型号 | DS2180AQN | DS2180A | DS2180AQ | DS2180AN |
---|---|---|---|---|
描述 | DATACOM, FRAMER, PQCC44, PLASTIC, LCC-44 | DATACOM, FRAMER, PDIP40, 0.600 INCH, DIP-40 | DATACOM, FRAMER, PQCC44, PLASTIC, LCC-44 | DATACOM, FRAMER, PDIP40, 0.600 INCH, DIP-40 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | LCC | DIP | LCC | DIP |
包装说明 | QCCJ, | DIP, | QCCJ, | DIP, |
针数 | 44 | 40 | 44 | 40 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
JESD-30 代码 | S-PQCC-J44 | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 16.585 mm | 52.3875 mm | 16.585 mm | 52.3875 mm |
湿度敏感等级 | 3 | 1 | 3 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 40 | 44 | 40 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | QCCJ | DIP |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
峰值回流温度(摄氏度) | 240 | 245 | 240 | 245 |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 4.57 mm | 4.064 mm | 4.57 mm | 4.064 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | FRAMER | FRAMER | FRAMER | FRAMER |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL |
处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED |
宽度 | 16.585 mm | 15.24 mm | 16.585 mm | 15.24 mm |
Base Number Matches | 1 | 1 | 1 | 1 |