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DP83848QSQX/NOPB

IC DATACOM, ETHERNET TRANSCEIVER, PQCC40, 6 X 6 MM, LEAD FREE, PLASTIC, LLP-40, Network Interface

器件类别:无线/射频/通信    电信电路   

厂商名称:National Semiconductor(TI )

厂商官网:http://www.ti.com

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器件参数
参数名称
属性值
厂商名称
National Semiconductor(TI )
包装说明
HVQCCN,
Reach Compliance Code
unknown
JESD-30 代码
S-PQCC-N40
长度
6 mm
功能数量
1
端子数量
40
最高工作温度
105 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
HVQCCN
封装形状
SQUARE
封装形式
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态
Not Qualified
座面最大高度
0.8 mm
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
电信集成电路类型
ETHERNET TRANSCEIVER
温度等级
INDUSTRIAL
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
QUAD
宽度
6 mm
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DP83848Q PHYTER Extended Temperature Single Port 10/100 Mb/s Ethernet Physical Layer
Transceiver
September 19, 2011
DP83848Q
PHYTER Extended Temperature Single Port 10/100 Mb/s
Ethernet Physical Layer Transceiver
1.0 General Description
The number of applications requiring Ethernet connectivity
continues to increase, driving Ethernet enabled devices into
harsher environments.
The DP83848Q was designed to meet the challenge of these
new applications with an extended temperature performance
that goes beyond the typical Industrial temperature range.
The DP83848Q is a highly reliable, feature rich, robust device
which meets IEEE 802.3u standards over an EXTENDED
temperature range of -40°C to 105°C. This device is ideally
suited for harsh environments such as automotive/transporta-
tion, wireless remote base stations,and industrial control ap-
plications.
It offers enhanced ESD protection and the choice of an MII or
RMII interface for maximum flexibility in MPU selection; all in
a 40 pin LLP package.
The DP83848Q extends the leadership position of the
PHYTER family of devices with a wide operating temperature
range. The National Semiconductor line of PHYTER
transceivers builds on decades of Ethernet expertise to offer
the high performance and flexibility that allows the end user
an easy implementation tailored to meet these application
needs.
3.0 Features
AEC-Q100 Grade 2
Extreme Temperature from -40°C to 105°C
Low-power 3.3V, 0.18µm CMOS technology
Low power consumption <270mW Typical
3.3V MAC Interface
Auto-MDIX for 10/100 Mb/s
Energy Detection Mode
25 MHz clock out
RMII Rev. 1.2 Interface (configurable)
MII Serial Management Interface (MDC and MDIO)
IEEE 802.3u MII
IEEE 802.3u Auto-Negotiation and Parallel Detection
IEEE 802.3u ENDEC, 10BASE-T transceivers and filters
IEEE 802.3u PCS, 100BASE-TX transceivers and filters
IEEE 1149.1 JTAG
Integrated ANSI X3.263 compliant TP-PMD physical sub-
layer with adaptive equalization and Baseline Wander
compensation
Error-free Operation up to 150 meters
Programmable LED support for Link and Activity
Single register access for complete PHY status
10/100 Mb/s packet BIST (Built in Self Test)
Lead free 40-pin LLP package (6mm) x (6mm) ADC
2.0 Applications
Automotive/Transportation
Industrial Controls and Factory Automation
General Embedded Applications
4.0 System Diagram
30152551
PHYTER
®
is a registered trademark of National Semiconductor.
© 2011 National Semiconductor Corporation
301525
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DP83848Q
4.0 Block Diagram
30152501
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2
DP83848Q
Table of Contents
1.0 General Description ......................................................................................................................... 1
2.0 Applications .................................................................................................................................... 1
3.0 Features ........................................................................................................................................ 1
4.0 System Diagram .............................................................................................................................. 1
4.0 Block Diagram ................................................................................................................................ 2
6.0 Pin Layout ...................................................................................................................................... 6
7.0 Pin Descriptions .............................................................................................................................. 7
7.1 SERIAL MANAGEMENT INTERFACE ........................................................................................ 7
7.2 MAC DATA INTERFACE ........................................................................................................... 7
7.3 CLOCK INTERFACE ................................................................................................................ 8
7.4 LED INTERFACE ..................................................................................................................... 9
7.5 RESET ................................................................................................................................... 9
7.6 STRAP OPTIONS .................................................................................................................. 10
7.7 10 Mb/s AND 100 Mb/s PMD INTERFACE ................................................................................ 11
7.8 SPECIAL CONNECTIONS ...................................................................................................... 11
7.9 POWER SUPPLY PINS .......................................................................................................... 11
7.10 PACKAGE PIN ASSIGNMENTS ............................................................................................. 12
8.0 Configuration ................................................................................................................................ 13
8.1 AUTO-NEGOTIATION ............................................................................................................ 13
8.1.1 Auto-Negotiation Pin Control .......................................................................................... 13
8.1.2 Auto-Negotiation Register Control ................................................................................... 13
8.1.3 Auto-Negotiation Parallel Detection ................................................................................. 13
8.1.4 Auto-Negotiation Restart ............................................................................................... 14
8.1.5 Enabling Auto-Negotiation via Software ........................................................................... 14
8.1.6 Auto-Negotiation Complete Time .................................................................................... 14
8.2 AUTO-MDIX .......................................................................................................................... 14
