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DSC6312ME2BB-001.0000B

LVCMOS Output Clock Oscillator, 1MHz Nom

器件类别:无源元件    振荡器   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

下载文档
器件参数
参数名称
属性值
Objectid
7271629234
Reach Compliance Code
compliant
Country Of Origin
Thailand
YTEOL
6.38
其他特性
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR
最长下降时间
1.5 ns
频率调整-机械
NO
频率稳定性
25%
安装特点
SURFACE MOUNT
标称工作频率
1 MHz
最高工作温度
70 °C
最低工作温度
-20 °C
振荡器类型
LVCMOS
输出负载
15 pF
物理尺寸
2.0mm x 1.6mm x 0.89mm
最长上升时间
1.5 ns
最大供电电压
3.63 V
最小供电电压
1.71 V
表面贴装
YES
最大对称度
55/45 %
文档预览
DSC63XXB
Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
Features
• Output Frequency: 1 MHz to 100 MHz LVCMOS
• Spread Spectrum Options:
- Center-Spread: ±0.25%, ±0.5%, ±1.0%,
±1.5%, ±2.0%, ±2.5%
- Down-Spread: –0.25%, –0.5%, –1.0%,
–1.5%, –2.0%, –3.0%
• Ultra-Low Power Consumption: 3 mA (Active),
1
A (Standby)
• Wide Supply Voltage Range: 1.71V ~ 3.63V V
DD
• Ultra-Small Package Sizes:
- 1.6 mm
1.2 mm
- 2.0 mm
1.6 mm
- 2.5 mm
2.0 mm
• Wide Temperature Range:
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20°C to +70°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTBF than Quartz Oscillators
• Lead Free and RoHS Compliant
• Automotive AEC-Q100 Option Available
General Description
The DSC63xxB family of devices is the industry’s
smallest and lowest-power spread-spectrum MEMS
oscillators. Available in three different package sizes
with operating current as low as 3 mA, the smallest
4-pin package is a mere 1.6 mm x 1.2 mm in size. The
devices support up to ±2.5% or –3% spread spectrum
that can achieve up to 15 dB electromagnetic
interference (EMI) reduction. Because of industry
standard package and pin options, customers can
solve last minute EMI problems simply by placing the
new DSC63xxB on their current board layout with no
redesign required.
The DSC63xxB family is available in 1.6 mm x 1.2 mm
and 2.0 mm x 1.6 mm, and 2.5 mm x 2.0 mm
packages. These packages are “drop-in” replacements
for standard 4-pin CMOS quartz crystal oscillators.
Package Types
DSC63
XX
B
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
OE/STDBY/SSEN
1
4
VDD
Applications
Flat Panel Display/Monitor
Multi-Function Printer
Digital Signage
Consumer Electronics
GND
2
3
OUT
2019 Microchip Technology Inc.
DS20006154A-page 1
DSC63XXB
Block Diagram
DSC63
XX
B
DIGITAL
CONTROL
OE/STDBY/SSEN
PIN 1
SST
MEMS
RESONATOR
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
SUPPLY
REGULATION
VDD
PIN 4
OUTPUT
DIVIDER
DRIVER
OUTPUT
PIN 3
GND
PIN 2
DS20006154A-page 2
2019 Microchip Technology Inc.
DSC63XXB
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (V
IN
) ..............................................................................................................................–0.3V to V
DD
+0.3V
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics:
Unless otherwise indicated, V
DD
= 1.8V –5% to 3.3V +10%, T
A
= –40°C to +125°C.
Parameters
Supply Voltage
Power Supply Ramp
Active Supply Current
Standby Supply Current
Output Duty Cycle
Frequency
Frequency Stability
Sym.
V
DD
t
PU
I
DD
I
STBY
SYM
f
0
∆f
Min.
1.71
0.1
45
1
0.7 x V
DD
Typ.
3.0
1
1.5
300
Max.
3.63
