型号
- 型号
- 关键词
128MB 32-bit Direct Rambus DRAM RIMM⑩ Module
厂商名称：ELPIDA
厂商官网：http://www.elpida.com/en
下载文档| 型号 | EBR12EC8ABKD-AD | EBR12EC8ABKD-AE | EBR12EC8ABKD-AEP | EBR12EC8ABKD | EBR12EC8ABKD-8C |
|---|---|---|---|---|---|
| 描述 | 128MB 32-bit Direct Rambus DRAM RIMM⑩ Module | 128MB 32-bit Direct Rambus DRAM RIMM⑩ Module | 128MB 32-bit Direct Rambus DRAM RIMM⑩ Module | 128MB 32-bit Direct Rambus DRAM RIMM⑩ Module | 128MB 32-bit Direct Rambus DRAM RIMM⑩ Module |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | ELPIDA | ELPIDA | ELPIDA | - | ELPIDA |
| 零件包装代码 | DMA | DMA | DMA | - | DMA |
| 包装说明 | DIMM, DIMM232,40 | DIMM, DIMM232,40 | DIMM, DIMM232,40 | - | DIMM, DIMM232,40 |
| 针数 | 232 | 232 | 232 | - | 232 |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 访问模式 | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | - | BLOCK ORIENTED PROTOCOL |
| 最长访问时间 | 35 ns | 32 ns | 32 ns | - | 40 ns |
| 其他特性 | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | - | SELF CONTAINED REFRESH |
| 最大时钟频率 (fCLK) | 1066 MHz | 1066 MHz | 1066 MHz | - | 800 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | - | COMMON |
| JESD-30 代码 | R-XDMA-N232 | R-XDMA-N232 | R-XDMA-N232 | - | R-XDMA-N232 |
| 内存密度 | 1207959552 bi | 1207959552 bi | 1207959552 bi | - | 1207959552 bi |
| 内存集成电路类型 | RAMBUS DRAM MODULE | RAMBUS DRAM MODULE | RAMBUS DRAM MODULE | - | RAMBUS DRAM MODULE |
| 内存宽度 | 36 | 36 | 36 | - | 36 |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端口数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 232 | 232 | 232 | - | 232 |
| 字数 | 33554432 words | 33554432 words | 33554432 words | - | 33554432 words |
| 字数代码 | 32000000 | 32000000 | 32000000 | - | 32000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 组织 | 32MX36 | 32MX36 | 32MX36 | - | 32MX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | - | DIMM |
| 封装等效代码 | DIMM232,40 | DIMM232,40 | DIMM232,40 | - | DIMM232,40 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | - | 225 |
| 电源 | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | - | 1.8/2.5,2.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 自我刷新 | YES | YES | YES | - | YES |
| 最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | - | 2.63 V |
| 最小供电电压 (Vsup) | 2.37 V | 2.37 V | 2.37 V | - | 2.37 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V |
| 表面贴装 | NO | NO | NO | - | NO |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD |
| 端子节距 | 1 mm | 1 mm | 1 mm | - | 1 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |