EC4SME-3.6864M
EC4SM E
Series
4.0mm Epoxy Base SMD Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
-3.6864M
Nominal Frequency
3.6864MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Storage Temperature Range
Insulation Resistance
3.6864MHz
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±5ppm/year Maximum
18pF Parallel Resonant
7pF Maximum
200 Ohms Maximum
AT-Cut Fundamental
1mWatts Maximum
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Connected to Pin 4 and to
Crystal
Connected to Pin 3 and to
Crystal
Connected to Pin 2 and to
Crystal
Connected to Pin 1 and to
Crystal
4
4.95
MAX
1
12.5
MAX
MARKING
ORIENTATION
1
3
2.0 REF
2
3
2
4
LINE MARKING
4.0
MAX
1.3 ±0.1
(x4)
1.2 ±0.1
9.0 ±0.1
1
E3.6864
E=Ecliptek Designator
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 1 of 3
EC4SME-3.6864M
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.2 (X4)
2.3 (X4)
6.7
Solder Land
(X4)
1.3
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 2 of 3
EC4SME-3.6864M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 225°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
225°C Maximum
225°C Maximum 2 Times
80 seconds Maximum 2 Times
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 3 of 3
