型号
- 型号
- 关键词
SRAM Module, 32KX24, 20ns, CMOS, ZIP-56
厂商名称：White Electronic Designs Corporation
厂商官网：http://www.wedc.com/
下载文档| 型号 | EDI8F2432C20MZC | EDI8F2432C25MZC | EDI8F2432C15MZC |
|---|---|---|---|
| 描述 | SRAM Module, 32KX24, 20ns, CMOS, ZIP-56 | SRAM Module, 32KX24, 25ns, CMOS, ZIP-56 | SRAM Module, 32KX24, 15ns, CMOS, ZIP-56 |
| 包装说明 | ZIP-56 | ZIP-56 | ZIP-56 |
| Reach Compliance Code | unknown | unknown | unknown |
| 最长访问时间 | 20 ns | 25 ns | 15 ns |
| JESD-30 代码 | R-XZMA-T56 | R-XZMA-T56 | R-XZMA-T56 |
| 内存密度 | 786432 bit | 786432 bit | 786432 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 24 | 24 | 24 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 56 | 56 | 56 |
| 字数 | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX24 | 32KX24 | 32KX24 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| 厂商名称 | White Electronic Designs Corporation | White Electronic Designs Corporation | - |
| Base Number Matches | - | 1 | 1 |