Aluminum Electrolytic Capacitor/TU
Snap-in Type
Series:
U
Type :
T
Discontinued
-40 to + 85°C
16 to 250 V .DC
1000 to 82000 µ F
-25 to + 85°C
315 to 450 V .DC
330 to 1200 µ F
±20 % (120Hz/+20°C)
s
Features
Endurance :85°C 2000 h
s
Specification
Operating temp. range
Rated W.V. range
Nominal cap. range
Capacitance tol.
DC leakage current
3ÖCV (µA) max. after 5 min.
C : Capacitance (µF), V : W.V(V.DC)
Rated W.V.
Body
Dia.
(mm)
35.5
40.0
16V
0.45
0.50
25V
0.40
0.45
35V
0.35
0.40
50V
0.30
0.35
63V
0.25
0.30
80V
0.25
0.25
100V
0.20
0.20
160 ~ 450V
0.15
0.15
tan
δ
(120Hz / +20°C)
(max.)
Frequency Correction
Factor for Ripple
Current
Capacitance > 39000µF: Please add following calculated value.
rated capacitance - 39000µF
x 0.1
10000µF
50
60
100
120
500
Frequency (Hz)
C.F.
16 ~ 100 V
160 ~ 450V
0.93
0.75
0.95
0.80
0.99
0.95
1.00
1.00
1.05
1.20
1k
1.08
1.25
10k to 50k
1.15
1.40
After 2000 hours application of DC voltage with specified ripple current (< rated DC working
voltage) at +85°C, the capacitor shall meet the following limits.
Endurance
Capacitance change
tan d
DC leakage current
<
±20% of initial measured value
<
175% of the initial specified value
<
Initial specified value
Shelf life
After storage for 500 hours at +85°C with no voltage application, the capacitor shall meet the
specified limits for “Endurance”.
E
C
Commom code
E
T
Shape
W.V. code
U
Series code
Capacitance code
Case code Suffix
s
Dimentions in mm (not to scale)
Vinyl sleeve
φD+1.0
max
Safety
vent
(mm)
°
60
60
°
30
°
C
4-φ2.0±0.1
B
A
0.8
-
0.1
+0.2
2.0 max
L ± 2.0
φ22.5
1.5±0.2
PC Board Mounting Holes
φD±1
6.3±1
Remark : The lands for dummy terminals (A & C) have
to be free from the circuit of P.C.B.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and /or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
(4.0)
dummy
6.3±1.0
φ22.5
30
°
Mar. 2005
Ñ
EE33
Ñ
Aluminum Electrolytic Capacitor/TU
Discontinued
s
Case size table
w.v.(v)
Case
size(mm)
φDxL
35.5 x 51
35.5 x 61
35.5 x 81
40
40
40
x 51
x 61
x 81
Charact.
Code
16(1C)
Cap.
(µF)
47000
56000
68000
56000
68000
82000
Ripple
current
(+85°C)
(120Hz/A)
25(1E)
Cap.
(µF)
33000
39000
47000
39000
47000
68000
Ripple
current
(+85°C)
(120Hz/A)
35(1V)
Cap.
(µF)
22000
27000
39000
27000
33000
47000
Ripple
current
(+85°C)
(120Hz/A)
50(1H)
Cap.
(µF)
15000
18000
22000
18000
22000
27000
Ripple
current
(+85°C)
(120Hz/A)
J
K
L
V
W
X
5.1
5.6
6.2
5.8
6.4
7.0
5.0
5.4
5.9
5.6
6.1
7.3
4.5
5.0
6.0
4.9
5.4
6.4
4.1
4.5
5.0
4.4
4.8
5.3
w.v.(v)
Case
size(mm)
φDxL
35.5 x 51
35.5 x 61
35.5 x 81
40
40
40
x 51
x 61
x 81
Charact.
Code
63(1J)
Cap.
(µF)
10000
12000
18000
12000
15000
22000
Ripple
current
(+85°C)
(120Hz/A)
80(1K)
Cap.
(µF)
6800
8200
10000
8200
10000
15000
Ripple
current
(+85°C)
(120Hz/A)
100(2A)
Cap.
(µF)
4700
5600
6800
5600
6800
8200
Ripple
current
(+85°C)
(120Hz/A)
160(2C)
Cap.
(µF)
1800
2200
2700
2200
2700
3300
Ripple
current
(+85°C)
(120Hz/A)
J
K
L
V
W
X
3.8
4.1
5.0
4.0
4.4
5.3
3.2
3.5
3.8
3.6
4.0
4.9
2.9
3.1
3.4
3.2
3.5
3.8
2.2
2.4
2.6
2.4
2.6
2.8
w.v.(v)
Case
size(mm)
φDxL
35.5 x 51
35.5 x 61
35.5 x 81
40
40
40
x 51
x 61
x 81
Charact.
Code
180(2P)
Cap.
