型号
- 型号
- 关键词
| 型号 | DS8911N | DS8911N/B+ | DS8911M | DS8911M/B+ |
|---|---|---|---|---|
| 描述 | IC,FREQUENCY SYNTHESIZER,BIPOLAR,DIP,24PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,BIPOLAR,DIP,24PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,BIPOLAR,SOP,24PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,BIPOLAR,SOP,24PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | SOP, SOP24,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | SOP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | SOP24,.4 | SOP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - |