress(赛普拉斯)
零件包装代码
QFP
包装说明
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数
100
Reach Compliance Code
not_compliant
ECCN代码
3A991.B.2.A
最长访问时间
8 ns
其他特性
PIPELINED ARCHITECTURE
I/O 类型
COMMON
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
内存密度
2359296 bit
内存集成电路类型
CACHE SRAM
内存宽度
18
湿度敏感等级
3
功能数量
1
端子数量
100
字数
131072 words
字数代码
128000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128KX18
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装等效代码
QFP100,.63X.87
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
225
电源
2.5/3.3,3.3 V
认证状态
Not Qualified
座面最大高度
1.6 mm
最大待机电流
0.01 A
最小待机电流
3.14 V
最大压摆率
0.3 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
宽度
14 mm
文档预览
CY7C1324
3.3V 128K x 18 Synchronous
Cache RAM
Features
• Supports 117-MHz microprocessor cache systems with
zero wait states
• 128K by 18 common I/O
• Fast clock-to-output times
— 7.5 ns (117 MHz)
• Two-bit wrap-around counter supporting either inter-
leaved or linear burst sequence
• Separate processor and controller address strobes pro-
vides direct interface with the processor and external
cache controller
• Synchronous self-timed write
• Asynchronous output enable
• I/Os capable of 2.5–3.3V operation
• JEDEC-standard pinout
• 100-pin TQFP packaging
• ZZ “sleep” mode
Functional Description
The CY7C1324 is a 3.3V, 128K by 18 synchronous cache
RAM designed to interface with high-speed microprocessors
with minimum glue logic. Maximum access delay from clock
rise is 7.5 ns (117-MHz version). A 2-bit on-chip counter cap-
tures the first address in a burst and increments the address
automatically for the rest of the burst access.
The CY7C1324 allows both interleaved or linear burst se-
quences, selected by the MODE input pin. A HIGH input on
MODE selects an interleaved burst sequence, while a LOW
selects a linear burst sequence. Burst accesses can be initiat-
ed with the Processor Address Strobe (ADSP) or the cache
Controller Address Strobe (ADSC) inputs. Address advance-
ment is controlled by the Address Advancement (ADV) input.
A synchronous self-timed write mechanism is provided to sim-
plify the write interface. A synchronous chip enable input and
an asynchronous output enable input provide easy control for
bank selection and output three-state control.
Logic Block Diagram
CLK
ADV
ADSC
ADSP
A
[16:0]
GW
BWE
BW
1
MODE
(A
0
,A
1
) 2
BURST Q
0
CE COUNTER
Q
1
CLR
Q
ADDRESS
CE REGISTER
D
15
17
17
15
128K X 18
MEMORY
ARRAY
D
Q
DQ[15:8]
BYTEWRITE
REGISTERS
Q
DQ[7:0]
BYTEWRITE
REGISTERS
D
BW
0
CE
1
CE
2
CE
3
D
ENABLE Q
CE REGISTER
CLK
18
18
INPUT
REGISTERS
CLK
OE
ZZ
SLEEP
CONTROL
DQ
[15:0]
DP
[1:0]
Pin
Selection Guide
7C1324–117
Maximum Access Time (ns)
Maximum Operating Current (mA)
Maximum Standby Current (mA)
Pentium is a registered trademark of Intel Corporation.
