ACT2813 Demo Board
Application Report
Rev 0, 12-Mar-2015
Dedicated 5V/2.4A Power Bank Solution
FEATURES
2.4A battery charge current
5V/2.4A boost output current
5.0V+/- 100mV output voltage
Single chip integration solution with minimal component count
Prioritized power path from input to output
91% charge efficiency and 94% discharge efficiency
Accommodation for 10mA-3000mA input current
Patent-pending constant output current control
Battery disconnected at output short to ground
<10uA battery drain current in HZ mode
Automatic shut-down at no load and turns on by push button or device plug-in
4 LEDs indicating battery level and charge status with battery impedance compensation
Preconditioning, fast charge, top off and end of charge in battery charge mode
Battery OTP, OVP and OCP
Charge current foldback at 110
℃
die temperature
IC over temperature protection
FCQFN4x4-20 package
SPECIFICATION
Input voltage
4.7 - 5.5V
Boost output voltage
5.0V
Battery charge current
2.4A
Boost output current
2.4A
Active-Semi, Inc.
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ACT2813: Dedicated 5V/2.4A Power Bank Solution
TABLE OF CONTENT
1.
2.
3.
4.
5.
DEMO BOARD PHOTOS...................................................................................................................................................
3
SCHEMATICS.......................................................................................................................................................................3
BILL OF MATERIALS........................................................................................................................................................ 4
PCB LAYOUT GUIDANCE.................................................................................................................................................
5
FUNCTIONAL TEST............................................................................................................................................................
6
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
6.
B
ATTERY
C
HARGE
V/I P
ROFILE
.......................................................................................................................................6
C
HARGE
E
FFICIENCY
....................................................................................................................................................... 6
B
OOST
O
UTPUT
R
EGULATION
......................................................................................................................................... 7
B
OOST
E
FFICIENCY AND
P
OWER
L
OSS
(T
A
=25℃)..........................................................................................................7
B
ATTERY
L
EAKAGE
C
URRENT IN
HZ M
ODE
................................................................................................................... 8
B
OOST
S
TANDBY
P
OWER
(T
A
=25℃)...............................................................................................................................8
B
OOST
C
ONSTANT
C
URRENT AND
C
ONSTANT
V
OLTAGE
R
EGULATION
(T
A
=27℃).........................................................9
R
IPPLE AND
N
OISE
........................................................................................................................................................ 10
L
OAD
D
YNAMIC
R
ESPONSE
L
OAD
S
TEP
(V
BAT
=3.7V).................................................................................................10
S
YSTEM
M
ANAGEMENT
................................................................................................................................................. 10
LED I
NDICATION
........................................................................................................................................................... 11
K
EY
C
OMPONENTS
T
EMPERATURE
T
EST
(T
A
=27℃,
BURNING FOR
2
HOURS
)...............................................................11
EMI TEST.............................................................................................................................................................................12
Active-Semi, Inc.
www.active-semi.com
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ACT2813: Dedicated 5V/2.4A Power Bank Solution
1. Demo Board Photos
(DEMO BOARD SIZE: 46.4mm*21.2mm)
Push button
LED indication
OUTPUT
INPUT
2. Schematics
R5
R6
LED2 LED3 LED4 RIMC BLVS
LED1
TH
R17
R12
R15
R4
ICST
HZ
R3
IOST
CSP
ACT2813
PB
R16
R13
C6
nPG
AGND
SW
VOUT
VIN
C7
VBAT/CSN
PGND
SW
R10
D2
Input USB
+
D-
R7
R8
C2
R2
D1
BAT
C9
R1
L1
R18
C10
C5
Q1
R9
C1
D+
-
+
D-
Q2
C11
C3
C4
R19
D+
-
Output USB
C8
R20
R22
R21
R23
Active-Semi, Inc.
www.active-semi.com
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ACT2813: Dedicated 5V/2.4A Power Bank Solution
3.
