型号
- 型号
- 关键词
| 型号 | EDI2KG46464V95D | EDI2KG46464V10D | EDI2KG46464V15D | EDI2KG46464V11D | EDI2KG46464V12D |
|---|---|---|---|---|---|
| 描述 | SRAM Module, 256KX64, 9.5ns, CMOS, | SRAM Module, 256KX64, 10ns, CMOS, | SRAM Module, 256KX64, 15ns, CMOS, | SRAM Module, 256KX64, 11ns, CMOS, | SRAM Module, 256KX64, 12ns, CMOS, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 9.5 ns | 10 ns | 15 ns | 11 ns | 12 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDMA-N120 | R-XDMA-N120 | R-XDMA-N120 | R-XDMA-N120 | R-XDMA-N120 |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bi |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 120 | 120 | 120 | 120 | 120 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX64 | 256KX64 | 256KX64 | 256KX64 | 256KX64 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装等效代码 | DIMM120 | DIMM120 | DIMM120 | DIMM120 | DIMM120 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | EDI [Electronic devices inc.] | - | - | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| 最大待机电流 | - | 0.35 A | 0.35 A | 0.35 A | 0.35 A |
| 最大压摆率 | - | 1.2 mA | 0.9 mA | 1.1 mA | 1 mA |