7.5
350
1.0
7C1324–100
8.0
325
1.0
7C1324–80
8.5
300
1.0
7C1324–50
11.0
250
1.0
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
August 4, 1999
CY7C1324
Pin Configuration
100-Lead TQFP
OE
ADSC
BWS
1
BWS
0
ADSP
ADV
84
83
BWE
V
DD
CE
1
CE
2
CE
3
CLK
V
SS
GW
NC
NC
A6
A7
A
8
82
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
NC
NC
NC
V
DDQ
V
SS
NC
NC
DQ
8
DQ
9
V
SS
V
DDQ
DQ
10
DQ
11
NC
V
DD
NC
V
SS
DQ
12
DQ
13
V
DDQ
V
SS
DQ
14
DQ
15
DP
1
NC
V
SS
V
DDQ
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
100
81
A
9
80
79
78
77
76
75
74
73
72
71
70
69
A
10
NC
NC
V
DDQ
V
SS
NC
DP
0
DQ
7
DQ
6
V
SS
V
DDQ
DQ
5
DQ
4
V
SS
NC
V
DD
ZZ
DQ
3
DQ
2
V
DDQ
V
SS
DQ
1
DQ
0
NC
NC
V
SS
V
DDQ
NC
NC
NC
BYTE0
CY7C1324
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
NC
BYTE1
MODE
A
5
A
4
A
3
A
2
A
1
A
0
DNU
DNU
A
11
A
12
V
SS
DNU
DNU
2
V
DD
A
15
A
16
A
13
A
14
CY7C1324
Functional Description
(continued)
Single Write Accesses Initiated by ADSP
This access is initiated when the following conditions are sat-
isfied at clock rise: (1) CE
1
, CE
2
, and CE
3
are all asserted
active, and (2) ADSP is asserted LOW. The addresses pre-
sented are loaded into the address register and the burst
counter/control logic and delivered to the RAM core. The write
inputs (GW, BWE, and BWS
[1:0]
) are ignored during this first
clock cycle. If the write inputs are asserted active (see Write
Cycle Descriptions table for appropriate states that indicate a
write) on the next clock rise, the appropriate data will be
latched and written into the device. Byte writes are allowed.
During byte writes, BWS
0
controls DQ
[7:0]
and DP
0
while
BWS
1
controls DQ
[15:8]
and DP
1
. All I/Os are three-stated dur-
ing a byte write. Since these are common I/O devices, the
asynchronous OE input signal must be deasserted and the
I/Os must be three-stated prior to the presentation of data to
DQ
[15:0]
and DP
[1:0]
. As a safety precaution, the data lines are
three-stated once a write cycle is detected, regardless of the
state of OE.
Single Write Accesses Initiated by ADSC
This write access is initiated when the following conditions are
satisfied at clock rise: (1) CE
1
, CE
2
, and CE
3
are all asserted
active, (2) ADSC is asserted LOW, (3) ADSP is deasserted
HIGH, and (4) the write input signals (GW, BWE, and BWS
[1:0]
)
indicate a write access. ADSC is ignored if ADSP is active LOW.
The addresses presented are loaded into the address register,
burst counter/control logic and delivered to the RAM core. The
information presented to DQ
[15:0]
and DP
[1:0]
will be written
into the specified address location. Byte writes are allowed,
with BWS
0
controlling DQ
[7:0]
and DP
0
while BWS
1
controlling
DQ
[15:8]
and DP
1
. All I/Os are three-stated when a write is
detected, even a byte write. Since these are common I/O de-
vices, the asynchronous OE input signal must be deasserted
and the I/Os must be three-stated prior to the presentation of
data to DQ
[15:0]
and DP
[1:0]
. As a safety precaution, the data
lines are three-stated once a write cycle is detected, regard-
less of the state of OE.
Single Read Accesses
A single read access is initiated when the following conditions
are satisfied at clock rise: (1) CE
1
, CE
2
, and CE
3
are all as-
serted active, and (2) ADSP or ADSC is asserted LOW (if the
access is initiated by ADSC, the write inputs must be deassert-
ed during this first cycle). The address presented to the ad-
dress inputs is latched into the Address Register, burst counter
/control logic and presented to the memory core. If the OE
input is asserted LOW, the requested data will be available at
the data outputs a maximum to t
CDV
after clock rise. ADSP is
ignored if CE
1
is HIGH.
Burst Sequences
This family of devices provide a 2-bit wrap around burst
counter inside the SRAM. The burst counter is fed by A
[1:0]
,
and can follow either a linear or interleaved burst order. The
burst order is determined by the state of the MODE input. A
LOW on MODE will select a linear burst sequence. A HIGH on
MODE will select an interleaved burst order. Leaving MODE
unconnected will cause the device to default to a interleaved
burst sequence.