Bill of Materials
ITEM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Active-Semi, Inc.
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REFERENCE
L1
Q1
Q2
D1
D2
C1
C2,C3,C4,C9
C5,C6
C7
C8
C10
C11
R1,R2
R3,R10
R4
R5
R6
R7,R8,R12
R9
R13
R15
R16,R19
R17
R18
R20,R22
R21,R23
LED1,LED2 LED3,LED4
PB
USB
Micro-USB
U1
DESCRIPTION
Core, 6.5*3*3 Dip, 2.2uH, 6A, Rdson=5mΩ
AO4453, Rdson=19mΩ at VGS = - 4.5 V
MMBT3906
SBR3U20SA, 20V/3A Schottky
1N4148, Vf=0.7V, 75V Schottky
Ceramic capacitor, 4.7uF/10V, X7R, 0805
Ceramic capacitor, 22uF/10V, X7R, 1206
Ceramic capacitor, 2.2uF/10V, X7R, 0603
Ceramic capacitor, 10nF/10V, X7R, 0603
Ceramic capacitor, 0.1uF/10V, X7R, 0603
Ceramic capacitor, 10uF/10V, X7R, 0805
Ceramic capacitor, 4.7nF/10V, X7R, 0603
Chip Resistor, 50mΩ, 1/4W, 1%, 1206
Chip Resistor, 100kΩ, 1/10W, 1%, 0603
Chip Resistor, 48kΩ, 1/10W, 1%, 0603
Chip Resistor, 68kΩ, 1/10W, 5%, 0603
Chip Resistor, 60.4kΩ, 1/10W, 1%, 0603
Chip Resistor, 0Ω, 1/10W, 1%, 0603
Chip Resistor, 2.7Ω, 1/8W, 1%, 0805
Chip Resistor, 100Ω, 1/10W, 1%, 0603
Chip Resistor, 715kΩ, 1/10W, 5%, 0603
Chip Resistor, 200kΩ, 1/10W, 5%, 0603
Chip Resistor, 10kΩ, 1/10W, 5%, 0603
Chip Resistor, 0.47Ω, 1/4W, 1%, 1206
Chip Resistor, 43.2kΩ, 1/10W, 1%, 0603
Chip Resistor, 49.9kΩ, 1/10W, 1%, 0603
LED, 0603, Blue
Push Button
10.2*14.6*7mm, 4P, DIP
MICRO USB 5P/F SMT B
IC, ACT2813, FCQFN 4x4-20
-
4
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QTY MANUFACTURER
1
1
1
1
1
1
4
2
1
1
1
1
2
2
1
1
1
3
1
1
1
2
1
1
2
2
4
1
1
1
1
ACT
Sunlord
AOS
Vishay
Diodes
Vishay
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
LED Manu
LED Manu
ACT2813: Dedicated 5V/2.4A Power Bank Solution
4. PCb Layout Guidance
When laying out the printed circuit board, the following checklist should be used to ensure proper
operation of the IC.
1. Place input decoupling ceramic capacitor C1 and R9 as close to VIN pin as possible. Resistor R9 is
added in series with capacitor C1 to damp the potential LC resonance.
2. Use copper plane for power GND for best heat dissipation and noise immunity.
3. Place CSP and CSN capacitor C7 (10nF) close to CSP and CSN pin as possible, use Kevin Sense from
sense resistor R1 and R2 to CSP and CSN pins. 22uF decoupling capacitor is added close to VBAT
pin.
4. Place the ceramic capacitor C2 and D1 as close to VOUT and PGND as possible, SW goes under the
C2 (recommend C2 to use 1206 size). SW pad is a noisy node switching. It should be isolated away
from the rest of circuit for good EMI and low noise operation.
5. RC snubber is recommended to add across SW to PGND to reduce EMI noise.
*C2 must be placed close to VOUT and PGND pins
Active-Semi, Inc.
www.active-semi.com
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