型号
- 型号
- 关键词
Standard SRAM, 64KX18, 20ns, CMOS, PQCC52, PLASTIC, LCC-52
厂商名称：EDI [Electronic devices inc.]
下载文档| 型号 | EDI82997C20AC | EDI82997C17AC | EDI82997C15AC | EDI82997C12AC | EDI82997C25AC |
|---|---|---|---|---|---|
| 描述 | Standard SRAM, 64KX18, 20ns, CMOS, PQCC52, PLASTIC, LCC-52 | Standard SRAM, 64KX18, 17ns, CMOS, PQCC52, PLASTIC, LCC-52 | Standard SRAM, 64KX18, 15ns, CMOS, PQCC52, PLASTIC, LCC-52 | Standard SRAM, 64KX18, 12ns, CMOS, PQCC52, PLASTIC, LCC-52 | Standard SRAM, 64KX18, 25ns, CMOS, PQCC52, PLASTIC, LCC-52 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| 包装说明 | PLASTIC, LCC-52 | PLASTIC, LCC-52 | PLASTIC, LCC-52 | PLASTIC, LCC-52 | PLASTIC, LCC-52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 20 ns | 17 ns | 15 ns | 12 ns | 25 ns |
| 其他特性 | ADDRESS LATCH | ADDRESS LATCH | ADDRESS LATCH | ADDRESS LATCH | ADDRESS LATCH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.5707 mm | 19.5707 mm | 19.5707 mm | 19.5707 mm | 19.5707 mm |
| 内存密度 | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 52 | 52 | 52 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| 最大待机电流 | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 19.5707 mm | 19.5707 mm | 19.5707 mm | 19.5707 mm | 19.5707 mm |
单片机
WindowsCE
stm32/stm8
传感器
嵌入式系统
电源技术
