Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:AMD(超微)
厂商官网:http://www.amd.com
下载文档型号 | D8231A-3 | MD8231A-3B | ID8231A-3 | ID8231A-8 | D8231A-8 | MD8231A-8B | D8231A |
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描述 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
桶式移位器 | NO | NO | NO | NO | NO | NO | NO |
边界扫描 | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 3.125 MHz | 3.125 MHz | 3.125 MHz | 2.08 MHz | 2.08 MHz | 2.08 MHz | 4 MHz |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 70 °C | 125 °C | 85 °C | 85 °C | 70 °C | 125 °C | 70 °C |
最低工作温度 | - | -55 °C | -40 °C | -40 °C | - | -55 °C | - |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm |
最大压摆率 | 95 mA | 100 mA | 95 mA | 95 mA | 95 mA | 100 mA | 95 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
温度等级 | COMMERCIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR |
最大供电电压 | 5.25 V | - | 5.5 V | 5.5 V | 5.25 V | - | 5.25 V |
最小供电电压 | 4.75 V | - | 4.5 V | 4.5 V | 4.75 V | - | 4.75 V |