battery management high-prec Li+ bat monitor w/alerts
厂商名称:Maxim(美信半导体)
厂商官网:https://www.maximintegrated.com/en.html
器件标准:
下载文档型号 | DS2762BE+025 | DS2762AX-025/T&R | DS2762BX/T&R | DS2762AX/T&R | DS2762BE+ | DS2762AE+T&R | DS2762AE+025/T&R | DS2762BX-025/T&R | DS2762AE+025 | DS2762BE+025/T&R |
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描述 | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts | battery management high-prec Li+ bat monitor w/alerts |
是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | TSSOP | BGA | BGA | BGA | TSSOP | TSSOP | TSSOP | BGA | TSSOP | TSSOP |
包装说明 | SSOP, TSSOP16,.25 | FLIPCHIP-14 | FLIPCHIP-14 | FLIPCHIP-14 | SSOP, TSSOP16,.25 | SSOP, TSSOP16,.25 | SSOP, TSSOP16,.25 | FLIPCHIP-14 | SSOP, TSSOP16,.25 | SSOP, TSSOP16,.25 |
针数 | 16 | 14 | 14 | 14 | 16 | 16 | 16 | 14 | 16 | 16 |
Reach Compliance Code | compliant | _compli | _compli | _compli | compli | compli | compli | _compli | compli | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G16 | R-PBGA-B14 | R-PBGA-B14 | R-PBGA-B14 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PBGA-B14 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e3 | e0 | e0 | e0 | e3 | e3 | e3 | e0 | e3 | e3 |
长度 | 5 mm | 2.54 mm | 2.54 mm | 2.54 mm | 5 mm | 5 mm | 5 mm | 2.54 mm | 5 mm | 5 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 14 | 14 | 14 | 16 | 16 | 16 | 14 | 16 | 16 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | VFBGA | VFBGA | VFBGA | SSOP | SSOP | SSOP | VFBGA | SSOP | SSOP |
封装等效代码 | TSSOP16,.25 | FLIP CHIP | FLIP CHIP | FLIP CHIP | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | FLIP CHIP | TSSOP16,.25 | TSSOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 240 | 240 | 240 | 260 | 260 | 260 | 240 | 260 | 260 |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 0.67 mm | 0.67 mm | 0.67 mm | 1.1 mm | 1.1 mm | 1.1 mm | 0.67 mm | 1.1 mm | 1.1 mm |
最大供电电流 (Isup) | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | BALL | BALL | BALL | GULL WING | GULL WING | GULL WING | BALL | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 20 | NOT SPECIFIED | 20 | 30 | 30 | 30 | 20 | 30 | 30 |
宽度 | 4.4 mm | 2.03 mm | 2.03 mm | 2.03 mm | 4.4 mm | 4.4 mm | 4.4 mm | 2.03 mm | 4.4 mm | 4.4 mm |