首页 > 器件类别 > 无源元件 > 振荡器

ECCM9FA22-16.000M TR

CRYSTALS 30/50 -40+85 22PF 16.000MHZ ATCUT ATCUT FUND 5.0X3.2MM 4PAD SMD

器件类别:无源元件    振荡器   

厂商名称:ECLIPTEK

厂商官网:http://www.ecliptek.com

器件标准:  

下载文档
器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Reach Compliance Code
unknown
文档预览
ECCM9FA22-16.000M
Series
RoHS Compliant (Pb-free) 3.2mm x 5mm Ceramic SMD
Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
ECCM9 F A 22 -16.000M
Nominal Frequency
16.000MHz
Load Capacitance
22pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Crystal Cut
Spurious Response
Storage Temperature Range
Insulation Resistance
16.000MHz
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±3ppm/Year Maximum
22pF Parallel Resonant
7pF Maximum
60 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum, 10µWatts Correlation
AT-Cut
>3dB from Fo to Fo+5000ppm
-40°C to +125°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
3.2
±0.2
MARKING
ORIENTATION
3
5.0
±0.2
4
2
1
1.4 ±0.1
1.2 ±0.1 (X4)
2
3
4
2
2.6
±0.1
3
LINE MARKING
1
2
E16.00
E=Ecliptek
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
1
1.0
MAX
1
4
0.9 ±0.1
(X4)
Note: Chamfer not shown.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/16/2010 | Page 1 of 4
ECCM9FA22-16.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.5 (X4)
2.3
Solder Land
(X4)
1.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/16/2010 | Page 2 of 4
ECCM9FA22-16.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/16/2010 | Page 3 of 4
ECCM9FA22-16.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/16/2010 | Page 4 of 4
查看更多>
参数对比
与ECCM9FA22-16.000M TR相近的元器件有:ECCM9FA22-16.000M。描述及对比如下:
型号 ECCM9FA22-16.000M TR ECCM9FA22-16.000M
描述 CRYSTALS 30/50 -40+85 22PF 16.000MHZ ATCUT ATCUT FUND 5.0X3.2MM 4PAD SMD QUARTZ CRYSTAL RESONATOR, 16MHz, ROHS COMPLIANT, MINIATURE, CERAMIC PACKAGE-4
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
Reach Compliance Code unknown compliant
看泰克 wifi 讲座,就有机会赢得蓝牙耳机等礼品,快来答题参加吧
追赶 WiFi 浪潮,看泰克技术讲座,答题好赢礼!( 第一期获奖名单已出, 点击此处查看详情...
hi5 测试/测量
嵌入式基本开发步骤总结
以LED灯开发为例子 1、为控制LED灯,知道要使用GPIO外设。 2、了解GPI...
Jacktang 微控制器 MCU
电路中电容的十二大功能,你知道吗?
电容是电子设计中最常用的元器件之一,那电容到底在电路中起到什么作用呢? 1. 旁路电容 用于旁路...
模拟IC 模拟与混合信号
单片机学习深入必要的几个步骤
成为一名嵌入式工程师,简单的单片机基础学习与应用是不可缺少的。学习单片机就是学习单片机的硬件结构,...
扫IC网`Allen stm32/stm8
电源滤波和负载去耦的问题
因为电源不干净,有几mV高的噪声,放大看是100MHz左右的窄脉冲,所以加了LC-PI型滤波电路,...
jelly_bessie 电源技术
2024 DigiKey创意大赛】职场提神法宝项目-问题排查
先说结论:淘宝买的电阻太不靠谱了,电阻开路导致驱动继电器电路异常 调试过程发现4号引脚...
eew_cT3H5d DigiKey得捷技术专区
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消