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DY243Z300L

Trans Voltage Suppressor Diode

器件类别:分立半导体    二极管   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Reach Compliance Code
compliant
ECCN代码
EAR99
二极管类型
TRANS VOLTAGE SUPPRESSOR DIODE
湿度敏感等级
1
峰值回流温度(摄氏度)
NOT SPECIFIED
处于峰值回流温度下的最长时间
NOT SPECIFIED
Base Number Matches
1
文档预览
Doc No.
TT4-EA-14923
Revision.
1
Product Standards
TVS Diode
DY243Z300L
DY243Z300L
Silicon epitaxial planar type
Unit: mm
For ESD protection and transient voltage suppressor
Features
IEC 61000-4-2 (ESD) ±30kV (air and contact)
Low Clamping Voltage
Low Capacitance
Low Leak Current
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
2.4
2
0.15
Marking Symbol: 5V
Packaging
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
1
1.75
1. Cathode
2. Anode
3.8
4.7
0.85
Absolute Maximum Ratings Ta = 25
C
Parameter
Symbol
Total power dissipation
Forward current
Electrostatic discharge
*2
Electrostatic discharge
*3
Peak pulse power
*4
Peak pulse current
*4
Junction temperature
Operating ambient temperature
Storage temperature
Note:
*1
Rating
2
200
±30
±30
1000
121
150
-40 to +85
-55 to +150
Unit
W
mA
kV
kV
W
A
°C
°C
°C
Panasonic
JEITA
Code
TMiniP2-F2-B
SC-110A
PT
IF
ESD
ESD
Ppp
Ipp
Tj
Topr
Tstg
Internal Connection
2
Electrical Characteristics Ta = 25
C 
3
C
Parameter
Symbol
Forward voltage
Reverse stand-off voltage
Reverse breakdown voltage
Reverse current
Clamping voltage
*3
Terminal capacitance
*1, *2
*1 Mounted on ceramics print circuit board. (Board size: 50 mm × 50 mm)
Board thickness: 0.8 mm Soldering size: 2 mm × 2 mm
*2 Test method:IEC61000_4_2
(C = 150 pF,R = 330
,
contact discharge:10 times)
*3 Test method:IEC61000_4_2
(C = 150 pF,R = 330, air discharge:10 times)
*4 Test method:IEC61000_4_5 ( tp = 8/20s, Unrepeated )
1
Conditions
IF = 200mA
IR = 20mA
VR = 3.3V
Ipp = 121A, tp = 8/20
s
VR = 0 V, f = 1 MHz
Min
5.32
Typ
5.6
Max
1.2
3.3
5.88
100
13
Unit
V
V
V
A
V
pF
1280
Note: 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031
8s×20s Pulse Waveform
Measuring methods for Diodes.
2. Absolute frequency of input and output is 5 MHz.
3. *1 The temperature must be controlled 25°C for VBR mesurement.
VBR value measured at other temperature must be
adjusted to VBR (25°C)
*2 VBR guaranted 20 ms after current flow.
*3 8s×20s Pulse Waveform
VF
VRWM
VBR
IR
Vc
Ct
Percent of Ipp
100
90
T2
Front time:
T1 = 1.25 × T = 8s±20%
Time to half value:
T2 = 20s±20%
50
10
T
T1
t
Page 1 of 3
Established : 2014-01-07
Revised
: ####-##-##
Doc No.
TT4-EA-14923
Revision.
1
Product Standards
TVS Diode
DY243Z300L
Technical Data ( reference )
PT - Ta
2.5
Total power dissipation PT (W)
IR - VBR
1.E-01
Ta = 25
1.5
1
0.5
0
0
20
40
60
80 100 120 140 160 180 200
Ambient temperature Ta (℃)
Reverse current IR (A)
2
Mounted on ceramics print board.
Board size : 50 mm × 50 mm × 0.8 mm
Solder in : 2 mm x 2 mm
1.E-02
1.E-03
1.E-04
1.E-05
1.E-06
0
2
4
6
8
10
Reverse breakdown voltage VBR (V)
IR - VR
1.E-05
1.E-06
Reverse current IR (A)
1.E-07
1.E-08
1.E-09
1.E-10
1.E-11
1.E-12
0
0.5
1
1.5
2
2.5
3
3.5
Reverse voltage VR (V)
Ct - VR
2000
Terminal capacitance Ct (pF)
Ta = 25
1500
Ta = 25
f = 1 MHz
1000
500
0
0
0.5
1
1.5
2
2.5
Reverse voltage VR (V)
3
3.5
Page 2 of 3
Established : 2014-01-07
Revised
: ####-##-##
Doc No.
TT4-EA-14923
Revision.
1
Product Standards
TVS Diode
DY243Z300L
TMiniP2-F2-B
2.4
±0.1
2
Unit: mm
0.15
±0.05
3.8
±0.1
4.7
±0.1
1
1.75
±0.10
0.45
±0.10
(5°)
0.85
±0.05
(5°)
Land Pattern (Reference) (Unit: mm)
2.1
1.4
4.4
0 to 0.03
1.4
0 to 0.4
Page 3 of 3
Established : 2014-01-07
Revised
: ####-##-##
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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