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EDS2732CABB-1AL-E

Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90

器件类别:存储    存储   

厂商名称:ELPIDA

厂商官网:http://www.elpida.com/en

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
ELPIDA
零件包装代码
BGA
包装说明
TFBGA,
针数
90
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FOUR BANK PAGE BURST
最长访问时间
6 ns
其他特性
AUTO/SELF REFRESH
JESD-30 代码
R-PBGA-B90
JESD-609代码
e1
长度
13 mm
内存密度
268435456 bit
内存集成电路类型
SYNCHRONOUS DRAM
内存宽度
32
功能数量
1
端口数量
1
端子数量
90
字数
8388608 words
字数代码
8000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
8MX32
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.14 mm
自我刷新
YES
最大供电电压 (Vsup)
2.7 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
50
宽度
8 mm
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PRELIMINARY DATA SHEET
256M bits SDRAM
EDS2732CABB (8M words
×
32 bits)
Description
The EDS2732CA is a 256M bits SDRAM organized as
2,097,152 words
×
32 bits
×
4 banks. All inputs and
outputs are synchronized with the positive edge of the
clock.
It is packaged in 90-ball FBGA.
Pin Configurations
/xxx indicate active low signal.
90-ball FBGA
1
2
3
4
5
6
7
8
9
A
DQ26 DQ24 VSS
VDD DQ23 DQ21
VDDQ VSSQ DQ19
DQ22 DQ20 VDDQ
DQ17 DQ18 VDDQ
NC
A2
A10
NC
BA0
/CAS
VDD
DQ6
DQ1
DQ16 VSSQ
DQM2 VDD
A0
BA1
/CS
A1
A11
/RAS
Features
2.5V power supply
Clock frequency: 133MHz/100MHz (max.)
Single pulsed /RAS
×32
organization
4 banks can operate simultaneously and
independently
Burst read/write operation and burst read/single write
operation capability
Programmable burst length (BL): 1, 2, 4, 8 and full
page
2 variations of burst sequence
Sequential (BL = 1, 2, 4, 8, full page)
Interleave (BL = 1, 2, 4, 8)
Programmable /CAS latency (CL): 2, 3
Byte control by DQM
Address
8K Row address /256 column address
Refresh cycles
4096 refresh cycles/64ms
2 variations of refresh
Auto refresh
Self refresh
FBGA package is lead free solder (Sn-Ag-Cu)
B
DQ28 VDDQ VSSQ
C
VSSQ DQ27 DQ25
D
VSSQ DQ29 DQ30
E
VDDQ DQ31
NC
A3
A6
A12
A9
NC
VSS
F
VSS DQM3
G
A4
A5
A8
CKE
NC
H
A7
J
CLK
K
DQM1
/WE DQM0
DQ7 VSSQ
DQ5 VDDQ
DQ3 VDDQ
L
VDDQ DQ8
M
VSSQ DQ10 DQ9
N
VSSQ DQ12 DQ14
P
DQ11 VDDQ VSSQ
VDDQ VSSQ DQ4
VDD
DQ0
DQ2
R
DQ13 DQ15 VSS
(Top view)
A0 to A12
BA0, BA1
DQ0 to DQ31
/CS
/RAS
/CAS
/WE
DQM0 to DQM3
CKE
CLK
VDD
VSS
VDDQ
VSSQ
NC
Address inputs
Bank select address
Data-input/output
Chip select
Row address strobe
Column address strobe
Write enable
DQ mask enable
Clock enable
Clock input
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
Document No. E0372E10 (Ver. 1.0)
Date Published April 2003 (K) Japan
URL: http://www.elpida.com
Elpida
Memory, Inc. 2003
EDS2732CABB
Ordering Information
Part number
EDS2732CABB-75-E
EDS2732CABB-1A-E
EDS2732CABB-75L-E
EDS2732CABB-1AL-E
Supply
voltage
2.5V
Organization
(words
×
bits) Internal Banks
8M
×
32
4
Clock frequency
MHz (max.)
133
100
100
133
100
100
/CAS latency
3
2
2, 3
3
2
2, 3
Package
90-ball FBGA
Part Number
E D S 27 32 C A BB - 75 L - E
Elpida Memory
Type
D: Monolithic Device
Environment Code
Blank: Sn-Pb Solder
E: Lead Free
Power Consumption
Blank: Normal
L: Low Power
Speed
75: 133MHz/CL3
100MHz/CL2
1A: 100MHz/CL2,CL3
Package
BB: FBGA
Product Code
S: SDRAM
Density / Bank
27: 256M/4-Bank, 8K Rows
Bit Organization
32: x32
Voltage, Interface
C: 2.5V, LVTTL
Die Rev.
Preliminary Data Sheet E0372E10 (Ver. 1.0)
2
EDS2732CABB
CONTENTS
Description.....................................................................................................................................................1
Features.........................................................................................................................................................1
Pin Configurations .........................................................................................................................................1
Ordering Information......................................................................................................................................2
Part Number ..................................................................................................................................................2
Electrical Specifications.................................................................................................................................4
Block Diagram ...............................................................................................................................................9
Pin Function.................................................................................................................................................10
Command Operation ...................................................................................................................................11
Simplified State Diagram .............................................................................................................................19
Mode Register Configuration.......................................................................................................................20
