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DSC2311KL1-R0009T

OSC MEMS CONFIGURABLE OUTPUT

器件类别:无源元件   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
类型
MEMS(硅)
功能
启用/禁用
输出
CMOS
电压 - 电源
2.25 V ~ 3.6 V
频率稳定度
±50ppm
工作温度
-40°C ~ 105°C
大小/尺寸
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm)
高度
0.035"(0.90mm)
封装/外壳
6-VDFN
电流 - 电源(禁用)(最大值)
23mA
文档预览
DSC2311
Crystal-less™ Configurable Two-Output Clock Generator
Features
• Two Simultaneous CMOS Outputs
- Output 1 Range: 2.3 MHz to 170 MHz
- Output 2 Range: 2.3 MHz to 170 MHz
• Low RMS Phase Jitter: <1 ps (typ.)
• High Stability: ±25 ppm, ±50 ppm
• Wide Temperature Range
- Automotive: –40
°
C to +125
°
C
- Ext. Industrial –40
°
C to +105
°
C
- Industrial –40
°
C to +85
°
C
- Ext. Commercial –20
°
C to +70
°
C
• High Supply Noise Rejection: –50 dBc
• High Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x higher MTBF than crystal-based clock
generator designs
• Supply Range of 2.25V to 3.6V
• Lead Free and RoHS-Compliant
General Description
The DSC2311 is a crystal-less™ clock generator that is
factory-configurable to simultaneously output two
separate frequencies from 2.3 MHz to 170 MHz. The
clock generator uses proven silicon MEMS technology
to provide low jitter and high frequency stability across
a wide range of supply voltages and temperatures. By
eliminating the external quartz crystal, crystal-less
clock generators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
consumer electronics, communications, and storage
applications.
DSC2311 has an Output Enable/Disable feature that
allows it to disable the outputs when OE is low. The
device is available in a space-saving 6-pin 2.5 mm x
2.0 mm crystal-less VDFN package that uses only a
single external bypass capacitor. This requires a PCB
footprint equivalent to that of a 1.0 mm x 1.0 mm
crystal-based clock generator.
Applications
Consumer Electronics
Camera and Imaging Modules
Home Automation
Industrial and Power Conversion
Mobile Communications, Internet, and Sensor
Devices
• Solid State, Hard Drive, and Flash Drive Storage
Block Diagram
Control Circuitry
MEMS
PLL
Output
Control
and
Divider
F
OUT1
OE
F
OUT2
2016 Microchip Technology Inc.
DS20005611A-page 1
DSC2311
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage .......................................................................................................................................–0.3V to V
DD
+0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: V
DD
= 3.3V; T
A
= +25°C unless otherwise specified.
Parameters
Supply Voltage (Note
1)
Supply Current (Note
2)
Sym.
V
DD
I
DD
Min.
2.25
Frequency Stability (Note
3)
Aging
Start-up Time (Note
4)
Input Logic Levels
Output Disable Time
Output Enable Time
Pull-Up Resistor (Note
2)
Output Logic Levels
∆f
∆f
t
SU
V
IH
V
IL
t
DA
t
EN
V
OH
V
OL
t
R
Output Transition Time
t
F
2.3
Frequency
f
0
3.3
3.3
Note 1:
2:
3:
4:
5:
1.4
2.0
170
100
170
MHz
0.75 x V
DD
0.9 x V
DD
Typ.
21
40
1.1
Max.
3.6
23
±25
±50
±5
5
0.25 x V
DD
5
20
0.1 x V
DD
2.0
ns
ppm
ppm
ms
V
ns
ns
kΩ
V
Units
V
mA
EN pin low. All outputs
disabled.
Includes frequency
variations due to initial
tolerance, temperature, and
power supply voltage.
One year at +25
°
C
T = +25
°
C
Input logic high
Input logic low
Pull-up exists on all digital
IO
Output logic high, I = ±6 mA
Output logic low, I = ±6 mA
Rise time. 20% to 80%;
C
L
= 15 pF
Fall time. 20% to 80%;
C
L
= 15 pF
Commercial/Industrial temp.
range
Automotive temp. range
Extended Industrial temp.
range
Conditions
Pin 4 V
DD
should be filtered with a 0.01 µF capacitor.
Output is enabled if Enable pad is floated or not connected. Operating current = disabled current +
∆I
DD
from F
OUT1
+
∆I
DD
from F
OUT2
. See
Current Consumption
graph for more information.
For other ppm stabilities, please contact the factory.
t
SU
is time to 100 ppm stable output frequency after V
DD
is applied and outputs are enabled.
Period jitter includes crosstalk from adjacent output.
DS20005611A-page 2
2016 Microchip Technology Inc.
DSC2311
ELECTRICAL CHARACTERISTICS (CONTINUED)
Specifications: V
DD
= 3.3V; T
A
= +25°C unless otherwise specified.
Parameters
Output Duty Cycle
Period Jitter (Note
5)
Sym.
SYM
J
PER
Min.
45
Integrated Phase Noise
J
CC
Note 1:
2:
3:
4:
5:
Typ.
3
0.3
0.38
1.7
Max.
55
2
ps
RMS
Units
%
ps
RMS
F
O1
= F
O2
= 25 MHz
200 kHz to 20 MHz @
25 MHz
100 kHz to 20 MHz @
25 MHz
12 kHz to 20 MHz @
25 MHz
Conditions
Pin 4 V
DD
should be filtered with a 0.01 µF capacitor.
Output is enabled if Enable pad is floated or not connected. Operating current = disabled current +
∆I
DD
from F
OUT1
+
∆I
DD
from F
OUT2
. See
Current Consumption
graph for more information.
For other ppm stabilities, please contact the factory.
t
SU
is time to 100 ppm stable output frequency after V
DD
is applied and outputs are enabled.
Period jitter includes crosstalk from adjacent output.
2016 Microchip Technology Inc.
DS20005611A-page 3
DSC2311
TEMPERATURE SPECIFICATIONS (Note
1)
Parameters
Temperature Ranges
T
A
Operating Temperature Range (T)
T
A
T
A
T
A
Junction Temperature
Storage Temperature Range
Soldering Temperature Range
Note 1:
T
J
T
S
–20
–40
–40
–40
–40
+70
+85
+105
+125
+150
+150
+260
°C
°C
°C
°C
°C
°C
°C
Ordering Option E
Ordering Option I
Ordering Option L
Ordering Option M
40 sec. max.
Sym.
Min.
Typ.
Max.
Units
Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., T
A
, T
J
,
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005611A-page 4
2016 Microchip Technology Inc.
DSC2311
2.0
PIN DESCRIPTIONS
PIN FUNCTION TABLE
Pin Name
ENABLE
N/C
GROUND
CLK0
CLK1
VDD
Do not connect.
Ground.
Clock Output 0 (CMOS).
Clock Output 1 (CMOS).
Supply Voltage.
Description
Output Enable for both CLK0 and CLK1.
The descriptions of the pins are listed in
Table 2-1.
TABLE 2-1:
Pin Number
1
2
3
4
5
6
2016 Microchip Technology Inc.
DS20005611A-page 5
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