DSC1104
DSC1124
Low-Jitter Precision HCSL Oscillator
General Description
The DSC1104 & DSC1124 series of high
performance oscillators utilizes a proven
silicon MEMS technology to provide excellent
jitter and stability over a wide range of
supply voltages and temperatures.
By
eliminating the need for quartz or SAW
technology, MEMS oscillators significantly
enhance reliability and accelerate product
development, while meeting stringent clock
performance criteria for a variety of
communications, storage, and networking
applications.
DSC1104 has a standby feature allowing it to
completely power-down when EN pin is
pulled low; whereas for DSC1124, only the
outputs are disabled when EN is low. Both
oscillators are available in industry standard
packages, including the small 3.2x2.5 mm
2
,
and are “drop-in” replacements for standard
6-pin HCSL quartz crystal oscillators.
Features
Low RMS Phase Jitter: <1 ps (typ)
High Stability: ±10, ±25, ±50 ppm
Wide Temperature Range
o
Industrial: -40° to 85° C
o
Ext. commercial: -20° to 70° C
High Supply Noise Rejection: -50 dBc
Short Lead Time: 2 Weeks
Wide Freq. Range: 2.3 to 460 MHz
Small Industry Standard Footprints
o
2.5x2.0, 3.2x2.5, 5.0x3.2, & 7.0x5.0 mm
Excellent Shock & Vibration Immunity
o
Qualified to MIL-STD-883
High Reliability
o
20x better MTF than quartz oscillators
Low Current Consumption
Supply Range of 2.25 to 3.6 V
Standby & Output Enable Function
Lead Free & RoHS Compliant
LVPECL & LVDS Versions Available
AEC-Q100 Automotive Qualified
Block Diagram
Applications
Storage Area Networks
o
SATA, SAS, Fibre Channel
Passive Optical Networks
o
EPON, 10G-EPON, GPON, 10G-PON
Ethernet
o
1G, 10GBASE-T/KR/LR/SR, and FCoE
HD/SD/SDI Video & Surveillance
PCI Express: Gen 1 & Gen 2
DisplayPort
Output Enable Modes
EN Pin
High
NC
Low
DSC1104
Outputs Active
Outputs Active
Standby
DSC1124
Outputs Active
Outputs Active
Outputs Disabled
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DSC1104 | DSC1124
Page 1
MK-Q-B-P-D-110410-04-6
DSC1104
DSC1124
Low-Jitter Precision HCSL Oscillator
Absolute Maximum Ratings
Item
Supply Voltage
Input Voltage
Junction Temp
Storage Temp
Soldering Temp
ESD
HBM
MM
CDM
Ordering Code
Unit
V
V
°C
°C
°C
V
40sec max.
Min
-0.3
-0.3
-
-55
-
-
Max
+4.0
V
DD
+0.3
+150
+150
+260
4000
400
1500
Condition
Enable Modes
0: Enable/Standby
2: Enable/Disable
Temp Range
E: -20 to 70
I: -40 to 85
L: -40 to 105
Packing
T: Tape & Reel
: Tube
DSC11
0
4
C I 5
Package
A: 7.0x5.0mm
B: 5.0x3.2mm
C: 3.2x2.5mm
D: 2.5x2.0mm
N: 7.0x5.0mm
(no center pad)
-
125.0000
T
Freq (MHz)
125.0000
Stability
1: ±50ppm
2: ±25ppm
5: ±10ppm
Note: 1000+ years of data retention on internal memory
Specifications
Parameter
Supply Voltage
1
Supply Current
V
DD
I
DD
EN pin low – outputs are disabled
DSC1104
DSC1124
Includes frequency variations due
to initial tolerance, temp. and
power supply voltage
1 year @25°C
T=25°C
0.75xV
DD
-
DSC1104
DSC1124
Pull-up resistor exist
40
40
0.725
-
750
200
2.3
48
2.5
200kHz to 20MHz @156.25MHz
100kHz to 20MHz @156.25MHz
12kHz to 20MHz @156.25MHz
0.25
0.37
1.7
400
460
52
42
-
0.1
Condition
Min.
2.25
Typ.
Max.
3.6
0.095
22
±10
±25
±50
±5
5
-
0.25xV
DD
5
5
20
Unit
V
mA
20
Frequency Stability
Aging
Startup Time
2
Input Logic Levels
Input logic high
Input logic low
Output Disable Time
3
Output Enable Time
Enable Pull-Up Resistor
4
Supply Current
Output Logic Levels
Output logic high
Output logic low
Pk to Pk Output Swing
Output Transition time
3
Rise Time
Fall Time
Frequency
Output Duty Cycle
Period Jitter
Integrated Phase Noise
Notes:
1.
2.
3.
4.