Table 1. Counter Implementation for the Intel
Pentium®/80486 Processor’s Sequence
First
Address
A
X + 1
, A
x
00
01
10
11
Second
Address
A
X + 1
, A
x
01
00
11
10
Third
Address
A
X + 1
, A
x
10
11
00
01
Fourth
Address
A
X + 1
, A
x
11
10
01
00
Table 2. Counter Implementation for a Linear Sequence
First
Address
A
X + 1
, A
x
00
01
10
11
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting a HIGH
input on ZZ places the SRAM in a power conservation “sleep”
mode. Two clock cycles are required to enter into or exit from
this “sleep” mode. While in this mode, data integrity is guaran-
teed. Accesses pending when entering the “sleep” mode are
not considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE
1
, CE
2
, CE
3
, ADSP, and ADSC must re-
main inactive for the duration of t
ZZREC
after the ZZ input re-
turns low
Second
Address
A
X + 1
, A
x
01
10
11
00
Third
Address
A
X + 1
, A
x
10
11
00
01
Fourth
Address
A
X + 1
, A
x
11
00
01
10
3
CY7C1324
Cycle Description Table
[1, 2, 3]
Cycle Description
Deselected Cycle, Power-down
Deselected Cycle, Power-down
Deselected Cycle, Power-down
Deselected Cycle, Power-down
Deselected Cycle, Power-down
SNOOZE MODE, Power-down
READ Cycle, Begin Burst
READ Cycle, Begin Burst
WRITE Cycle, Begin Burst
READ Cycle, Begin Burst
READ Cycle, Begin Burst
READ Cycle, Continue Burst
READ Cycle, Continue Burst
READ Cycle, Continue Burst
READ Cycle, Continue Burst
WRITE Cycle, Continue Burst
WRITE Cycle, Continue Burst
READ Cycle, Suspend Burst
READ Cycle, Suspend Burst
READ Cycle, Suspend Burst
READ Cycle, Suspend Burst
WRITE Cycle, Suspend Burst
WRITE Cycle, Suspend Burst
ADD
Used
None
None
None
None
None
None
External
External
External
External
External
Next
Next
Next
Next
Next
Next
Current
Current
Current
Current
Current
Current
CE
1
H
L
L
L
X
X
L
L
L
L
L
X
X
H
H
X
H
X
X
H
H
X
H
CE
3
X
X
H
X
X
X
L
L
L
L
L
X
X
X
X
X
X
X
X
X
X
X
X
CE
2
X
L
X
L
X
X
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
ZZ
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
ADSP
X
L
L
H
H
X
L
L
H
H
H
H
H
X
X
H
X
H
H
X
X
H
X
ADSP
L
X
X
L
L
X
X
X
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
ADV
X
X
X
X
X
X
X
X
X
X
X
L
L
L
L
L
L
H
H
H
H
H
H
WE
X
X
X
X
X
X
X
X
L
H
H
H
H
H
H
L
L
H
H
H
H
L
L
OE
X
X
X
X
X
X
L
H
X
L
H
L
H
L
H
X
X
L
H
L
H
X
X
CLK
L-H
L-H
L-H
L-H
L-H
X
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
DQ
High-Z
High-Z
High-Z
High-Z
High-Z
HIGH-Z
Q
High-Z
D
Q
High-Z
Q
High-Z
Q
High-Z
D
D
Q
High-Z
Q
High-Z
D
D
Notes:
1. X=”Don't Care”, 1=Logic HIGH, 0=Logic LOW.
2. The SRAM always initiates a read cycle when ADSP asserted, regardless of the state of GW, BWE, or BWS
[1:0].
Writes may occur only on subsequent clocks
after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to three-state. OE
is a “Don't Care” for the remainder of the write cycle.
3. OE is asynchronous and is not sampled with the clock rise. During a read cycle DQ=High-Z when OE is inactive, and DQ=data when OE is active.
4
CY7C1324
Pin Descriptions
TQFP Pin
Number
85
Name
ADSC
I/O
Input-
Synchronous
Input-
Synchronous
Description
Address Strobe from Controller, sampled on the rising edge of CLK. When asserted
LOW, A
[16:0]
is captured in the address registers. A
[1:0]
are also loaded into the burst
counter. When ADSP and ADSC are both asserted, only ADSP is recognized.
Address Strobe from Processor, sampled on the rising edge of CLK. When asserted
LOW, A
[16:0]
is captured in the address registers. A
[1:0]
are also loaded into the burst
counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP
is ignored when CE
1
is deasserted HIGH.
A
1
, A
0
Address Inputs, These inputs feed the on-chip burst counter as the LSBs as
well as being used to access a particular memory location in the memory array.
Address Inputs used in conjunction with A
[1:0]
to select one of the 128K address
locations. Sampled at the rising edge of the CLK, if CE
1
, CE
2
, and CE
3
are sampled
active, and ADSP or ADSC is active LOW.
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes.
