Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, MICRO, SOP-8
厂商名称:Maxim(美信半导体)
厂商官网:https://www.maximintegrated.com/en.html
下载文档型号 | DS2720BU | DS2720CU/T&R | DS2720BU/T&R |
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描述 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, MICRO, SOP-8 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, MICRO, SOP-8 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, MICRO, SOP-8 |
是否无铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | SOIC | SOIC | SOIC |
包装说明 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 |
针数 | 8 | 8 | 8 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
可调阈值 | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 |
长度 | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP |
封装等效代码 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 240 | 240 |
电源 | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电流 (Isup) | 0.025 mA | 0.025 mA | 0.025 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V |
表面贴装 | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 |
宽度 | 3 mm | 3 mm | 3 mm |