型号
- 型号
- 关键词
| 型号 | EBE41UF8ABDA-6E-E | EBE41UF8ABDA-8G-F | EBE41UF8ABDA-8G-E | EBE41UF8ABDA-6E-F | EBE41UF8ABDA |
|---|---|---|---|---|---|
| 描述 | 4GB DDR2 SDRAM SO-DIMM | 4GB DDR2 SDRAM SO-DIMM | 4GB DDR2 SDRAM SO-DIMM | 4GB DDR2 SDRAM SO-DIMM | 4GB DDR2 SDRAM SO-DIMM |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | ELPIDA | ELPIDA | ELPIDA | ELPIDA | - |
| 零件包装代码 | SODIMM | SODIMM | SODIMM | SODIMM | - |
| 包装说明 | DIMM, DIMM200,24 | DIMM, DIMM200,24 | DIMM, DIMM200,24 | DIMM, DIMM200,24 | - |
| 针数 | 200 | 200 | 200 | 200 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | - |
| 最长访问时间 | 0.45 ns | 0.4 ns | 0.4 ns | 0.45 ns | - |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - |
| 最大时钟频率 (fCLK) | 333 MHz | 400 MHz | 400 MHz | 333 MHz | - |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | - |
| JESD-30 代码 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | - |
| 内存密度 | 34359738368 bi | 34359738368 bi | 34359738368 bi | 34359738368 bi | - |
| 内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | - |
| 内存宽度 | 64 | 64 | 64 | 64 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 200 | 200 | 200 | 200 | - |
| 字数 | 536870912 words | 536870912 words | 536870912 words | 536870912 words | - |
| 字数代码 | 512000000 | 512000000 | 512000000 | 512000000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 组织 | 512MX64 | 512MX64 | 512MX64 | 512MX64 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | - |
| 封装等效代码 | DIMM200,24 | DIMM200,24 | DIMM200,24 | DIMM200,24 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 刷新周期 | 8192 | 8192 | 8192 | 8192 | - |
| 自我刷新 | YES | YES | YES | YES | - |
| 最大待机电流 | 0.24 A | 0.24 A | 0.24 A | 0.24 A | - |
| 最大压摆率 | 2.64 mA | 2.8 mA | 2.8 mA | 2.64 mA | - |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | - |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 表面贴装 | NO | NO | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子节距 | 0.6 mm | 0.6 mm | 0.6 mm | 0.6 mm | - |
| 端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