(µF)
1500
1800
2200
1800
2200
2700
Ripple
current
(+85°C)
(120Hz/A)
200(2D)
Cap.
(µF)
1200
1500
1800
1500
1800
2700
Ripple
current
(+85°C)
(120Hz/A)
250(2E)
Cap.
(µF)
1000
1200
1500
1200
1500
1800
Ripple
current
(+85°C)
(120Hz/A)
315(2F)
Cap.
(µF)
680
820
1000
820
1000
1200
Ripple
current
(+85°C)
(120Hz/A)
J
K
L
V
W
X
2.1
2.3
2.5
2.3
2.5
2.7
2.0
2.2
2.4
2.2
2.4
2.6
1.8
2.0
2.2
2.0
2.2
2.4
1.4
1.6
1.8
1.6
1.8
2.0
w.v.(v)
Case
size(mm)
φDxL
35.5 x 51
35.5 x 61
35.5 x 81
40
40
40
x 51
x 61
x 81
Charact.
Code
350(2V)
Cap.
(µF)
560
680
820
680
820
1000
Ripple
current
(+85°C)
(120Hz/A)
400(2G)
Cap.
(µF)
390
470
680
560
680
820
Ripple
current
(+85°C)
(120Hz/A)
450(2W)
Cap.
(µF)
330
390
560
470
560
680
Ripple
current
(+85°C)
(120Hz/A)
J
K
L
V
W
X
1.3
1.4
1.6
1.4
1.6
1.8
1.1
1.2
1.4
1.3
1.4
1.6
1.1
1.2
1.4
1.3
1.4
1.5
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
Ñ
EE34
Ñ
Aluminum Electrolytic Capacitor
Application Guidelines
1. Circuit Design
E n s u r e t h a t operational and mounting conditions
follw the specified conditions detailed in the catalog
and specification sheets.
1.2 Operating Temperature and Life Expectancy
(1) Expected life is affected by operating temperature.
Generally, each 10°C reduction in temperature
will double the expected life. Use capacitors at
the lowest possible temperature below the
maximum guaranteed temperature.
(2) I f o p e ra t i n g c o n d i t i o n s ex c e e d t h e m a x i m u m
guaranteed limit, rapid eIectrical parameter
deterioration will occur, and irreversible damage
will result.
Check for maximum capacitor operating tempera-
tures including ambient temperature, inter nal
capacitor temperature rise caused by ripple current,
a n d t h e e f fe c t s o f r a d i a t e d h e a t f r o m p ow e r
transistors, IC?s or resistors.
Avoid placing components which could conduct
heat to the capacitor from the back side of the circuit
board.
(3)The formula for calculating expected Iife at lower
operating temperatures is as fllows;
L
2
= L
1
x 2
T
1
-
T
2
10
1.1 Operating Temperature and Frequency
E l e c t r o l y t i c c a p a c i t o r e l e c t r i c a l p a ra m e t e r s a r e
normally specified at 20°C temperature and 120Hz
frequency. These parameter s var y with changes in
t e m p e r a t u r e a n d f r e q u e n c y. C i r c u i t d e s i g n e r s
should take these changes into consideration.
(1) Effects of o p e ra t i n g t e m p e ra t u r e on electrical
parameters
a ) A t h i g h e r t e m p e ra t u r e s, l e a k a g e c u r r e n t a n d
c a p a c i t a n c e i n c r e a s e while equivalent series
resistance(ESR) decreases.
b)At l o w e r t e m p e r a t u r e s , l e a k a g e c u r r e n t a n d
c a p a c i t a n c e decrease while equivalent series
resistance(ESR) increases.
(2) Effects of fr e q u e n c y on e l e c t r i c a l p a r a m e t e r s
a)At higher frequencies, capacitance and
impedance decrease while tan
δ
increases.
b)At lower frequencies, r ipple current generated
heat will ri s e d u e t o a n increase in equivalent
series resistance (ESR).
where,
L
1
: Guaranteed life (h) at temperature, T
1
°
C
L
2
: Expected life (h) at temperature,T
2
°C
T
1
: Maximum operating temperature (°C)
T
2
: Actual operating temperature, ambient
temperature + temperature rise due to
ripple currentheating(°C)
A quick eference capacitor guide for estimating
exected life is included for your reference.
