16Mx16, 7.5 - 15ns, P12, M-Densus
30A232-00
A
256 Megabit Synchronous DRAM
DPSD16MX16TY5
High Density Memory Device
ADVANCED INFORMATION
DESCRIPTION:
The
M-Densus
series is a family of interchangeable memory modules. The 256 Megabit SDRAM is a member of
this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are
constructed with 8 Meg x 16 SDRAMs.
This 128 Megabit based
M-Densus
module, the
DPSD16MX16TY5 has been designed to fit in the same
footprint as the 8 Meg x 16 SDRAM TSOP monolithic and
128 Megabit SDRAM based family of
M-Densus
modules.
This allows the memory board designer to upgrade the
memory in their products without redesigning the
memory board, thus saving time and money.
FEATURES:
•
Configuration Available:
16 Meg x 16 bit (with two Chip Selects)
•
Clock Frequency:
66
[1]
, 83
[1]
, 100, 125
[2]
, 133
[2]
MHz (max.)
•
PC100 and PC133 Compatible
•
3.3V Supply
•
LVTTL Compatible I/O
•
Four Bank Operation
•
Programmable Burst Type, Burst Length,
and CAS Latency
•
4096 Cycles / 64 ms
•
Auto and Self Refresh
•
Package: TSOP Leadless Stack
NOTES: [1] Available in Industrial Temperature Ranges Only.
[2] Available in Commercial Temperature Range Only.
M-Densus
PIN-OUT DIAGRAM
PIN NAMES
A0 - A11
BA0, BA1
DQ0 - DQ15
CAS
RAS
WE
UDQM,
LDQM
CKE
CLK
CS0-CS1
V
CC
/V
SS
V
CCQ
/V
SSQ
N.C./RFU
Row Address:
A0 - A11
Column Address: A0 - A8
Bank Select Address
Data In / Data Out
Column Address Strobes
Row Address Enables
Data Write Enable
Upper & Lower
Data Input/Output Mask
Clock Enable
System Clock
Chip Selects
Power Supply/Ground
Data Output Power/Ground
No Connect
Reserved for Future Use
FUNCTIONAL BLOCK DIAGRAM
30A232-00
REV. A
This document contains information on a product under consideration for
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change or discontinue information on this product without prior notice.
1
DPSD16MX16TY5
M-Densus
ADVANCED INFORMATION
PART NUMBER DESCRIPTION
Dense-Pac Microsystems, Inc.
NOTES: [1]
[2]
[3]
[4]
Available in Industrial Temperature Ranges Only. See Note 4.
Available in Commercial Temperature Range Only.
Contact your sales representative for supplier and manufacturer codes.
Delivery of all industrial temperature ranges are subject to availability of screened components.
MECHANICAL DRAWING
Standard TSOP Pad Layout is acceptable. When
possible, use the Dense-Pac recommended footprint as
shown. See Application Note 53A001-00 for further
(714) 898-0007
7321 Lincoln Way, Garden Grove, California 92841-1431
(800) 642-4477
FAX: (714) 897-1772
http://www.dense-pac.com
30A232-00
REV. A
Dense-Pac Microsystems, Inc.
2
