DAH SERIES
SLIDE AUTO INSERTING “IC” TYPE
Interconnect
x
Features
• Same size with IC can be assembled by any automatic
IC inserter.
• Molded 0.300" integrated circuit packing outline allowing
automatic insertion.
• Smaller size makes better heat convection during PC
board wave soldering.
• Top tape sealed to withstand wave soldering, board
washing.
• All materials are UL 94V-0 grade fire retardant plastics.
• Twin contact designed to ensure stable contact.
• Gold plated contact to ensure low contact resistance and
tin plated terminal to prevent contamination during
soldering (
tin/gold
).
x
Specifications
1
. ELECTRICAL
1-1 Contact Rating
- switching
- non-switching
1-2 Contact Resistance
- initial
- after life test
1-3 Insulation Resistance
1-4 Dielectric Strength
1-5 Capacitance between
adjacent switches
: 25 mA, 24 VDC
: 100 mA
:
:
:
:
50 mΩ max.
100 mΩ max.
1000 MΩ min. at 100 VDC
500 VDC for 1 min.
2
. MECHANICAL and ENVIRONMENTAL
2-1 Temperature rating
- operating
- storage
2-2 Operating force
2-3 Mechanical life
2-4 Humidity
2-5 Vibration
2-6 Solderability
2-7 Soldering temperature
: -25°C to +70°C-
: -40°C to +85°C
: 800 g max.
: 2000 operations
: 95% RH, 40°C for 96 hours
: Per MIL-STD-202F, method 204D
: 95% coverage after 230°C
+/- 5°C for 5 sec.
: 260°C max. for 5 seconds
: 5pF max.
x
Dimensions and circuitry
DIMENSION A
Position
A
2
6.68
3
9.42
4
11.96
5
14.5
6
17.04
7
19.58
8
22.12
10
27.20
12
32.28
3.4
±
0.3
(0.134)
6.4
±
0.3
(0.252)
(E) TYPE
1.0
±
0.2
2.54
±
0.5
0.40
±
0.2
(0.01
0)
Unit: mm (inch)
6.4
±
0.3
(L) TYPE
2
3
4
5
6
7
8
ON
(0.252)
1
A
±
0.3
8.5
±
0.3
(0.379)
7.62
±
0.3
(0.300)
(0.016)
0.25
±
0.5
(0.100)
0.5
±
0.1
(0.020)
2.54x (P-1)
±
0.4
(0.100x P-1))
12
3.5
±
0.3
(0.138)
(0.039)
4.3
±
0.3
(0.169)
(0.271) (0.371) (0.471) (0.571) (0.671) (0.771) (0.871) (1.071) (1.271)
Microchip MCU
