DSC1233NL2-2M300000B,DSC1233NL2-2M300000B pdf中文资料,DSC1233NL2-2M300000B引脚图,DSC1233NL2-2M300000B电路-Datasheet-电子工程世界

文档预览

DSC12X2/3/4

High Performance Differential MEMS Oscillators

Features

• Very Low RMS Phase Jitter: <650 fs (typ.)

• High Stability: ±20 ppm, ±25 ppm, ±50 ppm

• Wide Temperature Range:

- Automotive: –40°C to +125°C (DSC12x3

LVDS Only)

- Extended Industrial: –40°C to +105°C

- Industrial: –40°C to +85°C

- Commercial: –20°C to +70°C

• Supports LVPECL, LVDS, or HCSL Differential

Outputs

• PCIe Gen1-5 Compliant Output

• Wide Frequency Range: 2.5 MHz to 450 MHz

• Small Industry-Standard Footprints

- 2.5 mm x 2.0 mm

- 3.2 mm x 2.5 mm

- 5.0 mm x 3.2 mm

- 7.0 mm x 5.0 mm

• Excellent Shock and Vibration Immunity

- Qualified to MIL-STD-883

• High Reliability

- 20x Better MTF than Quartz Oscillators

• Supply Range of 2.25V to 3.63V

• Standby, Frequency Select, and Output Enable

Functions

• Lead-Free and RoHS-Compliant

General Description

The DSC12x2/3/4 family of high performance

oscillators utilizes the latest generation of silicon

MEMS technology that reduces close-in noise and

provides excellent jitter and stability over a wide range

of supply voltages and temperatures. By eliminating

the need for quartz or SAW technology, MEMS

oscillators significantly enhance reliability and

accelerate product development, while meeting

stringent clock performance criteria for a variety of

communications, storage, and networking applications.

The DSC12x2/3/4 family features a control function on

pin 1 or pin 2 that permits either a standby feature

(complete power down when STDBY is low), output

enable (output is tri-stated with OE low), or a frequency

select (choice of two frequencies selected by FS

high/low). See the

Product Identification System

section for detailed information.

All oscillators are available in industry-standard

packages, including the small 2.5 mm x 2.0 mm, and

are “drop-in” replacements for standard 6-pin

LVPECL/LVDS/HCSL crystal oscillators.

Package Types

DSC12

2/3/4

6-Lead CDFN/VDFN

OE/STDBY/FS

GND

VDD

CLK–

CLK+

Applications

•

Storage Area Networks

Passive Optical Networks

10/100G Ethernet

HD/SD/SDI Video and Surveillance

PCI Express Gen 1/2/3/4

Display Port

OE/STDBY/FS

GND

VDD

CLK–

CLK+



2020 Microchip Technology Inc.

DS20006011B-page 1

DSC12X2/3/4

Functional Block Diagrams

Pin 1

OE/STDBY/FS

DIGITAL

CONTROL

SUPPLY

REGULATION

Pin 6

VDD

Pin 2

MEMS

RESONATOR

TEMP SENSOR +

CONTROL &

COMPENSATION

PLL

OUTPUT

DIV

Pin 5

CLK–

Pin 4

CLK+

Pin 3

GND

Pin 1

DIGITAL

CONTROL

SUPPLY

REGULATION

Pin 6

VDD

Pin 2

OE/STDBY/FS

MEMS

RESONATOR

TEMP SENSOR +

CONTROL &

COMPENSATION

PLL

OUTPUT

DIV

Pin 5

CLK–

Pin 4

CLK+

Pin 3

GND

DS20006011B-page 2



2020 Microchip Technology Inc.

DSC12X2/3/4

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage .......................................................................................................................................... –0.3V to +4.0V

Input Voltage .................................................................................................................................... –0.3V to V

+ 0.3V

ESD Protection (HBM) ...............................................................................................................................................4 kV

ESD Protection (MM) ................................................................................................................................................400V

ESD Protection (CDM) ............................................................................................................................................1.5 kV

† Notice:

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at those or any other conditions above those indicated

in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended

periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics:

= 2.5V ±10% or 3.3V±10%; T

= –40°C to +105°C, unless noted.

Parameter

Supply Voltage

Symbol

Min.

2.25

—

Supply Current

—

Standby Current

STDBY_

Δf

—

Frequency Stability

—

Aging

Startup Time

Δf

Input Logic Levels

Output Disable Time

Output Enable Time

Enable Pull-Up Resistor

LVPECL (DSC12x2)

Frequency

Output Logic Levels

Peak-to-Peak Output Swing

Output Transition Time

2.5

–

1.145

—

800

200

250

450

—

–

1.695

—

250

300

= 50Ω

Single-Ended

20% to 80%, R

= 50Ω

MHz

—

0.75 x

—

Typ.

