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E1UGA16-19.500M

Quartz Crystal Resonator HC49/US Short Thru-Hole 2.5mm Height Metal Resistance Weld Seal 19.500MHz ±15ppm/30ppm over 0°C to +70°C

器件类别:无源元件    晶体/谐振器   

厂商名称:ECLIPTEK

厂商官网:http://www.ecliptek.com

器件标准:  

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器件参数
参数名称
属性值
Brand Name
Ecliptek
是否无铅
不含铅
是否Rohs认证
符合
零件包装代码
HC-49/US Short
包装说明
ROHS AND REACH COMPLIANT, RESISTANCE WELDED, METAL, HC49/US, 2 PIN
针数
2
制造商包装代码
HC-49/US Short
Reach Compliance Code
compliant
其他特性
AT-CUT; BULK
老化
5 PPM/YEAR
晶体/谐振器类型
PARALLEL - FUNDAMENTAL
驱动电平
1000 µW
频率稳定性
0.003%
频率容差
15 ppm
JESD-609代码
e4
负载电容
16 pF
制造商序列号
E1U
安装特点
THROUGH HOLE MOUNT
标称工作频率
19.5 MHz
最高工作温度
70 °C
最低工作温度
物理尺寸
L11.18XB4.7XH2.5 (mm)/L0.44XB0.185XH0.098 (inch)
串联电阻
50 Ω
表面贴装
NO
端子面层
Nickel/Gold (Ni/Au)
Base Number Matches
1
文档预览
E1UGA16-19.500M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Aug 31, 2020)
191 SVHC
ITEM DESCRIPTION
Quartz Crystal Resonator HC49/US Short Thru-Hole 2.5mm Height Metal Resistance Weld Seal 19.500MHz ±15ppm at 25°C,
±30ppm over 0°C to +70°C 16pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance
Equivalent Series Resistance
Mode of Operation
Drive Level
Storage Temperature Range
Insulation Resistance
19.500MHz
±15ppm at 25°C, ±30ppm over 0°C to +70°C
±5ppm/year Maximum
16pF Parallel Resonant
7pF Maximum
50 Ohms Maximum
AT-Cut Fundamental
1mWatt Maximum
-55°C to +125°C
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Lead Integrity
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
MIL-STD-202, Method 213, Condition C
MIL-STD-883, Method 1004
J-STD-020, MSL1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 1 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
E1UGA16-19.500M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
E19.500M
E=Ecliptek Designator
6.35
MIN
DIA 0.457
±0.051(X2)
11.18
MAX
4.88 ±0.20
2.50 MAX
4.70
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 2 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
E1UGA16-19.500M
Recommended Solder Reflow Methods
High Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads only.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 3 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
E1UGA16-19.500M
Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times
5°C/Second Maximum
N/A
Level 1
Temperatures shown are applied to back of PCB board and device leads only.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to back of PCB board and
device leads only.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to back of PCB board and device
leads only.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 4 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
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