Finished parts are 100% tested for electrical parameters
and visual characteristics.
0.20±0.10
0.20±0.10
(0.008±0.004)
(0.008±0.004)
6
5
4
2.12±0.20
(0.083±0.008)
0.44±0.10
0.44±0.10
(0.017±0.004)
(0.017±0.004)
0.55±0.10
(0.022±0.004)
Unit: mm (inches)
OPERATING TEMPERATURE
-40ºC to +85ºC
TERMINATION
Finishes available in Ni/Sn, Immersion Sn, Immersion Au
and OSP coatings which are compatible with automatic
soldering technologies which include reflow, wave
soldering, vapor phase and manual.
Terminal No.
1
2
3
4
5
6
Terminal Name
High Frequency Port
GND
Low Frequency Port
GND
Common Port
GND
ORIENTATION IN TAPE
Top View
PART NUMBER: DP05A19407TR
Specification @ 25ºC
Size [mm(inches)]
Height [mm(inches)]
Volume (mm^3)
Frequency Range (F1) (MHz)
Frequency Range (F2) (MHz)
Insertion Loss (F1, at Fc) (dB)
Insertion Loss (F2, at Fc) (dB)
Attenuation (F1) at (F2) (dB)
Attenuation (F2) at (F1) (dB)
VSWR (Input @ F1)
VSWR (Input @ F2)
VSWR (Lowband @ F1)
VSWR (Highband @ F2)
2.12 x 1.28 (0.083 x 0.050)
0.55 (0.021)
1.5
892±68
1940±230
-0.4
-0.65
-23
-20
1.3
1.4
1.4
1.2
6
5
4
1
2
3
6
5
4
1
2
3
POWER CAPACITY
4.5W Maximum
3
Multilayer Organic (MLO
TM
)
0805 WCDMA Diplexer
S PARAMETER MEASUREMENTS
0
-5
-10
dB(S(1.1)
dB(S(3.1)
-15
-20
-25
-30
0
-10
-20
-30
-40
Low Band
dB(S(1.1)
dB(S(2.1)
High Band
Return Loss
Return Loss
0.8 1.0
1.2 1.4
1.6
1.8 2.0
2.2
2.4 2.6
-50
-60
0.4 0.6
-35
0.4 0.6
0.8 1.0
1.2 1.4
1.6
1.8 2.0
2.2
2.4 2.6
freq, GHz
freq, GHz
-5
-10
dB(S(2.3))
-15
-20
Isolation
-25
-30
-35
0.4 0.6
0.8 1.0
1.2 1.4
1.6
1.8 2.0
2.2
2.4 2.6
freq, GHz
Note:
Measurements were taken using an Anritsu 4 port VNA; Diplexer was mounted on a custom evaluation board. To reduce systematic errors from the VNA, the coaxial
measurement cables, and evaluation board, a Short-Open-Load-Thru (SOLT) calibration was performed, using a custom fabricated calibration substrate. This is the most
common coaxial calibration methods.
4
Multilayer Organic (MLO
TM
)
0805 WLAN/BT Diplexer
AUTOMATED SMT ASSEMBLY
The following section describes the guidelines for automated
SMT assembly of MLO
TM
RF devices which are typically Land
Grid Array (LGA) packages or side termination SMT pacages.
Control of solder and solder paste volume is critical for
surface mount assembly of MLO
TM
RF devices onto the PCB.
Stencil thickness and aperture openings should be adjusted
according to the optimal solder volume. The following are
general recommendations for SMT mounting of MLO
TM
devices onto the PCB.
SMT REFLOW PROFILE
Common IR or convection reflow SMT processes shall be
used for the assembly. Standard SMT reflow profiles, for
eutectic and Pb free solders, can be used to surface mount
the MLO
TM
devices onto the PCB. In all cases, a temperature
gradient of 3°C/sec, or less, should be maintained to prevent
warpage of the package and to ensure that all joints reflow
properly. Additional soak time and slower preheating time
may be required to improve the out-gassing of solder paste.
In addition, the reflow profile depends on the PCB density
and the type of solder paste used. Standard no-clean solder
paste is generally recommended. If another type of flux is
used, complete removal of flux residual may be necessary.
Example of a typical lead free reflow profile is shown below.
Tp
Ramp-up
T
L
tp
Critical Zone
T
L
to Tp
t
L
Temperature
Ts max
Ts min
ts
Preheat
Ramp-down
25
t 25ºC to Peak
Time
Figure A. Typical Lead Free Profile and Parameters