Sampled on the rising edge. BWS
0
controls DQ
[7:0]
and DP
0
, BWS
1
controls DQ
[15:8]
and DP
1
. See Write Cycle Descriptions table for further details.
Advance Input used to advance the on-chip address counter. When LOW the internal
burst counter is advanced in a burst sequence. The burst sequence is selected using
the MODE input.
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal
must be asserted LOW to conduct a byte write.
Global Write Input, active LOW. Sampled on the rising edge of CLK. This signal is used
to conduct a global write, independent of the state of BWE and BWS
[1:0]
. Global writes
override byte writes.
Clock Input. Used to capture all synchronous inputs to the device.
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in con-
junction with CE
2
and CE
3
, to select/deselect the device. CE
1
gates ADSP.
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in con-
junction with CE
1
and CE
3
to select/deselect the device.
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in con-
junction with CE
1
and CE
2
to select/deselect the device.
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are
three-stated, and act as input data pins.
Snooze Input. Active HIGH asynchronous. When HIGH, the device enters a low-power
standby mode in which all other inputs are ignored, but the data in the memory array
is maintained. Leaving ZZ floating or NC will default the device into an active state.
Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved
burst order. Pulled LOW selects the linear burst order. When left floating or NC, defaults
to interleaved burst order.
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is
triggered by the rising edge of CLK. As outputs, they deliver the data contained in the
memory location specified by A
[17:0]
during the previous clock rise of the read cycle.
The direction of the pins is controlled by OE in conjunction with the internal control
logic. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ
[15:0]
and DP
[1:0]
are placed in a three-state condition. The outputs are automatically
three-stated when a WRITE cycle is detected.
Bidirectional Data Parity lines. These behave identical to DQ
[15:0]
described above.
These signals can be used as parity bits for bytes 0 and 1 respectively.
Power supply inputs to the core of the device. Should be connected to 3.3V power
supply.
84
ADSP
36, 37
49–44,
80–82, 99,
100,
32–35
94, 93
A
[1:0]
A
[16:2]
Input-
Synchronous
Input-
Synchronous
BWS
[1:0]
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-Clock
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-
Asynchronous
Input-
Asynchronous
-
83
ADV
87
88
BWE
GW
89
98
97
92
86
CLK
CE
1
CE
2
CE
3
OE
64
ZZ
31
MODE
23, 22, 19,
18, 13, 12,
9, 8, 73,
72, 69, 68,
63, 62, 59,
58
74, 24
15, 41, 65,
91
DQ
[15:0]
I/O-
Synchronous
DP
[1:0]
V
DD
I/O-
Synchronous
Power Supply
5
查看更多>
参数对比
与CY7C1324-100AC相近的元器件有:CY7C1324L-117AC、CY7C1324L-80AC、CY7C1324L-100AC。描述及对比如下:
型号 CY7C1324-100AC CY7C1324L-117AC CY7C1324L-80AC CY7C1324L-100AC
描述 Cache SRAM, 128KX18, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX18, 7.5ns, CMOS, PQFP100, PLASTIC, TQFP-100 Cache SRAM, 128KX18, 8.5ns, CMOS, PQFP100, PLASTIC, TQFP-100 Cache SRAM, 128KX18, 8ns, CMOS, PQFP100, PLASTIC, TQFP-100
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 QFP QFP QFP QFP
包装说明 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 PLASTIC, TQFP-100 PLASTIC, TQFP-100 PLASTIC, TQFP-100
针数 100 100 100 100
Reach Compliance Code not_compliant compli compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 8 ns 7.5 ns 8.5 ns 8 ns
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609代码 e0 e0 e0 e0
长度 20 mm 20 mm 20 mm 20 mm
内存密度 2359296 bit 2359296 bi 2359296 bit 2359296 bit
内存集成电路类型 CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
内存宽度 18 18 18 18
功能数量 1 1 1 1
端子数量 100 100 100 100
字数 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C
组织 128KX18 128KX18 128KX18 128KX18
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP
封装等效代码 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.01 A 0.001 A 0.001 A 0.001 A
最小待机电流 3.14 V 3.14 V 3.14 V 3.14 V
最大压摆率 0.3 mA 0.325 mA 0.275 mA 0.3 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 14 mm 14 mm 14 mm 14 mm
厂商名称 Cypress(赛普拉斯) - Cypress(赛普拉斯) Cypress(赛普拉斯)
Base Number Matches - 1 1 1
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