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DSC61XXB

Ultra-Small, Ultra-Low Power MEMS Oscillator

Features

• Wide Frequency Range: 3.5 kHz to 100 MHz

• Ultra-Low Power Consumption: 3 mA/1 µA

(Active/Standby)

• Ultra-Small Footprints

- 1.6 mm



1.2 mm

- 2.0 mm



1.6 mm

- 2.5 mm



2.0 mm

• Frequency Select Input Supports Two

Pre-Defined Frequencies

• High Stability: ±20 ppm, ±25 ppm, ±50 ppm

• Wide Temperature Range

- Automotive: –40°C to +125°C

- Ext. Industrial: –40°C to +105°C

- Industrial: –40°C to +85°C

- Ext. Commercial: –20° to +70°C

• Excellent Shock and Vibration Immunity

- Qualified to MIL-STD-883

• High Reliability

- 20x Better MTF Than Quartz Oscillators

• Supply Range of 1.71V to 3.63V

• Short Sample Lead Time: <2 weeks

• Lead Free & RoHS Compliant

• Automotive Version Available: DSA61xxB

General Description

The DSC61xxB family of MEMS oscillators combines

the industry leading low power consumption and

ultra-small packages with exceptional frequency

stability and jitter performance over temperature. The

single-output DSC61xxB MEMS oscillators are

excellent choices for use as clock references in small,

battery-powered devices such as wearable and

Internet of Things (IoT) devices in which small size, low

power consumption, and long-term reliability are

paramount.

The DSC61xxB family is available in ultra-small

1.6 mm x 1.2 mm,

2.0 mm x 1.6 mm,

and

2.5 mm x 2.0 mm packages. These packages are

“drop-in” replacements for standard 4-pin CMOS

quartz crystal oscillators. The Automotive Grade

AEC-Q100 qualified option is also available for this

device.

Package Types

DSC61

2.5 mm x 2.0 mm VLGA

2.0 mm x 1.6 mm VLGA

1.6 mm x 1.2 mm VFLGA

(Top View)

Applications

• Low Power/Portable Applications: IoT,

Embedded/Smart Devices

• Consumer: Home Healthcare, Fitness Devices,

Home Automation

• Industrial: Building/Factory Automation,

Surveillance Camera

• Automotive (Please Refer to the DSA61xx Family)

OE/STDBY/FS

VDD

GND

OUT



2019 - 2021 Microchip Technology Inc. and its subsidiaries

DS20006155B-page 1

DSC61XXB

Block Diagram

DSC61

DIGITAL

CONTROL

OE/STDBY/FS

PIN 1

SUPPLY

REGULATION

VDD

PIN 4

MEMS

RESONATOR

TEMP SENSOR

CONTROL &

COMPENSATION

PLL

VCO

OUTPUT

DIVIDER

DRIVER

OUTPUT

PIN 3

GND

PIN 2

DS20006155B-page 2



2019 - 2021 Microchip Technology Inc. and its subsidiaries

DSC61XXB

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Supply Voltage .......................................................................................................................................... –0.3V to +4.0V

Input Voltage (V

) ..............................................................................................................................–0.3V to V

+0.3V

ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM

ELECTRICAL CHARACTERISTICS

Electrical Characteristics:

Unless otherwise indicated, V

= 1.8V –5% to 3.3V +10%, T

= –40°C to +125°C.

Parameters

Supply Voltage

Power Supply Ramp

Active Supply Current

Standby Supply Current

Output Duty Cycle

Frequency

Frequency Stability

Sym.

STBY

SYM

Δf

Min.

1.71

0.1

—

0.0035

—

0.7 x V

—

Typ.

—

3.0

1.5

—

300

Max.

3.63

100

—

100

±20

±25

±50

±5

±1

1.5

—

0.3 x V

200 +

2 Periods

—

Units

µA

MHz

ppm

Note 1

Note 8

OUT

= 27 MHz, V

= 1.8V, No

Load

= 1.8/2.5V,

Note 2

= 3.3V,

Note 2

—

All temp ranges,

Note 3

1st year @ 25°C

Per year after first year

From 90% V

to valid clock

output, T = 25°C

Input Logic High,

Note 4

Input Logic Low,

Note 4

Note 5

Note 6

If configured,

Note 7

Conditions

Aging

Startup Time

Input Logic Levels

Output Disable Time

Output Enable Time

Enable Pull-up Resistor

Note 1:

Δf

—

ppm

µs

kΩ

Pin 4 V

should be filtered with 0.1 µF capacitor.

Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at

>3.3V V

Includes frequency variations due to initial tolerance, temp. and power supply voltage.

Input waveform must be monotonic with rise/fall time < 10 ms

Output Disable time takes up to two periods of the output waveform + 200 ns.

For parts configured with OE, not Standby.

Output is enabled if pad is floated or not connected.

Time to reach 90% of target V

. Power ramp rise must be monotonic.



2019 - 2021 Microchip Technology Inc. and its subsidiaries

DS20006155B-page 3

DSC61XXB

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

Unless otherwise indicated, V

= 1.8V –5% to 3.3V +10%, T

= –40°C to +125°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Output Logic High, I = 3 mA,

Std. Drive

Output Logic High, I = 6 mA,

High Drive

Output Logic Low, I = –3 mA,

Std. Drive

Output Logic Low, I = –6 mA,

High Drive

DSC61x2

= 1.8V

High Drive,

20% to 80%

= 15 pF V

= 2.5V/3.3V

DSC61x1

= 1.8V

Std Drive,

20% to 80%

= 10 pF V

= 2.5V/3.3V

OUT

27 MHz

OUT

27 MHz

OUT

27 MHz

= 1.8V

= 2.5V/3.3V

= 1.8V

= 2.5V/3.3V

= 1.8V

= 2.5V/3.3V

Output Logic Levels

0.8 x V

—

0.2 x V

—

Output Transition Time

Rise Time/Fall Time

—

Period Jitter, RMS

Cycle-to-Cycle Jitter

(Peak)

Period Jitter

(Peak-to-Peak)

Note 1:

PER

Cy–Cy

—

0.5

1.2

0.6

8.5

1.5

1.0

2.0

1.2

—

RMS

Pin 4 V

should be filtered with 0.1 µF capacitor.

Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at

>3.3V V

Includes frequency variations due to initial tolerance, temp. and power supply voltage.

Input waveform must be monotonic with rise/fall time < 10 ms

Output Disable time takes up to two periods of the output waveform + 200 ns.

For parts configured with OE, not Standby.

Output is enabled if pad is floated or not connected.

Time to reach 90% of target V

. Power ramp rise must be monotonic.

DS20006155B-page 4



2019 - 2021 Microchip Technology Inc. and its subsidiaries

DSC61XXB

TEMPERATURE SPECIFICATIONS (Note

Parameters

Temperature Ranges

Junction Operating Temperature

Storage Ambient Temperature Range

Soldering Temperature

Note 1:

–40

–55

—

+260

+150

—

°C

—

40 sec. max.

Sym.

Min.

Typ.

Max.

Units

Conditions

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., T

, T

, θ

). Exceeding the max-

imum allowable power dissipation will cause the device operating junction temperature to exceed the max-

imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.



2019 - 2021 Microchip Technology Inc. and its subsidiaries

DS20006155B-page 5