Power-up sequence.....................................................................................................................................22
Operation of the SDRAM.............................................................................................................................23
Timing Waveforms.......................................................................................................................................39
Package Drawing ........................................................................................................................................45
Recommended Soldering Conditions ..........................................................................................................46
Preliminary Data Sheet E0372E10 (Ver. 1.0)
3
EDS2732CABB
Electrical Specifications
All voltages are referenced to VSS (GND).
After power up, execute power up sequence and initialization sequence before proper device operation is achieved
(refer to the Power up sequence).
Absolute Maximum Ratings
Parameter
Voltage on any pin relative to VSS
Supply voltage relative to VSS
Short circuit output current
Power dissipation
Operating temperature
Storage temperature
Symbol
VT
VDD
IOS
PD
TA
Tstg
Rating
–0.5 to +3.6
–0.5 to +3.6
50
1.0
0 to +70
–55 to +125
Unit
V
V
mA
W
°C
°C
Note
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended DC Operating Conditions (TA = 0 to +70°C)
°
Parameter
Supply voltage
Input high voltage
Input low voltage
Symbol
VDD, VDDQ
VSS, VSSQ
VIH
VIL
min.
2.3
0
1.7
–0.3
max.
2.7
0
VDD + 0.3
0.7
Unit
V
V
V
V
Notes
1
2
3
4
Notes: 1.
2.
3.
4.
The supply voltage with all VDD and VDDQ pins must be on the same level.
The supply voltage with all VSS and VSSQ pins must be on the same level.
VIH (max.) = VDD + 1.5V (pulse width
5ns).
VIL (min.) = VSS – 1.5V (pulse width
5ns).
Preliminary Data Sheet E0372E10 (Ver. 1.0)
4
EDS2732CABB
DC Characteristics 1 (TA = 0 to +70°C, VDD, VDDQ = 2.5V ± 0.2V, VSS, VSSQ = 0V)
°
Parameter
/CAS latency
Operating current
Standby current in power down
Standby current in power down
(input signal stable)
Standby current in non power
down
Standby current in non power
down (input signal stable)
Active standby current in power
down
Active standby current in power
down (input signal stable)
Active standby current in non
power down
Active standby current in non
power down (input signal stable)
Burst operating current
Refresh current
Self refresh current
Self refresh current
(L-version)
Symbol
IDD1
IDD2P
IDD2PS
IDD2N
IDD2NS
IDD3P
IDD3PS
IDD3N
IDD3NS
IDD4
IDD5
IDD6
IDD6
-XXL
-75
-1A
-75
-1A
Grade
max.
105
3
2
20
9
4
3
50
30
155
125
265
255
3
1
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Test condition
Burst length = 1
tRC = tRC (min.)
CKE = VIL,
tCK = tCK (min.)
CKE = VIL, tCK =
CKE, /CS = VIH,
tCK = tCK (min.)
CKE = VIH, tCK =
∞,
/CS = VIH
CKE = VIL,
tCK = tCK (min.)
CKE = VIL, tCK =
CKE, /CS = VIH,
tCK = tCK (min.)
CKE = VIH, tCK =
∞,
/CS = VIH
tCK = tCK (min.),
BL = 4
tRC = tRC (min.)
VIH
VDD – 0.2V
VIL
0.2V
VIH
VDD – 0.2V
VIL
0.2V
Notes
1, 2, 3
6
7
4
8
1, 2, 6
2, 7
1, 2, 4
2, 8
1, 2, 5
3
Notes: 1. IDD depends on output load condition when the device is selected. IDD (max.) is specified at the output
open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CLK operating current.
7. After power down mode, no CLK operating current.
8. Input signals are VIH or VIL fixed.
Preliminary Data Sheet E0372E10 (Ver. 1.0)
5
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参数对比
与EDS2732CABB-1AL-E相近的元器件有:EDS2732CABB-1A-E、EDS2732CABB-75-E、EDS2732CABB-75L-E。描述及对比如下:
型号 EDS2732CABB-1AL-E EDS2732CABB-1A-E EDS2732CABB-75-E EDS2732CABB-75L-E
描述 Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90 Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90 Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, FBGA-90 Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, FBGA-90
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 ELPIDA ELPIDA ELPIDA ELPIDA
零件包装代码 BGA BGA BGA BGA
包装说明 TFBGA, TFBGA, TFBGA, TFBGA,
针数 90 90 90 90
Reach Compliance Code unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99
访问模式 FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
最长访问时间 6 ns 6 ns 5.4 ns 5.4 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 代码 R-PBGA-B90 R-PBGA-B90 R-PBGA-B90 R-PBGA-B90
JESD-609代码 e1 e1 e1 e1
长度 13 mm 13 mm 13 mm 13 mm
内存密度 268435456 bit 268435456 bit 268435456 bit 268435456 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 32 32 32 32
功能数量 1 1 1 1
端口数量 1 1 1 1
端子数量 90 90 90 90
字数 8388608 words 8388608 words 8388608 words 8388608 words
字数代码 8000000 8000000 8000000 8000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C
组织 8MX32 8MX32 8MX32 8MX32
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA TFBGA TFBGA TFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.14 mm 1.14 mm 1.14 mm 1.14 mm
自我刷新 YES YES YES YES
最大供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 50 50 50 50
宽度 8 mm 8 mm 8 mm 8 mm
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