8.3 PHY ADDRESS ..................................................................................................................... 14
8.3.1 MII Isolate Mode ........................................................................................................... 14
8.4 LED INTERFACE ................................................................................................................... 15
8.4.1 LEDs .......................................................................................................................... 15
8.4.2 LED Direct Control ........................................................................................................ 16
8.5 HALF DUPLEX vs. FULL DUPLEX ........................................................................................... 16
8.6 INTERNAL LOOPBACK .......................................................................................................... 16
8.7 BIST ..................................................................................................................................... 16
9.0 Functional Description .................................................................................................................... 17
9.1 MII INTERFACE ..................................................................................................................... 17
9.1.1 Nibble-wide MII Data Interface ....................................................................................... 17
9.1.2 Collision Detect ............................................................................................................ 17
9.1.3 Carrier Sense .............................................................................................................. 17
9.2 REDUCED MII INTERFACE .................................................................................................... 17
9.3 802.3u MII SERIAL MANAGEMENT INTERFACE ...................................................................... 18
9.3.1 Serial Management Register Access ............................................................................... 18
9.3.2 Serial Management Access Protocol ............................................................................... 18
9.3.3 Serial Management Preamble Suppression ...................................................................... 19
10.0 Architecture ................................................................................................................................ 20
10.1 100BASE-TX TRANSMITTER ................................................................................................ 20
10.1.1 Code-group Encoding and Injection ............................................................................... 21
10.1.2 Scrambler .................................................................................................................. 21
10.1.3 NRZ to NRZI Encoder ................................................................................................. 22
10.1.4 Binary to MLT-3 Convertor ........................................................................................... 22
10.2 100BASE-TX RECEIVER ...................................................................................................... 22
10.2.1 Analog Front End ........................................................................................................ 22
10.2.2 Digital Signal Processor ............................................................................................... 22
10.2.2.1 Digital Adaptive Equalization and Gain Control ..................................................... 23
10.2.2.2 Base Line Wander Compensation ....................................................................... 24
10.2.3 Signal Detect ............................................................................................................. 25
10.2.4 MLT-3 to NRZI Decoder .............................................................................................. 25
10.2.5 NRZI to NRZ .............................................................................................................. 25
10.2.6 Serial to Parallel ......................................................................................................... 25
10.2.7 Descrambler .............................................................................................................. 25
10.2.8 Code-group Alignment ................................................................................................ 25
10.2.9 4B/5B Decoder ........................................................................................................... 25
10.2.10 100BASE-TX Link Integrity Monitor ............................................................................. 25
10.2.11 Bad SSD Detection ................................................................................................... 25
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DP83848Q
10.3 10BASE-T TRANSCEIVER MODULE .....................................................................................
10.3.1 Operational Modes .....................................................................................................
10.3.2 Smart Squelch ...........................................................................................................
10.3.3 Collision Detection and SQE ........................................................................................
10.3.4 Carrier Sense .............................................................................................................
10.3.5 Normal Link Pulse Detection/Generation ........................................................................
10.3.6 Jabber Function .........................................................................................................
10.3.7 Automatic Link Polarity Detection and Correction ............................................................
10.3.8 Transmit and Receive Filtering .....................................................................................
10.3.9 Transmitter ................................................................................................................
10.3.10 Receiver ..................................................................................................................
11.0 Design Guidelines .......................................................................................................................
11.1 TPI NETWORK CIRCUIT ......................................................................................................
11.2 ESD PROTECTION ..............................................................................................................
11.3 CLOCK IN (X1) REQUIREMENTS ..........................................................................................
11.4 POWER FEEDBACK CIRCUIT ..............................................................................................