Δf
Δf
t
SU
V
IH
V
IL
t
DA
t
EN
ppm
ppm
ms
V
ns
ms
ns
kΩ
mA
V
mV
ps
MHz
%
ps
RMS
ps
RMS
HCSL Outputs
I
DD
V
OH
V
OL
Output Enabled, R
L
=50Ω
R
L
=50Ω
Single-Ended
t
R
t
F
f
0
SYM
J
PER
J
PH
20% to 80%
R
L
=50Ω, C
L
= 2pF
Single Frequency
Differential
2
Pin 6 V
DD
should be filtered with 0.1uf capacitor.
t
su
is time to 100ppm of output frequency after V
DD
is applied and outputs are enabled.
Output Waveform and Test Circuit figures below define the parameters.
Output is enabled if pad is floated or not connected.
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DSC1104 | DSC1124
Page 2
MK-Q-B-P-D-110410-04-6
DSC1104
DSC1124
Low-Jitter Precision HCSL Oscillator
Nominal Performance Parameters
(Unless specified otherwise: T=25° C, V
DD
=3.3 V)
0
-10
2.5
50-mV
Phase Jitter (ps RMS)
50MHz-HCSL
2.0
Rejection (dBc)
-20
-30
-40
-50
-60
-70
-80
0.1
1
10
100
100-mV
106MHz-HCSL
156MHz-HCSL
1.5
212MHz-HCSL
1.0
0.5
0.0
1000
10000
0
200
400
600
800
1000
Supply Noise Frequency (kHz)
Low-end of integration BW: x kHz to 20 MHz
Power supply rejection ratio
Phase jitter (integrated phase noise)
Output Waveform
t
R
t
F
Output
Output
80
%
50%
20%
675 mV
830 mv
1/
f
o
t
EN
t
DA
V
IH
Enable
V
IL
Typical Termination Scheme
V
DD
0.1uF
Rs = 0 Ω f or test
6
2
3
5
4
Rs
100 Ω
Rs
Rs serves to match the trace
impedances. Depending on
board layout, the value may
range from 0 to 30 ohms.
50 Ω
50 Ω
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DSC1104 | DSC1124
Page 3
MK-Q-B-P-D-110410-04-6
DSC1104
Test Circuit
DSC1124
Low-Jitter Precision HCSL Oscillator
Solder Reflow Profile
ax
260
°
C
Temperature (°C)
Se
cM
.
20-40
Sec
217
°
C
200
°
C
.
ax
60-150
Sec
150
°
C
3C
/Se
60-180
Sec
cM
Reflow
Pre heat
8 min max
Cool
Time
25
°
C
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/Sec Max.
Preheat Time 150°C to 200°C
60-180 Sec
Time maintained above 217°C
60-150 Sec
255-260°C
Peak Temperature
Time within 5°C of actual Peak
20-40 Sec
6°C/Sec Max.
Ramp-Down Rate
Time 25°C to Peak Temperature
8 min Max.
3C
/
_____________________________________________________________________________________________________________________________ _________________
DSC1104 | DSC1124
Page 4
MK-Q-B-P-D-110410-04-6
S
S
S
6C
6C
6C/
c
c
ec
Ma
Ma
Ma
.
.
x.
DSC1104
DSC1124
Low-Jitter Precision HCSL Oscillator
Package Dimensions
7.0 x 5.0 mm Plastic Package
EXTERNAL DIMENSIONS
Units: mm [ inches]
7±0.10 [0.276±0.004]
6
5
4
4
2.54 [0.100]
5
6
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
Via to Ground
Plane
1.4±0.10 [0.055±0.004]
Via to Power
Trace
2.54[0.100]
1.1±0.01[0.43±0.004]
3.7 [0.146] REF
6
5
4
1.8 [0.071]
2.6 [0.102]
1
2
3
1
2
3
5±0.10 [0.197±0.004]
3
2
2.8 [0.110]
1
0.85±0.05
No.
1
2
3
4
5
6
PAD
Pin Terminal
Enable
N/C
Ground
OUT
OUT-
VDD
TIE TO GND
1.4 [0.055]
1.4 [0.055]
5.0 x 3.2 mm Plastic Package
EXTERNAL DIMENSIONS
Units: mm [ inches]
5±0.05 [0.197±0.002]
6
5
4
4
1.27 [0.050]
5
6
0.64±0.05
Via to Ground
Plane
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
Via to Power
Trace
1.27[0.05]
1.2 [0.047] REF
6
1.2 [0.047] REF
1
3
2
1
0.7±0.1 [0.079±0.002]
5
2
4
3
1
2
3
3.2±0.05 [0.126±0.002]
0.85±0.05
No.
1
2
3
4
5
6
Pin Terminal
Enable
N/C
Ground
OUT
OUT-
VDD
1.1 [ 0.043]
0.64 [0.025]
_____________________________________________________________________________________________________________________________ _________________
DSC1104 | DSC1124
Page 5
MK-Q-B-P-D-110410-04-6
模拟电子
