Line Driver, 1 Func, 1 Driver, BIPolar, 5 X 7 MM, ROHS COMPLIANT, MLP-38
厂商名称:Device Engineering Incorporated
器件标准:
下载文档型号 | DEI1271A-MMS-G | DEI1271A-MES-G |
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描述 | Line Driver, 1 Func, 1 Driver, BIPolar, 5 X 7 MM, ROHS COMPLIANT, MLP-38 | Line Driver, 1 Func, 1 Driver, BIPolar, 5 X 7 MM, ROHS COMPLIANT, MLP-38 |
是否无铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 |
厂商名称 | Device Engineering Incorporated | Device Engineering Incorporated |
零件包装代码 | DFN | DFN |
包装说明 | HVQCCN, LCC38,.2X.28,20 | HVQCCN, LCC38,.2X.28,20 |
针数 | 38 | 38 |
Reach Compliance Code | compliant | compliant |
ECCN代码 | EAR99 | EAR99 |
差分输出 | YES | YES |
驱动器位数 | 2 | 2 |
高电平输入电流最大值 | 0.0001 A | 0.0001 A |
输入特性 | STANDARD | STANDARD |
接口集成电路类型 | LINE DRIVER | LINE DRIVER |
接口标准 | ARINC 429 | ARINC 429 |
JESD-30 代码 | R-PQCC-N38 | R-PQCC-N38 |
JESD-609代码 | e4 | e4 |
长度 | 7 mm | 7 mm |
湿度敏感等级 | 1 | 1 |
标称负供电电压 | -15 V | -15 V |
功能数量 | 2 | 2 |
端子数量 | 38 | 38 |
最高工作温度 | 125 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C |
最小输出摆幅 | 9 V | 9 V |
输出特性 | 3-STATE | 3-STATE |
输出极性 | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN |
封装等效代码 | LCC38,.2X.28,20 | LCC38,.2X.28,20 |
封装形状 | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 |
电源 | +-10/+-15 V | +-10/+-15 V |
认证状态 | Not Qualified | Not Qualified |
座面最大高度 | 1.05 mm | 1.05 mm |
最大压摆率 | 6 mA | 6 mA |
最大供电电压 | 16.5 V | 16.5 V |
最小供电电压 | 9.5 V | 9.5 V |
标称供电电压 | 15 V | 15 V |
表面贴装 | YES | YES |
技术 | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | OTHER |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 |
宽度 | 5 mm | 5 mm |