11.5 ENERGY DETECT MODE .....................................................................................................
12.0 Reset Operation ..........................................................................................................................
12.1 HARDWARE RESET ............................................................................................................
12.2 SOFTWARE RESET .............................................................................................................
13.0 Register Block .............................................................................................................................
13.1 REGISTER DEFINITION .......................................................................................................
13.1.1 Basic Mode Control Register (BMCR) ............................................................................
13.1.2 Basic Mode Status Register (BMSR) .............................................................................
13.1.3 PHY Identifier Register #1 (PHYIDR1) ...........................................................................
13.1.4 PHY Identifier Register #2 (PHYIDR2) ...........................................................................
13.1.5 Auto-Negotiation Advertisement Register (ANAR) ...........................................................
13.1.6 Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page) .............................
13.1.7 Auto-Negotiation Link Partner Ability Register (ANLPAR) (Next Page) ...............................
13.1.8 Auto-Negotiate Expansion Register (ANER) ...................................................................
13.1.9 Auto-Negotiation Next Page Transmit Register (ANNPTR) ...............................................
13.2 EXTENDED REGISTERS ......................................................................................................
13.2.1 PHY Status Register (PHYSTS) ...................................................................................
13.2.2 False Carrier Sense Counter Register (FCSCR) .............................................................
13.2.3 Receiver Error Counter Register (RECR) .......................................................................
13.2.4 100 Mb/s PCS Configuration and Status Register (PCSR) ................................................
13.2.5 RMII and Bypass Register (RBR) ..................................................................................
13.2.6 LED Direct Control Register (LEDCR) ...........................................................................
13.2.7 PHY Control Register (PHYCR) ....................................................................................
13.2.8 10 Base-T Status/Control Register (10BTSCR) ...............................................................
13.2.9 CD Test and BIST Extensions Register (CDCTRL1) ........................................................
13.2.10 Energy Detect Control (EDCR) ...................................................................................
14.0 Absolute Maximum Ratings ...........................................................................................................
15.0 AC and DC Specifications .............................................................................................................
15.1 DC SPECIFICATIONS ..........................................................................................................
15.2 AC SPECIFICATIONS ..........................................................................................................
15.2.1 Power Up Timing ........................................................................................................
15.2.2 Reset Timing .............................................................................................................
15.2.3 MII Serial Management Timing .....................................................................................
15.2.4 100 Mb/s MII Transmit Timing ......................................................................................
15.2.5 100 Mb/s MII Receive Timing .......................................................................................
15.2.6 100BASE-TX and 100BASE-FX MII Transmit Packet Latency Timing ................................
15.2.7 100BASE-TX Transmit Packet Deassertion Timing ..........................................................
15.2.8 100BASE-TX Transmit Timing (t
R/F
& Jitter) ....................................................................
15.2.9 100BASE-TX Receive Packet Latency Timing ................................................................
15.2.10 100BASE-TX Receive Packet Deassertion Timing ........................................................
15.2.11 10 Mb/s MII Transmit Timing ......................................................................................
15.2.12 10 Mb/s MII Receive Timing .......................................................................................
15.2.13 10 Mb/s Serial Mode Transmit Timing ..........................................................................
15.2.14 10 Mb/s Serial Mode Receive Timing ..........................................................................
15.2.15 10BASE-T Transmit Timing (Start of Packet) ................................................................
15.2.16 10BASE-T Transmit Timing (End of Packet) .................................................................
15.2.17 10BASE-T Receive Timing (Start of Packet) .................................................................
15.2.18 10BASE-T Receive Timing (End of Packet) ..................................................................
15.2.19 10 Mb/s Heartbeat Timing .........................................................................................
15.2.20 10 Mb/s Jabber Timing .............................................................................................
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参数对比
与DP83848QSQX/NOPB相近的元器件有:DP83848QSQ/NOPB、DP83848QSQE/NOPB。描述及对比如下:
型号 DP83848QSQX/NOPB DP83848QSQ/NOPB DP83848QSQE/NOPB
描述 IC DATACOM, ETHERNET TRANSCEIVER, PQCC40, 6 X 6 MM, LEAD FREE, PLASTIC, LLP-40, Network Interface IC DATACOM, ETHERNET TRANSCEIVER, PQCC40, 6 X 6 MM, LEAD FREE, PLASTIC, LLP-40, Network Interface IC DATACOM, ETHERNET TRANSCEIVER, PQCC40, 6 X 6 MM, LEAD FREE, PLASTIC, LLP-40, Network Interface
厂商名称 National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
包装说明 HVQCCN, HVQCCN, HVQCCN,
Reach Compliance Code unknown unknown unknown
JESD-30 代码 S-PQCC-N40 S-PQCC-N40 S-PQCC-N40
长度 6 mm 6 mm 6 mm
功能数量 1 1 1
端子数量 40 40 40
最高工作温度 105 °C 105 °C 105 °C
最低工作温度 -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVQCCN HVQCCN HVQCCN
封装形状 SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 0.8 mm 0.8 mm 0.8 mm
标称供电电压 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
电信集成电路类型 ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD
宽度 6 mm 6 mm 6 mm
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