EL15D8D2F-311.040M
Series
RoHS Compliant (Pb-free) 6 Pad 5mm x 7mm Ceramic
SMD 2.5Vdc LVDS Oscillator
Frequency Tolerance/Stability
±50ppm Maximum over 0°C to +70°C
Duty Cycle
50 ±5(%)
RoHS
Pb
EL15D8 D 2 F -311.040M
Nominal Frequency
311.040MHz
Logic Control / Additional Output
Tri-State (High Impedance) and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
311.040MHz
±50ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency
Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year
Aging at 25°C, Shock, and Vibration)
2.5Vdc ±5%
85mA Maximum (with Load)
1.45Vdc Typical, 1.6Vdc Maximum
1.1Vdc Typical, 0.9Vdc Minimum
-50mV Minimum, +50mV Maximum
247mV Minimum, 350mV Typical, 454mV Maximum
1.125Vdc Minimum, 1.250Vdc Typical, 1.375Vdc Maximum
300pSec Typical, 600pSec Maximum (Measured over 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
-150mV Minimum, +150mV Maximum
100 Ohms (Between Output and Complementary Output)
LVDS
-60dBc/Hz at 10Hz offset, -90dBc/Hz at 100Hz offset, -115dBc/Hz at 1kHz offset, -129dBc/Hz at 10kHz
offset, -130dBc/Hz at 100kHz offset, -131dBc/Hz at 1MHz offset, -148dBc/Hz at 10MHz offset (Typical
Values, Fo = 156.250MHz)
Tri-State (High Impedance) and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output, Vil of 30% of Vcc to Disable Output (High
Impedance)
600µA Maximum (Disabled Output, High Impedance, without Load)
0.7pSec Typical, 1pSec Maximum (Fj = 12kHz to 20MHz)
10mSec Maximum
-55°C to +125°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Vod Magnitude Change (dVod)
Differential Output Voltage (Vod)
Offset Voltage (Vos)
Rise/Fall Time
Duty Cycle
Vos Magnitude Change (dVos)
Load Drive Capability
Output Logic Type
Phase Noise
Logic Control / Additional Output
Tri-State Input Voltage (Vih and Vil)
Standby Current
RMS Phase Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 1 of 5
EL15D8D2F-311.040M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
3
4
5
6
CONNECTION
Tri-State
No Connect
Case/Ground
Output
Complementary Output
Supply Voltage
2.00
MAX
5.00
±0.15
2.54
TYP
5.08
±0.15
6
5
4
1
2
3
MARKINING
ORIENTATION
2.60 ±0.15
1.2 ±0.2
7.00
±0.15
LINE MARKING
1
2
3
ECLIPTEK
311.04M
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
1.4
±0.1
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.80 (X6)
2.00 (X6)
0.54 (X4)
2.39 (X3)
All Tolerances are ±0.1
Solder Land
(X6)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 2 of 5
EL15D8D2F-311.040M
Test Circuit for Tri-State and Complementary Output
Oscilloscope
Frequency
Counter
Current
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe 2
(Note 2)
Probe 1
(Note 2)
100 Ohms
Complementary
Output
Output
Switch
0.1µF
(Note 1)
Ground
Power
Supply
Voltage
Meter
Power
Supply
Tri-State
No
Connect
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 3 of 5
EL15D8D2F-311.040M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 4 of 5
EL15D8D2F-311.040M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 5 of 5
RF/无线