—

2.5

—

5.5

—

1.5

Max.

3.63

—

Units

Conditions

Note 1

LVPECL, f

OUT

= 100 MHz

LVDS, f

OUT

= 100 MHz

HCSL, f

OUT

= 100 MHz

Output disabled (tri-state),

OUT

= 100 MHz

±20

±25

±50

±5

±1

—

0.25 x

350

—

μA

Input pin = STDBY = Asserted

= 3.3V)

Includes frequency variations due

to initial tolerance, temp., and

power supply voltage

First year @ 25°C

Per year after first year

From 90% V

to valid clock

output, T = +25°C,

Note 2

Input logic high

ppm

Input logic low

MΩ

Note 3

STDBY

Pull-up resistor on pin 1,

Note 4



2020 Microchip Technology Inc.

DS20006011B-page 3

DSC12X2/3/4

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

= 2.5V ±10% or 3.3V±10%; T

= –40°C to +105°C, unless noted.

Parameter

Output Duty Cycle

Period Jitter RMS

Period Jitter Peak-to-Peak

Integrated Phase Noise

(Random)

LVDS (DSC12x3)

Frequency

Output Offset Voltage

Peak-to-Peak Output Swing

Output Transition Time

Output Duty Cycle

Period Jitter RMS

Period Jitter Peak-to-Peak

Period Jitter RMS

Period Jitter Peak-to-Peak

Integrated Phase Noise

(Random)

HCSL (DSC12x4)

Frequency

Output Logic Levels

Peak-to-Peak Output Swing

Output Transition Time

Output Duty Cycle

Period Jitter RMS

Period Jitter Peak-to-Peak

SYM

PER

PTP

2.3

0.64

—

200

250

—

Integrated Phase Noise

(Random)

—

750

260

370

—

0.617

0.460

0.212

450

—

0.1

—

400

500

—

RMS

MHz

—

= 50Ω

Single-Ended

20% to 80%, R

= 50Ω

Differential

= 100.00 MHz, 10k cycles

12 kHz to 20 MHz @100 MHz

= –40°C to +105°C

100 kHz to 20 MHz @100 MHz

= –40°C to +105°C

1.875 MHz to 20 MHz @100 MHz

= –40°C to +105°C

SYM

PER

PTP

PER

PTP

2.3

1.15

250

120

—

0.9

—

1.25

350

170

—

2.5

0.65

450

1.35

450

220

—

RMS

MHz

—

R = 100Ω Differential

Single-Ended

20% to 80%, R

= 100Ω

Differential

= 156.25 MHz, 10k cycles

= 156.25 MHz,

= –40°C to +125°C

= 156.25 MHz,

= –40°C to +125°C

12 kHz to 20 MHz @156.25 MHz

= –40°C to +105°C

2 kHz to 20 MHz @156.25 MHz

TA = –40°C to +125°C

Symbol

SYM

PER

PTP

Min.

—

Typ.

—

2.0

0.65

Max.

—

Units

Conditions

Differential

= 156.25 MHz, 10k cycles

RMS

12 kHz to 20 MHz @156.25 MHz

DS20006011B-page 4



2020 Microchip Technology Inc.

DSC12X2/3/4

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

= 2.5V ±10% or 3.3V±10%; T

= –40°C to +105°C, unless noted.

Parameter

Symbol

RMS-CCHF

Phase Jitter

RMS-CCHF

RMS-CC

Note 1:

Min.

—

Typ.

3.42

0.247

0.08

0.107

0.043

Max.

3.1

3.0

1.0

0.5

0.15

Units

RMS

Conditions

PCIe Gen1.1, T

= D

+14.069 x

(BER 10

–12

Note 5

PCIe Gen2.1, 1.5 MHz to Nyquist,

Note 5

PCIe Gen 2.1, 10 kHz to 1.5 MHz,

Note 5

PCIe Gen 3.0,

Note 5

RMS

PCIe Gen 4.0, 16 GHz,

Note 5

PCIe Gen 5.0, 32 GHz,

Note 5

pin should be filtered with a 0.1

μF

capacitor.

is the time to 100 ppm stable output frequency after V

is applied and outputs are enabled.

: See the Output Waveforms and the

Test Circuits

sections for more information.

Output is enabled if pad is floated (not connected).

Jitter limits are established by Gen1.1, Gen 2.1, Gen 3.0, Gen 4.0, and Gen 5.0 PCIe standards.



2020 Microchip Technology Inc.

DS20006011B-page 5