s
Expected Life Estimate Quick Reference Guide
Capacitor Ambient Temperature
120
110
100
90
80
70
60
50
40
s
Failure rate curve
2
1
3
4
1. 85°C2000h
2.105°C1000h
3.105°C2000h
4.105°C5000h
Initial failure period
Random failure period
Wear failure period
Failure rate
Life Time
24h
(h)
2000
5000
10,000
1
3
20,000
2
6
3
10
50,000 100,000 200,000
4 5
7
30
20
operat-
Years
ion
Time
8h/d
Years
15 20
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE16
–
Aluminum Electrolytic Capacitor
s
Typical failure modes and their factors
Faliure mode
Faliure mechanism (internal phenomenon)
Production factor
Application factor
Overvoltage applied
Vent operates
Increase in
internal pressure
•
Increase in inter-
•
nal temperature
•
Capacitance
reduction
•
tan
d
increase
•
Reduced cathode
foil capacitance
Reduced anode foil
capacitance
•
•
•
Excessive ripple current
•
Reverse voltage applied
•
Severe charging-discharging
AC voltage applied
•
•
Deterioration of
oxide film
Leakage current
increase
•
•
Electrolyte evapora-
tion
•
•
Short circuit
Insulation breakdown of film
or electrolytic paper
•
•
Burr(s) on foil leads
Metal particles
in capacitor
Stress applied to leads
•
•
Insufficient
electrolyte
Used for a long period of time
Defect of oxide film
•
Used for a high temperature
Leads improperly
connected
Leads improperly connected
•
Mechanical stress
Open
•
•
Use of Halogenated solvent
Corrosion
Infiltration of Cl
•
Use of adhesive
Use of coating material
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE17
–
Aluminum Electrolytic Capacitor
1.3 Common Application Conditions to Avoid
The following misapplication load conditions will
cause rapid deter ioration to capacitor electr ical
p a r a m e t e r s. l n a d d i t i o n , ra p i d h e a t i n g a n d g a s
generation within the capacitor can occur causing
the pressure relief vent to operate and resuItant
leakage of electrolyte. Under extreme conditions,
explosion and fire could result. Leakinq electrolyte
is combustible and electrically conductive.
The vinyl sleeve of the capacitor can be damaged
i f s o l d e r p a s s e s t h r o u g h a l e a d h o l e for
subsequently processed parts. Special care when
locating hole positions in proximity to capacitors is
recommended.
(3) Circuit Board Hole Spacing
The circuit board holes spacing should match the
capacitor lead wire spacing within the specified
tolerances. Incorrect spacing can cause excessive
lead wire stress during the insertion process. This
may resuIt in premature capacitor failure due to
short or open circuit, increased leakage current,
or electrolyte leakage.
(1) Reverse Voltaqe
DC capacitors have polarity. Verify correct polarity
before inser tion. For circuits with changing or
uncertain polarity,use DC bipolar capacitors. DC
bipolar capacitors are not suitable for use in AC
circuits.
(4)Land/Pad Pattern
The circuit board land/pad pattern size for chip
capacitors is specified in the following table.
(2) Charqe/Discharqe Applications
Standard capacitors are not suitable for use in
repeating charge/discharge applications. For
charqe/discharqe applications consult us and advise
actual conditions.
[ Table of Board Land Size vs. Capacitor Size ]
(3) Overvoltage
Do not appIy voltaqes exceeding the maximum
specified rated voltages. Voltage up to the surge
voltage rating are acceptable for short periods of
time. Ensure that the sum of the DC voltage and
the superimposed AC ripple vo l t a g e does not
exceed the rated voltage.
c
b
a
b
Board land part
(mm)
c
1.5
1.6
1.6
1.6
1.6
2.0
2.0
(4) Ripple Current
Do not apply ripple currents exceeding the maximum
specified value. For high ripple current applications,
use a capacitor designed for high rippIe currents
or contact us with your requirements.
Ensure that allowable ripple currents superimposed
on low DC bias voltages do not cause reverse voltage
conditions.
Size
A(φ3)
B(φ4)
C(φ5)
D(φ6.3)
E(φ8 x 6.2L)
F(φ8 x 10.2L)
G(φ10 x 10.2L)
a
0.6
1.0
1.5
1.8
2.2
3.1
4.6
b
2.2
2.5.
2.8
3.2
4.0
4.0
4.1
1.4 Using Two or More Capacitors in Series
or Parallel
(1) Capacitors Connected in Parallel
The circuit resistance can closely approximate the
ser ies resistance of the capacitor causing an
imbalance of ripple current loads w i t h in the
capacitors. Careful design of wiring methods can
minimize the possibility of excessive ripple currents
applied to a capacitor.
Among others, when the size a is wide , back fillet can
not be made, decreasing fitting strength.
h
Decide considering mounting condition, solderability
and fitting strength, etc. based on the design
standards of your company.
(2) Capacitors Connected in Series
Normal DC leakage current differences among
capacitors can cause voltage imbalances. The use
of voltage divider shunt resistors with consideration
to leakage currents, can prevent capacitor voltage
imbaIances.
1.5 Capacitor Mounting Considerations
(1) DoubIe - Sided Circuit Boards
Avoid wiring Pattern runs which pass between
the mounted capacitor and the circuit board. When
dipping into a solder bath, excess solder may collect
u n d e r t h e c a p a c i t o r by c a p i l l a r y a c t i o n a n d
shortcircuit the anode and cathode terminals.
(2) Circuit Board Hole Positioning
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE18
–
