型号
- 型号
- 关键词
Digital Signal Processors & Controllers - DSP, DSC Digital Media SOC
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | DM355SZCE135 | DM355SZCEA216 | DM355SZCE270 | TMS320DM355ZCEA135 | TMS320DM355ZCE135 | TMS320DM355ZCE216 |
|---|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC Digital Media SOC | Digital Signal Processors & Controllers - DSP, DSC Digital Media SOC | Digital Signal Processors & Controllers - DSP, DSC Digital Media SOC | Digital Signal Processors & Controllers - DSP, DSC Digital Media SOC | Digital Signal Processors & Controllers - DSP, DSC Digital Media SOC | Digital Signal Processors & Controllers - DSP, DSC Digital Media System on Chip |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 |
| 针数 | 337 | 337 | 337 | 337 | 337 | 337 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| JESD-30 代码 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 337 | 337 | 337 | 337 | 337 | 337 |
| 最高工作温度 | 85 °C | 100 °C | 85 °C | 100 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 |
| 座面最大高度 | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm |
| 最大供电电压 | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V |
| 最小供电电压 | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V |
| 标称供电电压 | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
