DN(X)
diode terminator network
EU
features
•
•
•
•
Fast reverse recovery time
•
Fast turn on time
Low capacitance
•
SMD packages
16 kV IEC61000-4-2 capable
Products with lead-free terminations meet EU RoHS
and China RoHS requirements
circuit
protection
applications
•
Signal termination
•
Signal conditioning
dimensions and construction
S03
L
P
Bonding
Wire
Die
Pad
W
Molded
Resin
Si
Wafer
Lead
d
Molded
Resin
W
Die
Si Pad
Wafer
•
ESD suppression
•
Transient suppression
S14
L
p
Bonding
Wire
Lead
d
Package Total
Code Power
S03
S14
S06
N08
225mw
225mw
225mw
400mw
1200mw
1000mw
1000mw
Pins
3
4
6
8
20
20
24
Dimensions
inches
(mm)
L ±0.2 W ±0.2 p ±0.1
Pkg Ht
d ±0.05
±0.2
.115
(2.92)
.115
(2.92)
.115
(2.92)
.190
(4.83)
.500
(12.7)
.341
(8.66)
.341
(8.66)
.091
(2.30)
.091
(2.30)
.110
(2.80)
.236
(5.99)
.408
(10.36)
.236
(5.99)
.236
(5.99)
.075
(1.91)
.075
(1.91)
.037
(0.95)
.050
(1.27)
.050
(1.27)
.025
(0.635)
.025
(0.635)
.037
(0.95)
.037
(0.95)
.037
(0.95)
.063
(1.60)
.084
(2.40)
.063
(1.60)
.063
(1.60)
.017
(0.43)
.017
(0.43)
.017
(0.43)
.016
(0.41)
.016
(0.41)
.010
(0.25)
.010
(0.25)
S06
L
p
N08, W20,
Q20, Q24
Bonding
Wire
Lead
L
Bonding
Wire
d
p
Lead
W20
Q20
Q24
W
Si
Wafer
Molded
Resin
W
d
Die
Pad
Die
Pad
Si
Wafer
Molded
Resin
circuit schematic
1
1
DNA:
20 pins
DN2:
20 pins
1
DN3:
6 pins
1
DN4:
4 pins
1
DN5:
24 pins
1
DN6:
8 pins
1
DN7:
24 pins
1
DN8
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
3/03/08
208
KOA Speer Electronics, Inc.
• Bolivar Drive • P Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
.O.
DN(X)
diode terminator network
ordering information
New Part #
DNA
Type
DNA
DN2
DN3
DN4
DN5
DN6
DN7
DN8
Q20
Package
Symbol
Package type symbol + number of pins
S03: 3 pin SOT23
S14: 4 pin SOT23
S06: 6 pin SOT23
N08: 8 pin Narrow SOIC
W20: 20 pin Wide SOIC
Q20: 20 pin QSOP
Q24: 24 pin QSOP
T
Termination
Material
T: Sn
(Other termination
styles available,
contact factory
for options)
TEB
Packaging
TE: 7" embossed plastic
TEB: 13" embossed
plastic tape
application schematic
ESD Suppression
Transient
+ Rail
Driver
– Rail or GND
– Rail or GND
Transient
Suppressed
Receiver
Driver
Signal Conditioning
Signal
Ringing
+ Rail
Receiver
Ringing
Eliminate
applications and ratings
Part
Designation
DN(X)
Forward
Voltage
1
F
=50ma
0.4 to 1.2V
Reverse
Breakdown
Voltage
1
R
=1ma
7.2V
Leakage
Current
@7V
1uA
Capacitance
@1Mhz
2pF
ESD
Voltage
Capability
IEC 61000-4-2
16kV
Operating
Temperature
Range
-55°C
to +125°C
Continuous
Forward
Current*
50mA
* One diode conducting
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
2/27/06
KOA Speer Electronics, Inc.
• Bolivar Drive • P Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
.O.
209
circuit
protection
