EH2900TS-32.768M TR
EH29 00
Series
RoHS Compliant (Pb-free) 1.8V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Oscillator
Frequency Tolerance/Stability
±100ppm Maximum
Operating Temperature Range
0°C to +70°C
Duty Cycle
50 ±10(%)
RoHS
Pb
Packaging Options
Tape & Reel
TS -32.768M TR
Nominal Frequency
32.768MHz
Pin 1 Connection
Tri-State (High Impedance)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
32.768MHz
±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°,
260°C Reflow, Shock, and Vibration)
±5ppm/Year Maximum
0°C to +70°C
1.8Vdc ±5%
4mA Maximum (No Load)
90% of Vdd Minimum (IOH = -8mA)
10% of Vdd Maximum (IOL = +8mA)
6nSec Maximum (Measured at 20% to 80% of waveform)
50 ±10(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Tri-State (High Impedance)
90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High
Impedance)
10µA Maximum (Pin 1 = Ground)
±100pSec Maximum
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Pin 1 Connection
Tri-State Input Voltage (Vih and Vil)
Standby Current
Absolute Clock Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/13/2010 | Page 1 of 6
EH2900TS-32.768M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Tri-State
Case Ground
Output
Supply Voltage
7.00
±0.15
3
5.00
±0.15
MARKING
ORIENTATION
2
1.4 ±0.1
5.08
±0.15
4
2.60
±0.15
1
1.2 ±0.2
3.68
±0.15
1
2
3
4
LINE MARKING
1
2
3
ECLIPTEK
32.768M
XXXXXX
XXXXXX=Ecliptek
Manufacturing Identifier
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/13/2010 | Page 2 of 6
EH2900TS-32.768M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/13/2010 | Page 3 of 6
EH2900TS-32.768M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 +0.1/-0.0
0.3 ±0.05
7.5 ±0.1
16.0
+0.3/-0.1
6.75 ±0.1
A0*
8.0 ±0.1
*Compliant to EIA 481A
B0*
K0*
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
22.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
16.4 +2.0/-0.0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/13/2010 | Page 4 of 6
EH2900TS-32.768M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/13/2010 | Page 5 of 6
