EC4SME-3.6864M TR
EC4SM E
Series
4.0mm Epoxy Base SMD Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
-3.6864M TR
Packaging Options
Tape and Reel
Nominal Frequency
3.6864MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Storage Temperature Range
Insulation Resistance
3.6864MHz
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±5ppm/year Maximum
18pF Parallel Resonant
7pF Maximum
200 Ohms Maximum
AT-Cut Fundamental
1mWatts Maximum
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Connected to Pin 4 and to
Crystal
Connected to Pin 3 and to
Crystal
Connected to Pin 2 and to
Crystal
Connected to Pin 1 and to
Crystal
4
4.95
MAX
1
12.5
MAX
MARKING
ORIENTATION
1
3
2.0 REF
2
3
2
4
LINE MARKING
4.0
MAX
1.3 ±0.1
(x4)
1.2 ±0.1
9.0 ±0.1
1
E3.6864
E=Ecliptek Designator
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 8/12/2010 | Page 1 of 4
EC4SME-3.6864M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.2 (X4)
2.3 (X4)
6.7
Solder Land
(X4)
1.3
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 8/12/2010 | Page 2 of 4
EC4SME-3.6864M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 ±0.1
0.40 ±0.05
11.5 ±0.1
24.0 ±0.3
10.75 ±0.10
12.5
±0.1
12.0 ±0.1
*Compliant to EIA 481A
5.4 ±0.1
4.2 ±0.1
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
30.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
24.4 +2.0/-0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 8/12/2010 | Page 3 of 4
EC4SME-3.6864M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 225°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
225°C Maximum
225°C Maximum 2 Times
80 seconds Maximum 2 Times
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 8/12/2010 | Page 4 of 4
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