100
55
100
±20
±25
±50
±5
±1
1.5
0.3 x V
DD
200 +
2 Periods
1
Units
V
ms
mA
µA
%
MHz
ppm
Note 1
Note 8
f
OUT
= 27 MHz, V
DD
= 1.8V, No
Load
V
DD
= 1.8/2.5V,
Note 2
V
DD
= 3.3V,
Note 2
All temp ranges,
Note 3
1st year @ 25°C
Per year after first year
From 90% V
DD
to valid clock
output, T = 25°C
Input Logic High,
Note 4
Input Logic Low,
Note 4
Note 5
Note 6
If configured,
Note 7
Conditions
Aging
Startup Time
Input Logic Levels
Output Disable Time
Output Enable Time
OE/STDBY/SSEN Pull-up
Resistor
Note 1:
2:
3:
4:
5:
6:
7:
8:
∆f
t
SU
V
IH
V
IL
t
DA
t
EN
ppm
ms
V
V
ns
µs
kΩ
Pin 4 V
DD
should be filtered with 0.1 µF capacitor.
Not including current through pull-up resistor on EN pin (if configured).
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to two periods of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Time to reach 90% of target V
DD
. Power ramp rise must be monotonic.
2019 Microchip Technology Inc.
DS20006154A-page 3
DSC63XXB
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics:
Unless otherwise indicated, V
DD
= 1.8V –5% to 3.3V +10%, T
A
= –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output Logic High, I = 3 mA,
Std. Drive
Output Logic High, I = 6 mA,
High Drive
Output Logic Low, I = –3 mA,
Std. Drive
Output Logic Low, I = –6 mA,
High Drive
DSC61x2
V
DD
= 1.8V
High Drive,
20% to 80%
C
L
= 15 pF V
DD
= 2.5V/3.3V
DSC61x1
V
DD
= 1.8V
Std Drive,
20% to 80%
C
L
= 10 pF V
DD
= 2.5V/3.3V
V
DD
= 1.8V
V
DD
= 2.5V/3.3V
V
DD
= 1.8V
V
DD
= 2.5V/3.3V
V
DD
= 1.8V
V
DD
= 2.5V/3.3V
V
OH
Output Logic Levels
V
OL
0.8 x V
DD
V
0.2 x V
DD
V
t
RX
/t
FX
Output Transition Time
Rise Time/Fall Time
t
RY
/t
FY
Period Jitter, RMS
Cycle-to-Cycle Jitter
(Peak)
Period Jitter
(Peak-to-Peak)
Spread Spectrum
Modulation Frequency
Note 1:
2:
3:
4:
5:
6:
7:
8:
J
PER
J
Cy–Cy
J
PP
f
SS
1
0.5
1.2
0.6
8.5
7
50
35
70
60
33
1.5
1.0
2.0
1.2
70
60
ns
ns
ns
ns
f
OUT
=
ps
RMS
27 MHz,
Spread Off
ps
f
OUT
=
27 MHz,
Spread Off
f
OUT
=
27 MHz,
Spread Off
ps
kHz
Pin 4 V
DD
should be filtered with 0.1 µF capacitor.
Not including current through pull-up resistor on EN pin (if configured).
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to two periods of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Time to reach 90% of target V
DD
. Power ramp rise must be monotonic.
DS20006154A-page 4
2019 Microchip Technology Inc.
DSC63XXB
SPREAD SPECTRUM
Ordering Code
A
B
C
D
E
F
G
H
I
J
K
L
M
Spread Percentage
±0.25%
±0.5%
±1.0%
±1.5%
±2.0%
±2.5%
–0.25%
–0.5%
–1.0%
–1.5%
–2.0%
–3.0%
Custom
Spread Type
Center-Spread
Center-Spread
Center-Spread
Center-Spread
Center-Spread
Center-Spread
Down-Spread
Down-Spread
Down-Spread
Down-Spread
Down-Spread
Down-Spread
Center-Spread or Down-Spread
TEMPERATURE SPECIFICATIONS (Note
1)
Parameters
Temperature Ranges
Junction Operating Temperature
Storage Ambient Temperature Range
Soldering Temperature
Note 1:
T
J
T
A
T
S
–40
–55
+260
+150
+150
°C
°C
°C
40 sec. max.
Sym.
Min.
Typ.
Max.
Units
Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
θ
JA
). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2019 Microchip Technology Inc.
DS20006154A-page 5
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