L6210
Dual Schottky diode bridge
Features
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Monolithic array of eight Schottky diodes
High efficiency
4 A peak current
Low forward voltage
Fast recovery
Time two separated diode bridges
Description
The L6210 is a monolithic IC containing eight
Schottky diodes arranged as two separated diode
bridges.
This diodes connection makes this device
versatile in many applications.
They are used particular in bipolar stepper motor
applications, where high efficient operation, due
to low forward voltage drop and fast reverse
recovery time, are required.
Table 1. Device summary
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Order code
E-L6210
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PDIP 16
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The L6210 is available in a 16 pin powerdip
package (12 + 2 + 2) designed for the 0 to 70°C
ambient temperature range.
Package
PDIP 16
Packing
Tube
April 2008
Rev 2
1/8
www.st.com
8
Contents
L6210
Contents
1
2
Block and pin connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
2.2
2.3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
4
5
Mounting instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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L6210
Block and pin connection diagram
1
Block and pin connection diagram
Figure 1.
Block diagram
Figure 2.
Pin connection (top view)
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Electrical specifications
L6210
2
2.1
Electrical specifications
Absolute maximum ratings
Table 2.
Symbol
I
F
V
R
T
AMB
T
STG
Absolute maximum ratings
Parameter
Repetitive Forward Current Peak
Peak Reverse Voltage (per diode)
Operating Ambient Temperature
Storage Temperature Range
Value
2
50
70
–55 to +150
Unit
A
V
2.2
Thermal data
Table 3.
Symbol
R
TH J-CASE
R
TH J-AMB
Thermal data
Parameter
Thermal Impedance Junction-case
Thermal Impedance Junction-ambient without
External Heatsink
2.3
Electrical characteristics
Table 4.
Symbol
b
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F
I
L
Electrical characteristics
(T
J
= 25°C unless otherwise specified)
Parameter
Test conditions
I
F
= 100 mA
I
F
= 500 mA
I
F
= 1 A
Leakage Current
V
R
= 40 V, T
AMB
= 25 °C
Min.
Typ.
0.65
0.8
1
Max.
0.8
1
1.2
1
Unit
V
V
V
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°C
Unit
°C/W
°C/W
°C
Typ.
Max.
14
65
Forward Voltage Drop
Note:
At forward currents of greater than 1 A, a parasitic current of approximately 10 mA may be
collected by adiacent diodes.
4/8
L6210
Mounting instructions
3
Mounting instructions
The R
th j-am
b of the L6210 can be reduced by soldering the GND pins to suitable copper
area of the printed circuit boards as shown in
Figure 3
or to an external heatsink (Figure
4).
During soldering the pin temperature must not exceed 260°C and the soldering time must
not be longer then 12 s. The external heatsink or printed circuit copper area must be
connected to electrical ground.
Figure 3.
Example of PC board copper area which is used as heatsink
Figure 4.
Example of an external heatsink
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