SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
厂商名称:White Electronic Designs Corporation
厂商官网:http://www.wedc.com/
下载文档型号 | EDI8L32256C20AI | EDI8L32256C25AI | EDI8L32256C15AC | EDI8L32256C17AC | EDI8L32256C17AI | EDI8L32256C20AC | EDI8L32256C25AC |
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描述 | SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 256KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 256KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 256KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 256KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 256KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 |
包装说明 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 20 ns | 25 ns | 15 ns | 17 ns | 17 ns | 20 ns | 25 ns |
备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
长度 | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm | 24.2316 mm |
厂商名称 | White Electronic Designs Corporation | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |