Preliminary Information
DIM1600ECM17-A000
IGBT Chopper Module
DS6069-1 September 2011 (LN28672)
FEATURES
10µs Short Circuit Withstand
High Thermal Cycling Capability
Soft Punch Through Silicon
Isolated AlSiC Base with AlN Substrates
Lead Free Construction
KEY PARAMETERS
V
CES
V
CE(sat)
* (typ)
I
C
(max)
I
C(PK)
(max)
1700V
2.7V
1600A
3200A
* Measured at the auxiliary terminals
APPLICATIONS
9(C)
3(C)
2(G)
7(C)
5(A)
Motor Controllers
Power Supplies
Choppers
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 1200V to
6500V and currents up to 2400A.
The DIM1600ECM17-A000 is a 1700V, soft punch
through n-channel enhancement mode, insulated gate
bipolar transistor (IGBT) chopper module. The IGBT
has a wide reverse bias safe operating area (RBSOA)
plus 10μs short circuit withstand. This device is
optimised for traction drives and other applications
requiring high thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety
.
1(E)
8(E)
6(E)
4(K)
Fig. 1 Circuit configuration
ORDERING INFORMATION
Order As:
DIM1600ECM17-A000
Note: When ordering, please use the complete part
number
Outline type code: E
(See Fig. 11 for further information)
Fig. 2 Package
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
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DIM1600ECM17-A000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In
extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.
Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect
device reliability.
T
case
= 25°C unless stated otherwise
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
It
V
isol
Q
PD
2
Parameter
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Diode I t value (IGBT arm)
Diode I t value (Diode arm)
Isolation voltage – per module
Partial discharge – per module
2
2
Test Conditions
V
GE
= 0V
Max.
1700
±20
Units
V
V
A
A
W
kA s
kA s
V
pC
2
2
T
case
= 75°C
1ms, T
case
= 110°C
T
case
= 25°C, T
j
= 150°C
V
R
= 0, t
p
= 10ms, T
j
= 125ºC
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
IEC1287, V
1
= 1800V, V
2
= 1300V, 50Hz RMS
1600
3200
13900
480
480
4000
10
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
Baseplate material:
Creepage distance:
Clearance:
CTI (Comparative Tracking Index):
Symbol
R
th(j-c)
R
th(j-c)
R
th(c-h)
T
j
T
stg
Parameter
Thermal resistance – transistor (per arm)
Thermal resistance – diode (IGBT arm)
Thermal resistance – diode (Diode arm)
Thermal resistance – case to heatsink
(per module)
Junction temperature
Storage temperature range
AlN
AlSiC
33mm
20mm
>600
Test Conditions
Continuous dissipation –
junction to case
Continuous dissipation –
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting – M6
Screw torque
Electrical connections – M4
Electrical connections – M8
Min
-
-
-
-
-
-
-40
-
-
-
Typ.
-
-
-
-
-
-
-
-
-
-
Max
9
20
20
6
150
125
125
5
2
10
Units
°C/kW
°C/kW
°C/kW
°C/kW
°C
°C
°C
Nm
Nm
Nm
2/8
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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DIM1600ECM17-A000
ELECTRICAL CHARACTERISTICS
T
case
= 25°C unless stated otherwise.
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
†
Parameter
Collector cut-off current
Test Conditions
V
GE
= 0V, V
CE
= V
CES
V
GE
= 0V, V
CE
= V
CES
, T
case
= 125°C
Min
Typ
Max
2
50
8
Units
mA
mA
μA
V
V
V
A
A
Gate leakage current
Gate threshold voltage
Collector-emitter saturation
voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
(IGBT arm)
Diode forward voltage
(Diode arm)
Diode forward voltage
(IGBT arm)
Diode forward voltage
(Diode arm)
Input capacitance
Gate charge
Reverse transfer capacitance
Module inductance – IGBT arm
Internal resistance – IGBT arm
V
GE
= ± 20V, V
CE
= 0V
I
C
= 80mA, V
GE
= V
CE
V
GE
= 15V, I
C
= 1600A
V
GE
= 15V, I
C
= 1600A, T
j
= 125°C
DC
t
p
= 1ms
I
F
= 1600A
2.2
2.3
I
F
= 1600A, T
j
= 125°C
2.3
V
CE
= 25V, V
GE
= 0V, f = 1MHz
±15V
V
CE
= 25V, V
GE
= 0V, f = 1MHz
15
140
T
j
= 125°C, V
CC
= 1000V
t
p
≤ 10μs, V
GE
≤ 15V
V
CE (max)
= V
CES
– L x dI/dt
IEC 60747-9
*
4.5
5.5
2.7
3.4
1600
3200
2.2
6.5
3.2
4.0
2.5
2.5
2.6
2.6
V
V
V
V
nF
μC
nF
nH
μ
V
F
†
C
ies
Q
g
C
res
L
M
R
INT
120
18
SC
Data
Short circuit current, I
SC
6400
A
Note:
†
Measured at the auxiliary terminals
*
L is the circuit inductance + L
M
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
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DIM1600ECM17-A000
ELECTRICAL CHARACTERISTICS
T
case
= 25°C unless stated otherwise
Symbol
t
d(off)
t
f
E
OFF
t
d(on)
t
r
E
ON
Q
rr
I
rr
E
rec
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse recovery current
Diode reverse recovery energy
I
F
= 1600A
V
CE
= 900V
dI
F
/dt = 8000A/μs
I
C
= 1600A
V
GE
= ±15V
V
CE
= 900V
R
G(ON)
= 1.5
R
G(OFF)
= 1.5
L
S
~ 100nH
500
300
200
300
400
1000
200
mJ
ns
ns
mJ
μC
A
mJ
Test Conditions
Min
Typ.
1400
200
Max
Units
ns
ns
T
case
= 125°C unless stated otherwise
Symbol
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse recovery current
Diode reverse recovery energy
Test Conditions
Min
Typ.
1600
Max
Units
ns
ns
mJ
ns
ns
mJ
μC
A
mJ
t
d(off)
t
f
E
OFF
t
d(on)
t
r
E
ON
Q
rr
I
rr
E
rec
I
C
= 1600A
V
GE
= ±15V
V
CE
= 900V
R
G(ON)
= 1.5
R
G(OFF)
= 1.5
L
S
~ 100nH
250
650
400
250
600
I
F
= 1600A
V
CE
= 900V
dI
F
/dt = 7000A/μs
600
1050
400
4/8
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
DIM1600ECM17-A000
Fig. 3 Typical output characteristics
Fig. 4 Typical output characteristics
Fig. 5 Typical switching energy vs collector current
Fig. 6 Typical switching energy vs gate resistance
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
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