EB13C3G2H-25.000M
Series
RoHS Compliant (Pb-free) Low Current 3.3V 4 Pad
5mm x 7mm Ceramic SMD LVCMOS Oscillator
Frequency Tolerance/Stability
±100ppm over -40°C to +85°C
Duty Cycle
50 ±5(%)
RoHS
Pb
EB13C3 G 2 H -25.000M
Nominal Frequency
25.000MHz
Logic Control / Additional Output
Tri-State (High Impedance)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
25.000MHz
±100ppm over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency
Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year
Aging at 25°C, Shock, and Vibration)
3.3Vdc ±10%
3mA Maximum
90% of Vdd Minimum
-1.6mA
10% of Vdd Maximum
+1.6mA
6nSec Maximum (Measured at 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Tri-State (High Impedance)
90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High
Impedance)
10µA Maximum (Disabled Output: High Impedance)
25pSec Maximum
10mSec Maximum
-55°C to +125°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Input Current Logic High (Ioh)
Output Voltage Logic Low (Vol)
Input Current Logic Low (Iol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Logic Control / Additional Output
Tri-State Input Voltage (Vih and Vil)
Standby Current
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 1 of 5
EB13C3G2H-25.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Tri-State
Ground
Output
Supply Voltage
7.00
±0.15
3
5.00
±0.15
MARKING
ORIENTATION
2
1.4 ±01
5.08
±0.15
4
2.60
±0.15
1
1.2 ±0.2
3.68
±0.15
1
2
3
4
LINE MARKING
1
2
3
ECLIPTEK
25.000M
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 2 of 5
EB13C3G2H-25.000M
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 3 of 5
EB13C3G2H-25.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 4 of 5
EB13C3G2H-25.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 5 of 5
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